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Rogers AD250 1.524mm 2 Layer Rigid PCB No Solder Mask

China Bicheng Electronics Technology Co., Ltd certification
China Bicheng Electronics Technology Co., Ltd certification
Kevin, Received and tested the boards - thanks very much. These are perfect, exactly what we needed. rgds Rich

—— Rich Rickett

Ruth, I got the PCB today, and they are just perfect. Please stay a little patience, my next order is coming soon. Kind regards from Hamburg Olaf

—— Olaf Kühnhold

Hi Natalie. It was perfect, I attach some pictures for your reference. And I send you next 2 projects to budget. Thanks a lot again

—— Sebastian Toplisek

Kevin, Thanks, they were perfectly made, and work well. As promised, here are the links for my latest project, using the PCBs you manufactured for me: Regards, Daniel

—— Daniel Ford

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Rogers AD250 1.524mm 2 Layer Rigid PCB No Solder Mask

Detailed Product Description
High Light:

2 Layer PCB No Solder Mask


2 Layer Rigid PCB


Rogers AD250 Rigid PCB

Experience exceptional performance and reliability with our newly shipped 2-layer rigid PCB, featuring the cutting-edge Rogers AD250 PTFE and Ceramic Filled Composite material. Engineered to meet the highest standards, this PCB offers superior electrical properties and temperature resistance, making it an ideal choice for a wide range of applications.


Key Features:


PCB Material:

Rogers AD250 PTFE and Ceramic Filled Composite with a dielectric constant of 2.5 at 10 GHz/23°C.
Extremely low dissipation factor of 0.0014 at 10 GHz/23°C.
Exceptional thermal stability with a Td greater than 500°C.
Reliable operation in temperatures ranging from -40℃ to +85℃.


2-layer rigid PCB design for efficient signal transmission.
Copper layer 1 with a thickness of 35 μm.
Rogers AD250 substrate with a thickness of 1.524 mm.
Copper layer 2 with a thickness of 35 μm.


Construction Details:
Board dimensions: 124.05mm x 60.61 mm, available in 5PCS and 3 types.
Minimum Trace/Space: 4.5/5 mils for precise circuitry.
Minimum Hole Size: 0.35mm for versatile component integration.
No Blind vias for simplified assembly.
Finished board thickness of 1.6mm for durability.
Outer layers with 1 oz (1.4 mils) finished Cu weight.
Via plating thickness of 20 μm for reliable connections.
Immersion tin surface finish for enhanced solderability.
Green top solder mask for added protection.
No bottom solder mask for flexibility.
100% Electrical test conducted prior to shipment for optimal performance.


PCB Statistics:
Components: 106 for comprehensive functionality.
Total Pads: 186 for versatile component placement.
Thru Hole Pads: 144 for reliable connections.
Top SMT Pads: 32 for surface mount components.
Bottom SMT Pads: 10 for surface mount components.
Vias: 177 for efficient signal routing.
Nets: 14 for seamless connectivity.


Artwork Format: Gerber RS-274-X for compatibility and ease of use.


Accepted Standard: Compliant with IPC-Class-2 for industry-leading quality.


Availability: Our PCB is available worldwide, ensuring accessibility for customers globally.


PCB Material: PTFE based Woven Fiberglass/Ceramic Filled Composites
Designation: AD250C
Dielectric constant: 2.50 (10 GHz)
Dissipation factor 0.0013 (10 GHz)
Layer count: Double Sided PCB, Multilayer PCB, Hybrid PCB
Copper weight: 1oz (35µm), 2oz (70µm)
Dielectric thickness 20mil (0.508mm), 30mil (0.762mm), 60mil (1.524mm)
PCB size: ≤400mm X 500mm
Solder mask: Green, Black, Blue, Yellow, Red etc.
Surface finish: Immersion gold (ENIG), HASL, Immersion silver, Immersion tin, OSP, ENEPIG, Bare copper, Pure gold plated etc..


