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Immersion Silver On Pads Microwave PCB,
Microwave PCB On TC600,
Microwave PCB With Solder Mask
Today, we will be discussing the TC600 microwave PCB, which is a type of enhanced thermal conductivity printed circuit board.
Rogers TC600 laminate is a woven fiberglass reinforced, ceramic-filled, PTFE-based composite designed to provide enhanced heat transfer through high thermal conductivity, while reducing dielectric and insertion losses. The increased thermal conductivity offers several advantages, including higher power handling, improved device reliability, and reduced hot spots.
Let's take a closer look at the properties of TC600 material, including its electrical, thermal, mechanical, and physical characteristics.
TC600 Typical Properties:
1. Dielectric Constant: The dielectric constant of TC600 is 6.15 at 1.8 MHz using the resonant cavity method. It is also 6.15 at 10 GHz according to IPC TM-650 testing.
2. Dissipation Factor: The dissipation factor is 0.0017 at 1.8 GHz and 0.002 at 10 GHz, as per IPC TM-650 testing.
3. Temperature Coefficient of Dielectric Constant (TCDk): The TCDk is 75 ppm/ºC, indicating that the dielectric constant of TC600 remains stable over a wide temperature range.
|1. Electrical Properties|
|Dielectric Constant (may vary by thickness)|
|@1.8 MHz||-||6.15||Resonant Cavity|
|@10 GHz||-||6.15||IPC TM-650 184.108.40.206|
|@1.8 GHz||-||0.0017||Resonant Cavity|
|@10 GHz||-||0.002||IPC TM-650 220.127.116.11|
|Temperature Coefficient of Dielectric Constant: TCεr @ 10 GHz (-40-150°C)||ppm/ºC||-75||IPC TM-650 18.104.22.168|
|C96/35/90||MΩ-cm||1.6x109||IPC TM-650 22.214.171.124|
|E24/125||MΩ-cm||2.4x108||IPC TM-650 126.96.36.199|
|C96/35/90||MΩ||3.1x109||IPC TM-650 188.8.131.52|
|E24/125||MΩ||9.0x108||IPC TM-650 184.108.40.206|
|Electrical Strength||Volts/mil (kV/mm)||850 (34)||IPC TM-650 220.127.116.11|
|Dielectric Breakdown||kV||62||IPC TM-650 2.5.6|
|Arc Resistance||sec||>240||IPC TM-650 2.5.1|
|2. Thermal Properties|
|Decomposition Temperature (Td)|
|Initial||°C||512||IPC TM-650 18.104.22.168|
|5%||°C||572||IPC TM-650 22.214.171.124|
|T260||min||>60||IPC TM-650 126.96.36.199|
|T288||min||>60||IPC TM-650 188.8.131.52|
|T300||min||>60||IPC TM-650 184.108.40.206|
|Thermal Expansion, CTE (x,y) 50-150ºC||ppm/ºC||9, 9||IPC TM-650 2.4.41|
|Thermal Expansion, CTE (z) 50-150ºC||ppm/ºC||35||IPC TM-650 2.4.24|
|% z-axis Expansion (50-260ºC)||%||1.5||IPC TM-650 2.4.24|
|3. Mechanical Properties|
|Peel Strength to Copper (1 oz/35 micron)|
|After Thermal Stress||lb/in (N/mm)||10 (1.8)||IPC TM-650 2.4.8|
|At Elevated Temperatures (150ºC)||lb/in (N/mm)||10 (1.8)||IPC TM-650 220.127.116.11|
|After Process Solutions||lb/in (N/mm)||9 (1.6)||IPC TM-650 2.4.8|
|Young’s Modulus||kpsi (MPa)||280 (1930)||IPC TM-650 18.104.22.168|
|Flexural Strength (Machine/Cross)||kpsi (MPa)||9.60/9.30 (66/64)||IPC TM-650 2.4.4|
|Tensile Strength (Machine/Cross)||kpsi (MPa)||5.0/4.30 (34/30)||IPC TM-650 22.214.171.124|
|Compressive Modulus||kpsi (MPa)||ASTM D-3410|
|Poisson’s Ratio||-||ASTM D-3039|
|4. Physical Properties|
|Water Absorption||%||0.02||IPC TM-650 126.96.36.199|
|Density, ambient 23ºC||g/cm3||2.9||ASTM D792 Method A|
|Thermal Conductivity (z-axis)||W/mK||1.1||ASTM E1461|
|Thermal Conductivity (x, y)||W/mK||1.4||ASTM E1461|
|Specific Heat||J/gK||0.94||ASTM E1461|
|NASA Outgassing, 125ºC, ≤10-6 torr|
|Total Mass Loss||%||0.02||NASA SP-R-0022A|
|Collected Volatiles||%||0||NASA SP-R-0022A|
|Water Vapor Recovered||%||0||NASA SP-R-0022A|
4. Electrical Properties: TC600 exhibits good volume resistivity and surface resistivity, with an electrical strength of 850 Volts/mil or 34 Kv/mm. The dielectric breakdown is 62 kilovolts, and the arc resistance is greater than 240 seconds.
