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Microwave PCB On TC600 With Blue Solder Mask And Immersion Silver On Pads

China Bicheng Electronics Technology Co., Ltd certification
China Bicheng Electronics Technology Co., Ltd certification
Kevin, Received and tested the boards - thanks very much. These are perfect, exactly what we needed. rgds Rich

—— Rich Rickett

Ruth, I got the PCB today, and they are just perfect. Please stay a little patience, my next order is coming soon. Kind regards from Hamburg Olaf

—— Olaf Kühnhold

Hi Natalie. It was perfect, I attach some pictures for your reference. And I send you next 2 projects to budget. Thanks a lot again

—— Sebastian Toplisek

Kevin, Thanks, they were perfectly made, and work well. As promised, here are the links for my latest project, using the PCBs you manufactured for me: Regards, Daniel

—— Daniel Ford

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Microwave PCB On TC600 With Blue Solder Mask And Immersion Silver On Pads

Microwave PCB On TC600 With Blue Solder Mask And Immersion Silver On Pads
Microwave PCB On TC600 With Blue Solder Mask And Immersion Silver On Pads

Large Image :  Microwave PCB On TC600 With Blue Solder Mask And Immersion Silver On Pads

Product Details:
Place of Origin: CHINA
Brand Name: Bicheng
Certification: UL, ISO9001, IATF16949
Payment & Shipping Terms:
Minimum Order Quantity: 1PCS
Price: USD 9.99-99.99/PCS
Packaging Details: Vacuum bags+Cartons
Delivery Time: 8-9 working days
Payment Terms: T/T
Supply Ability: 5000PCS per month
Detailed Product Description
High Light:

Immersion Silver On Pads Microwave PCB

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Microwave PCB On TC600

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Microwave PCB With Solder Mask

Today, we will be discussing the TC600 microwave PCB, which is a type of enhanced thermal conductivity printed circuit board.

 

Rogers TC600 laminate is a woven fiberglass reinforced, ceramic-filled, PTFE-based composite designed to provide enhanced heat transfer through high thermal conductivity, while reducing dielectric and insertion losses. The increased thermal conductivity offers several advantages, including higher power handling, improved device reliability, and reduced hot spots.

 

Let's take a closer look at the properties of TC600 material, including its electrical, thermal, mechanical, and physical characteristics.

 

TC600 Typical Properties:

1. Dielectric Constant: The dielectric constant of TC600 is 6.15 at 1.8 MHz using the resonant cavity method. It is also 6.15 at 10 GHz according to IPC TM-650 testing.

 

2. Dissipation Factor: The dissipation factor is 0.0017 at 1.8 GHz and 0.002 at 10 GHz, as per IPC TM-650 testing.

 

3. Temperature Coefficient of Dielectric Constant (TCDk): The TCDk is 75 ppm/ºC, indicating that the dielectric constant of TC600 remains stable over a wide temperature range.

 

Property Unit Value Test Method
1. Electrical Properties
Dielectric Constant (may vary by thickness)      
@1.8 MHz - 6.15 Resonant Cavity
@10 GHz - 6.15 IPC TM-650 2.5.5.5
Dissipation Factor      
@1.8 GHz - 0.0017 Resonant Cavity
@10 GHz - 0.002 IPC TM-650 2.5.5.5
Temperature Coefficient of Dielectric Constant: TCεr @ 10 GHz (-40-150°C) ppm/ºC -75 IPC TM-650 2.5.5.5
Volume Resistivity      
C96/35/90 MΩ-cm 1.6x109 IPC TM-650 2.5.17.1
E24/125 MΩ-cm 2.4x108 IPC TM-650 2.5.17.1
Surface Resistivity      
C96/35/90 3.1x109 IPC TM-650 2.5.17.1
E24/125 9.0x108 IPC TM-650 2.5.17.1
Electrical Strength Volts/mil (kV/mm) 850 (34) IPC TM-650 2.5.6.2
Dielectric Breakdown kV 62 IPC TM-650 2.5.6
Arc Resistance sec >240 IPC TM-650 2.5.1
2. Thermal Properties
Decomposition Temperature (Td)      
Initial °C 512 IPC TM-650 2.4.24.6
5% °C 572 IPC TM-650 2.4.24.6
T260 min >60 IPC TM-650 2.4.24.1
T288 min >60 IPC TM-650 2.4.24.1
T300 min >60 IPC TM-650 2.4.24.1
Thermal Expansion, CTE (x,y) 50-150ºC ppm/ºC 9, 9 IPC TM-650 2.4.41
Thermal Expansion, CTE (z) 50-150ºC ppm/ºC 35 IPC TM-650 2.4.24
% z-axis Expansion (50-260ºC) % 1.5 IPC TM-650 2.4.24
3. Mechanical Properties
Peel Strength to Copper (1 oz/35 micron)      
After Thermal Stress lb/in (N/mm) 10 (1.8) IPC TM-650 2.4.8
At Elevated Temperatures (150ºC) lb/in (N/mm) 10 (1.8) IPC TM-650 2.4.8.2
After Process Solutions lb/in (N/mm) 9 (1.6) IPC TM-650 2.4.8
Young’s Modulus kpsi (MPa) 280 (1930) IPC TM-650 2.4.18.3
Flexural Strength (Machine/Cross) kpsi (MPa) 9.60/9.30 (66/64) IPC TM-650 2.4.4
Tensile Strength (Machine/Cross) kpsi (MPa) 5.0/4.30 (34/30) IPC TM-650 2.4.18.3
Compressive Modulus kpsi (MPa)   ASTM D-3410
Poisson’s Ratio -   ASTM D-3039
4. Physical Properties
Water Absorption % 0.02 IPC TM-650 2.6.2.1
Density, ambient 23ºC g/cm3 2.9 ASTM D792 Method A
Thermal Conductivity (z-axis) W/mK 1.1 ASTM E1461
Thermal Conductivity (x, y) W/mK 1.4 ASTM E1461
Specific Heat J/gK 0.94 ASTM E1461
Flammability class V0 UL-94
NASA Outgassing, 125ºC, ≤10-6 torr      
Total Mass Loss % 0.02 NASA SP-R-0022A
Collected Volatiles % 0 NASA SP-R-0022A
Water Vapor Recovered % 0 NASA SP-R-0022A

