RO3010 2 Layer 2.7mm RF PCB With Hot Air Soldering Level

Introducing our newly shipped 2-layer rigid PCB, which is supplied to meet the demanding requirements of high-frequency applications. Crafted with exceptional precision and utilizing Rogers RO3010 ceramic-filled PTFE composites, this PCB offers unrivaled performance and reliability.

The PCB material boasts remarkable characteristics, including a dielectric constant of 10.2+/- .30 at 10 GHz/23°C, ensuring precise signal transmission. With a dissipation factor of 0.0022 at 10 GHz/23°C, it minimizes signal loss, guaranteeing optimal performance. Operating seamlessly in temperatures ranging from -40℃ to +85℃, it is suitable for various environments.

One of the key features of this PCB lies in its low X, Y, and Z axis CTE (Coefficient of Thermal Expansion) of 13, 11, and 16 ppm/°C, respectively. This ensures excellent dimensional stability, with the expansion coefficient perfectly matched to copper, preventing any warping or distortion.

Additionally, being ISO 9001 Certified, this PCB adheres to the highest quality standards.

The stackup consists of two layers, with a 35 μm copper layer on both sides. The Rogers RO3010 substrates, each measuring 50mil (1.27mm), provide exceptional insulation and signal integrity. The board's construction details include a finished thickness of 2.7mm, a minimum trace/space of 5/5 mils, and a minimum hole size of 0.45mm. The via plating thickness is 20 μm, ensuring robust connections.

For added convenience, this PCB comes with a Hot Air Soldering Level (HASL) surface finish, ensuring excellent solderability and corrosion resistance. While it does not feature top or bottom silkscreen or solder mask, it offers a clean and straightforward design.

With 18 components and a total of 72 pads, including 43 thru-hole pads and 29 top SMT pads, this PCB provides ample room for your circuitry needs. It also features two vias and two nets, offering versatility in routing.

It meets IPC-Class-2 standards, this PCB undergoes a 100% electrical test prior to shipment, ensuring its functionality and reliability. Its compatibility with Gerber RS-274-X artwork allows for seamless integration into your manufacturing process.

This high-performance PCB finds its applications in various industries. From automotive radar and GPS antennas to cellular telecommunications systems and wireless communications devices, it excels in power amplifiers, antennas, data links, and more.

We offer worldwide availability, ensuring prompt delivery to meet your project timelines. For any technical inquiries or further information, please contact Ivy at sales10@bichengpcb.com. Trust our expertise to deliver the highest quality PCBs for your cutting-edge applications.

Unleashing the Power of RO3010: A Breakthrough in PCB Technology

Introduction:
Revolutionary advancements in the field of printed circuit boards (PCBs) have paved the way for enhanced performance and reliability in a wide range of electronic applications. Among the cutting-edge PCB materials, RO3010 stands out as a game-changer. With its exceptional properties and unmatched capabilities, RO3010 is poised to revolutionize the industry. In this article, we will delve into the remarkable features of RO3010 and explore its potential applications.

Understanding Dielectric Constant and Design:
The dielectric constant is a crucial parameter that determines the insulation properties of a material. RO3010 boasts an impressive dielectric constant of 10.2±0.05 (at 10 GHz/23℃), ensuring efficient signal transmission and minimal signal loss. Moreover, its design dielectric constant of 11.2 (from 8 GHz to 40 GHz) makes it ideal for high-frequency applications, enabling seamless data transfer and optimal performance.

Unveiling Dissipation Factor and Thermal Coefficient:
The dissipation factor, or tanδ, of RO3010 is an astonishingly low 0.0022 (at 10 GHz/23℃), signifying minimal energy loss during signal propagation. Additionally, the material exhibits a negative thermal coefficient of ε (-395 ppm/℃ at 10 GHz, -50℃ to 150℃), ensuring its stability across a wide temperature range. This makes RO3010 a reliable choice for demanding environments.

Dimensional Stability and Electrical Performance:
RO3010 boasts exceptional dimensional stability, with a maximum variation of 0.35 mm/m (in X-direction) and 0.31 mm/m (in Y-direction) under COND A conditions. This ensures precise and consistent PCB fabrication, enabling accurate component placement and reliable circuit performance. The material also exhibits high volume resistivity (105 MΩ.cm) and surface resistivity (105 MΩ), ensuring excellent electrical insulation properties.

Unmatched Strength and Moisture Resistance:
With a tensile modulus of 1902 MPa (in X-direction) and 1934 MPa (in Y-direction) at 23℃, RO3010 offers exceptional mechanical strength, ensuring durability and reliability in demanding applications. Moreover, its low moisture absorption rate of 0.05% ensures long-term stability and reliable performance even in high-humidity environments.

Superior Thermal Management:
RO3010 excels in thermal management, thanks to its impressive thermal conductivity of 0.95 W/M/K at 50℃. This property allows for efficient heat dissipation, preventing overheating and ensuring optimal performance in high-power applications. Additionally, its coefficient of thermal expansion (13 ppm/℃ in X-direction, 11 ppm/℃ in Y-direction, and 16 ppm/℃ in Z-direction) further enhances its thermal stability across a wide temperature range.

Unwavering Reliability and Compatibility:
RO3010 has been rigorously tested and certified for its exceptional performance and reliability. With a Td (decomposition temperature) of 500℃ and a V-0 flammability rating according to UL 94, it ensures safety and compliance with industry standards. Furthermore, RO3010 is lead-free process compatible, making it environmentally friendly and compatible with modern manufacturing processes.

Conclusion:
RO3010 has emerged as a game-changer in the world of PCB technology. Its exceptional dielectric properties, dimensional stability, strength, thermal management capabilities, and reliability make it an ideal choice for high-frequency and high-performance applications.