5. Thermal Properties: TC600 has a decomposition temperature greater than 512 °C. The T260, T288, and T300 values are all greater than 60 minutes, indicating excellent thermal stability. It also has a low Z-Direction coefficient of thermal expansion (CTE), providing reliable plated through hole performance.
6. Mechanical Properties: TC600 demonstrates a peel strength of 10 lb/in, a Young's modulus of 280 kpsi, a flexural strength of 9.6 kpsi, and a tensile strength of 5.0 kpsi.
7. Physical Properties: TC600 has extremely low water absorption of 0.02%, a density of 2.9 g/cm³, and a high thermal conductivity of 1.1 W/mK in the Z direction. It has a specific heat capacity of 0.94 J/gK and a flammability rating of 94V0.
8. Outgassing: TC600 exhibits a total mass loss of as low as 0.02%, indicating excellent outgassing properties.
PCB Capability (TC600):
We offer various layer counts, including single-sided, double-sided, multilayer, and hybrid PCBs. The dielectric thickness options include 10mil (0.254mm), 20mil (0.508mm), 30mil (0.762mm), and 60mil (1.524mm) to cater to different design requirements.
Our PCBs are available with copper weights of 1oz (35µm) and 2oz (70µm), providing flexibility for specific applications.
The maximum size for our PCBs is ≤400mm X 500mm, accommodating a wide range of applications.
We offer a variety of solder mask colors, including green, black, blue, yellow, red, and more.
Additionally, our surface finish options include immersion gold, hot air solder level (HASL), immersion silver, immersion tin, bare copper, OSP, pure gold plated, and others, allowing for various choices for the final finish of the PCB.
|PCB Material:||Ceramic Filled PTFE/Woven Fiberglass|
|Dielectric constant:||6.15 (10 GHz)|
|Dissipation factor:||0.002 (10 GHz)|
|Layer count:||Single sided, Double Sided, Multilayer PCB, Hybrid PCB|
|Dielectric thickness:||10mil (0.254mm), 20mil (0.508mm), 30mil (0.762mm),60mil (1.524mm)|
|Copper weight:||1oz (35µm), 2oz (70µm)|
|PCB size:||≤400mm X 500mm|
|Solder mask:||Green, Black, Blue, Yellow, Red etc.|
|Surface finish:||Immersion gold, Hot air soldering level (HASL), Immersion silver, Immersion tin, Bare copper, OSP, Pure gold plated etc..|
TC600 printed circuit boards (PCBs) are designed to deliver improved thermal management, making them ideal for high-power RF signal applications.
With high thermal conductivity, low loss tangent, low coefficient of thermal expansion (CTE), and temperature phase stability, TC600 boards offer enhanced performance and reliability in high-power applications.
They are suitable for power amplifiers, couplers, filters, small footprint antennas, digital audio broadcasting (DAB) antennas, GPS, and handheld RFID reader antennas, among others.
Thank you. We hope this information was helpful, and we look forward to seeing you again next time.
Contact Person: Ms. Ivy Deng