 

4. Electrical Properties: TC600 exhibits good volume resistivity and surface resistivity, with an electrical strength of 850 Volts/mil or 34 Kv/mm. The dielectric breakdown is 62 kilovolts, and the arc resistance is greater than 240 seconds.

 

5. Thermal Properties: TC600 has a decomposition temperature greater than 512 °C. The T260, T288, and T300 values are all greater than 60 minutes, indicating excellent thermal stability. It also has a low Z-Direction coefficient of thermal expansion (CTE), providing reliable plated through hole performance.

 

6. Mechanical Properties: TC600 demonstrates a peel strength of 10 lb/in, a Young's modulus of 280 kpsi, a flexural strength of 9.6 kpsi, and a tensile strength of 5.0 kpsi.

 

7. Physical Properties: TC600 has extremely low water absorption of 0.02%, a density of 2.9 g/cm³, and a high thermal conductivity of 1.1 W/mK in the Z direction. It has a specific heat capacity of 0.94 J/gK and a flammability rating of 94V0.

 

8. Outgassing: TC600 exhibits a total mass loss of as low as 0.02%, indicating excellent outgassing properties.

 

PCB Capability (TC600):

We offer various layer counts, including single-sided, double-sided, multilayer, and hybrid PCBs. The dielectric thickness options include 10mil (0.254mm), 20mil (0.508mm), 30mil (0.762mm), and 60mil (1.524mm) to cater to different design requirements.

 

Our PCBs are available with copper weights of 1oz (35µm) and 2oz (70µm), providing flexibility for specific applications.

 

The maximum size for our PCBs is ≤400mm X 500mm, accommodating a wide range of applications.

 

We offer a variety of solder mask colors, including green, black, blue, yellow, red, and more.

 

Additionally, our surface finish options include immersion gold, hot air solder level (HASL), immersion silver, immersion tin, bare copper, OSP, pure gold plated, and others, allowing for various choices for the final finish of the PCB.

 

PCB Material: Ceramic Filled PTFE/Woven Fiberglass
Designation: TC600
Dielectric constant: 6.15 (10 GHz)
Dissipation factor: 0.002 (10 GHz)
Layer count: Single sided, Double Sided, Multilayer PCB, Hybrid PCB
Dielectric thickness: 10mil (0.254mm), 20mil (0.508mm), 30mil (0.762mm),60mil (1.524mm)
Copper weight: 1oz (35µm), 2oz (70µm)
PCB size: ≤400mm X 500mm
Solder mask: Green, Black, Blue, Yellow, Red etc.
Surface finish: Immersion gold, Hot air soldering level (HASL), Immersion silver, Immersion tin, Bare copper, OSP, Pure gold plated etc..


Conclusion:

TC600 printed circuit boards (PCBs) are designed to deliver improved thermal management, making them ideal for high-power RF signal applications.

 

With high thermal conductivity, low loss tangent, low coefficient of thermal expansion (CTE), and temperature phase stability, TC600 boards offer enhanced performance and reliability in high-power applications.

 

They are suitable for power amplifiers, couplers, filters, small footprint antennas, digital audio broadcasting (DAB) antennas, GPS, and handheld RFID reader antennas, among others.

 

Thank you. We hope this information was helpful, and we look forward to seeing you again next time.

 

Microwave PCB On TC600 With Blue Solder Mask And Immersion Silver On Pads 0

Contact Details
Bicheng Electronics Technology Co., Ltd

Contact Person: Ms. Ivy Deng

Tel: 86-755-27374946

Fax: 86-755-27374848

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