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Product Details:
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Experience superior performance and reliability with the Rogers RO4730G3 Hydrocarbon/Ceramic/Woven Glass Antenna Grade PCB. Designed to meet the demanding requirements of modern electronic applications, this 2-layer rigid PCB offers exceptional electrical properties and exceptional thermal stability.
The PCB material, Rogers RO4730G3, is a high-quality laminate known for its outstanding performance. It features a low dielectric constant of DK 3.0 at 10 GHz and 23°C, ensuring efficient signal transmission and reduced signal loss. With a dissipation factor of 0.0028 at 10 GHz and 23°C, this PCB ensures minimal energy loss during operation.
Engineered to withstand extreme temperatures, the RO4730G3 PCB has a glass transition temperature (Tg) greater than 280°C and a decomposition temperature (Td) of 411°C, making it suitable for a wide range of environments. Its operating temperature range of -40°C to +85°C ensures reliable performance even in challenging conditions.
The construction details of this PCB are carefully crafted to meet your specific needs. With a board thickness of 0.63mm and copper layers of 35μm, this PCB provides excellent durability and conductivity. The minimum trace/space of 6/4 mils allows for precise routing and exceptional signal integrity. Each via is plated with a thickness of 20μm, ensuring reliable connectivity and maximum durability.
To guarantee the highest quality, each board undergoes a 100% electrical test prior to shipment, ensuring that all components and connections meet the required specifications. The PCB adheres to the IPC-Class-2 standard, guaranteeing consistent and reliable performance.
With a worldwide availability, you can easily procure the Rogers RO4730G3 PCB for your projects. For any technical inquiries or further information, please contact Ivy at sales10@bichengpcb.com.
Choose the Rogers RO4730G3 Hydrocarbon/Ceramic/Woven Glass Antenna Grade PCB for exceptional performance, reliability, and global compatibility in your electronic applications.
| Dielectric Constant,εProcess | 3.0±0.5 | Z | 10 GHz 23℃ | IPC-TM-650 2.5.5.5 | |
| Dielectric Constant,εDesign | 2.98 | Z | 1.7 GHz to 5 GHz | Differential Phase Length Method | |
| Dissipation Factor,tanδ | 0.0028 | Z | 10 GHz 23℃ | IPC-TM-650 2.5.5.5 | |
| 2.5 GHz | |||||
| Thermal Coefficient of ε | +34 | Z | ppm/℃ | -50 ℃to 150℃ | IPC-TM-650 2.5.5.5 |
| Dimensional Stability | <0.4 | X, Y | mm/m | after etech +E2/150 ℃ | IPC-TM-650 2.4.39A |
| Volume Resistivity (0.030") | 9 X 107 | MΩ.cm | COND A | IPC-TM-650 2.5.17.1 | |
| Surface Resistivity (0.030") | 7.2 X 105 | MΩ | COND A | IPC-TM-650 2.5.17.1 | |
| PIM | -165 | dBc | 50 ohm 0.060" | 43 dBm 1900 MHz | |
| Electrical Strength (0.030") | 730 | Z | V/mil | IPC-TM-650 2.5.6.2 | |
| Flexural Strength MD | 181 (26.3) | Mpa (kpsi) | RT | ASTM D790 | |
| CMD | 139 (20.2) | ||||
| Moisure Absorption | 0.093 | - | % | 48/50 | IPC-TM-650 2.6.2.1 ASTM D570 |
| Thermal Conductivity | 0.45 | Z | W/mK | 50℃ | ASTM D5470 |
| Coefficient of Thermal Expansion | 15.9 14.4 35.2 |
X Y Z |
ppm/℃ | -50 ℃to 288℃ | IPC-TM-650 2.4.4.1 |
| Tg | >280 | ℃ | IPC-TM-650 2.4.24 | ||
| Td | 411 | ℃ | ASTM D3850 | ||
| Density | 1.58 | gm/cm3 | ASTM D792 | ||
| Copper Peel Stength | 4.1 | pli | 1oz,LoPro EDC | IPC-TM-650 2.4.8 | |
| Flammability | V-0 | UL 94 | |||
| Lead-free Process Compatible | Yes |
Advantages of using RO4730G3 PCB
RO4730G3 PCB offers several advantages that make it a preferred choice for various applications. Here are some key advantages of RO4730G3 PCB:
1. High Thermal Performance: RO4730G3 PCB exhibits excellent thermal conductivity, allowing for efficient heat dissipation. This makes it suitable for applications that require effective thermal management, such as power electronics, RF amplifiers, and high-frequency circuits.
2. Low Loss and High Frequency Operation: RO4730G3 PCB has a low dielectric loss, resulting in minimal signal attenuation and high signal integrity. It offers reliable performance at high frequencies, making it ideal for applications involving wireless communication, radar systems, microwave circuits, and high-speed digital designs.
3. Stable Electrical Properties: The dielectric constant (DK) and dissipation factor (DF) of RO4730G3 PCB remain consistent over a wide range of frequencies and temperatures. This stability ensures predictable electrical performance and optimal signal integrity in demanding applications.
4. Excellent Dimensional Stability: RO4730G3 PCB demonstrates exceptional dimensional stability, even under varying environmental conditions. It maintains its form and shape, minimizing the risk of warping or distortion during fabrication or in-field operation.
5. Low Moisture Absorption: The RO4730G3 material has low moisture absorption characteristics, reducing the risk of any electrical performance degradation due to moisture ingress. This property contributes to the reliability and longevity of the PCB in humid or moisture-prone environments.
6. Compatibility with Lead-Free Assembly: RO4730G3 PCB is compatible with lead-free assembly processes, ensuring compliance with environmental regulations and industry standards. It enables the use of RoHS-compliant components and manufacturing practices.
7. Mechanical Strength: The RO4730G3 material offers good mechanical strength and rigidity, providing stability and resistance to bending or flexing. This makes it suitable for applications where the PCB may undergo mechanical stress or require structural support.
It's important to note that while RO4730G3 offers numerous advantages, the selection of the appropriate PCB material depends on the specific requirements and constraints of the application.
Contact Person: Ms. Ivy Deng
Tel: 86-755-27374946
Fax: 86-755-27374848