PIM (30mil/60mil) -159/-163 dBc Reflected 43 dBm swept tones at 1900 MHz, S1/S1 Rogers Internal 50 ohm
Dielectric Constant (process) 2.52 - 23°C @ 50% RH 10 GHz IPC TM-650
(IPC TM-650
Dielectric Constant (design) 2.50 - C-24/23/50 10 GHz Microstrip Differential Phase Length
Dissipation Factor (process) 0.0013 - 23°C @ 50% RH 10 GHz IPC TM-650
Thermal Coefficient of Dielectric Constant -117 ppm/ºC 0°C to 100°C 10 GHz IPC TM-650
Volume Resistivity 4.8 x 108 Mohm-cm C-96/35/90 - IPC TM-650
Surface Resistivity 4.1 x 107 Mohm C-96/35/90 - IPC TM-650
Electrical Strength (dielectric strength) 979 V/mil - - IPC TM-650
Dielectric Breakdown >40 kV D-48/50 X/Y direction IPC TM-650 2.5.6
Thermal Properties
Decomposition Temperature (Td) >500 ˚C 2hrs @ 105˚C 5% Weight Loss IPC TM-650 2.3.40
Coefficient of Thermal Expansion - x 47 ppm/˚C - -55˚C to 288˚C IPC TM-650 2.4.41
Coefficient of Thermal Expansion - y 29 ppm/˚C - -55˚C to 288˚C IPC TM-650 2.4.41
Coefficient of Thermal Expansion - z 196 ppm/˚C - -55˚C to 288˚C IPC TM-650 2.4.41
Thermal Conductivity 0.33 W/mK - z direction ASTM D5470
Time to Delamination >60 minutes as-received 288˚C IPC TM-650
Mechanical Properties
Copper Peel Strength after Thermal Stress 2.6
N/mm (lbs/in) 10s @288˚C 35 μm foil IPC TM-650 2.4.8
Flexural Strength (MD/CMD) 8.8/6.4 (60.7/44.1) MPa (ksi ) 25°C ± 3°C - ASTM D790
Tensile Strength (MD/CMD) 6.0/5.6 (41.4/38.6) MPa (ksi ) 23°C/50% RH - ASTM D3039/D3039-14
Flex Modulus (MD/CMD) 885/778 (6,102/5,364) MPa (ksi ) 25°C ± 3°C - IPC-TM-650 Test Method 2.4.4
Dimensional Stability (MD/CMD) 0.02/0.06 mils/inch after etch + bake - IPC-TM-650 2.4.39a
Physical Properties
Flammability V-0 - - - UL-94
Moisture Absorption 0.04 % E1/105 +D48/50 - IPC TM-650
Density 2.28 g/cm3 C-24/23/50 - ASTM D792
Specific Heat Capacity 0.813 J/g°K 2 hours at 105°C - ASTM E2716

Introducing the AD250 PTFE and Ceramic Filled Composite PCB

Our AD250 PTFE and Ceramic Filled Composite PCB sets a new standard in performance and reliability, revolutionizing the world of circuit board technology. With its advanced features and cutting-edge design, this PCB is engineered to meet the most demanding requirements of various applications. Let's dive deeper into the specifications and capabilities of the AD250 PCB.


Unparalleled Electrical Performance:

The AD250 PCB showcases an impressive set of electrical properties, ensuring optimal signal integrity and transmission. With a dielectric constant of 2.52 at 10 GHz and 23°C, it maintains stable performance even in high-frequency applications. Reflected tones at 1900 MHz exhibit a remarkable PIM rating of -159 dBc (30mil/60mil), indicating excellent signal clarity and minimal interference. The board demonstrates superior electrical strength, with a dielectric breakdown voltage exceeding 40 kV.


Thermal Stability and Reliability:
Designed to withstand extreme temperatures, the AD250 PCB boasts exceptional thermal properties. It exhibits a decomposition temperature (Td) surpassing 500°C, ensuring outstanding durability even in demanding environments. The coefficient of thermal expansion remains within acceptable limits, with values of 47 ppm/?C (x-axis), 29 ppm/?C (y-axis), and 196 ppm/?C (z-axis) over a temperature range of -55?C to 288?C. Additionally, the PCB showcases a thermal conductivity of 0.33 W/mK in the z-axis direction, facilitating efficient heat dissipation.


Reliable Mechanical Strength:
The AD250 PCB excels in mechanical performance, providing robustness and stability. With a flexural strength of 8.8 MPa (MD) and 6.4 MPa (CMD), it withstands bending forces and maintains structural integrity. The PCB exhibits impressive tensile strength, with values of 6.0 MPa (MD) and 5.6 MPa (CMD), ensuring resistance against pulling forces. Additionally, the flex modulus of 885 MPa (MD) and 778 MPa (CMD) further enhances the board's mechanical stability.


Outstanding Dimensional Stability:
Maintaining precise dimensions is crucial for optimal circuit board performance. The AD250 PCB showcases exceptional dimensional stability, with a low coefficient of dimensional change. After etching and baking processes, it maintains dimensional stability with only 0.02 mils/inch (MD) and 0.06 mils/inch (CMD) of change, ensuring consistent and accurate circuitry.


Rogers AD250 1.524mm 2 Layer Rigid PCB No Solder Mask 0


Flame Retardant and Moisture Resistant:
The AD250 PCB adheres to the V-0 flammability rating, making it highly resistant to combustion and contributing to overall safety. With a moisture absorption rate of only 0.04%, the board demonstrates excellent resistance to moisture-related issues, ensuring reliable operation even in humid environments.


Quality and Compatibility:
Compliant with IPC-Class-2 standards, the AD250 PCB guarantees high-quality manufacturing and adherence to industry benchmarks. It accepts Gerber RS-274-X artwork format, providing compatibility and ease of use. Prior to shipment, each board undergoes a rigorous 100% electrical test, ensuring optimal functionality and reliability.


Global Availability and Support:
Our AD250 PCB is available worldwide, allowing customers from various regions to benefit from its outstanding features. For any technical inquiries or further information, our dedicated team, led by Ivy at, is ready to provide comprehensive support and address your specific requirements.


In conclusion, the AD250 PTFE and Ceramic Filled Composite PCB sets a new benchmark in performance, reliability, and thermal stability. With its exceptional electrical properties, mechanical strength, and dimensional stability, it is an ideal choice for a wide range of applications. Trust in the AD250 PCB to deliver unparalleled performance and ensure the success of your next electronic project.

Contact Details
Bicheng Electronics Technology Co., Ltd

Contact Person: Ms. Ivy Deng

Tel: 86-755-27374946

Fax: 86-755-27374848

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