Send Message
Home ProductsPCB Blog

RO4003C Via Filled PCB Blog Low DK For RF Applications

China Bicheng Electronics Technology Co., Ltd certification
China Bicheng Electronics Technology Co., Ltd certification
Kevin, Received and tested the boards - thanks very much. These are perfect, exactly what we needed. rgds Rich

—— Rich Rickett

Ruth, I got the PCB today, and they are just perfect. Please stay a little patience, my next order is coming soon. Kind regards from Hamburg Olaf

—— Olaf Kühnhold

Hi Natalie. It was perfect, I attach some pictures for your reference. And I send you next 2 projects to budget. Thanks a lot again

—— Sebastian Toplisek

Kevin, Thanks, they were perfectly made, and work well. As promised, here are the links for my latest project, using the PCBs you manufactured for me: Regards, Daniel

—— Daniel Ford

I'm Online Chat Now

RO4003C Via Filled PCB Blog Low DK For RF Applications

Detailed Product Description
High Light:

Low DK RF PCB Blog


Via Filled PCB Blog


RO4003C RF PCB Board

Today's PCB sharing is a via filled by resin and capped PCB. Made from RO4003C hydrocarbon ceramic laminates, this PCB is ideal for use in a variety of applications. With a lead-free process and -40℃ to +85℃ temperature range, this PCB is environmentally friendly and can operate in extreme temperatures.


The PCB measures 136mm x 96mm, with a finished board thickness of 0.6mm and finished copper weight of 1.5 oz (2.1 mils) all layers. It features 96 components and 128 total pads, including 54 thru-hole pads, 72 top SMT pads, and 0 bottom SMT pads. With a minimum trace/space

of 4/4 mils and minimum hole size of 0.2mm, this PCB provides high-density interconnectivity.


The PCB is constructed using electroless nickle immersion gold (ENIG) surface finish for improved solderability and corrosion resistance. It also features a green top and bottom solder mask, with no silkscreen on the solder pads. The slotted holes defined as per Gerber are plated through, with side-by-side holes defining the dimensions of the slots.


The PCB meets IPC-Class-2 standards and has been 100% electrically tested to ensure reliability. It also features 0.2mm and 0.5mm via filled by resin and capped as per IPC-4761 Type VII. With worldwide service area, this PCB is perfect for a wide range of applications.


Property RO4003C Direction Units Condition Test Method
Dielectric Constant,εProcess 3.38±0.05 Z   10 GHz/23℃ IPC-TM-650 Clamped Stripline
Dielectric Constant,εDesign 3.55 Z   8 to 40 GHz Differential Phase Length Method
Dissipation Factortan,δ 0.0027
Z   10 GHz/23℃
2.5 GHz/23℃
Thermal Coefficient of ε +40 Z ppm/℃ -50℃to 150℃ IPC-TM-650
Volume Resistivity 1.7 x 1010   MΩ.cm COND A IPC-TM-650
Surface Resistivity 4.2 x 109   COND A IPC-TM-650
Electrical Strength 31.2(780) Z Kv/mm(v/mil) 0.51mm(0.020") IPC-TM-650
Tensile Modulus 19,650(2,850)
MPa(ksi) RT ASTM D 638
Tensile Strength 139(20.2)
MPa(ksi) RT ASTM D 638
Flexural Strength 276
  IPC-TM-650 2.4.4
Dimensional Stability <0.3 X,Y mm/m
after etch+E2/150℃ IPC-TM-650 2.4.39A
Coefficient of Thermal Expansion 11
ppm/℃ -55℃to288℃ IPC-TM-650 2.4.41
Tg >280   ℃ TMA A IPC-TM-650
Td 425   ℃ TGA   ASTM D 3850
Thermal Conductivity 0.71   W/M/oK 80℃ ASTM C518
Moisture Absorption 0.06   % 48hrs immersion 0.060"
sample Temperature 50℃
ASTM D 570
Density 1.79   gm/cm3 23℃ ASTM D 792
Copper Peel Stength 1.05
after solder float 1 oz.
EDC Foil
IPC-TM-650 2.4.8
Flammability N/A       UL 94
Lead-free Process Compatible Yes        


Why sugguest RO4003C?


RO4003C boasts a dielectric constant of 3.38±0.05 and a design dielectric constant of 3.55, making it the ideal material for high-frequency applications. It also has a low dissipation factor of 0.0027 and 0.0021 at 10 GHz/23℃ and 2.5 GHz/23℃, respectively, ensuring excellent signal integrity. Plus, with a thermal coefficient of ε of +40 ppm/℃ from -50℃ to 150℃, RO4003C can withstand even the most extreme temperatures!


But that's not all – RO4003C provides several advantages over other PCB materials. It ensures superior signal integrity due to its low dielectric constant and dissipation factor, making it an ideal choice for high-frequency and high-speed digital applications. Its low thermal coefficient of ε also makes it suitable for use in high-temperature environments, and it is lead-free process compatible, making it an environmentally friendly option.


RO4003C is suitable for a wide range of demanding applications, including RF/microwave applications, high-speed digital applications, and aerospace and defense. It can even operate in temperatures ranging from -40℃ to +85℃, making it ideal for harsh environments and extreme conditions.


Compared to other PCB materials, RO4003C provides superior high-frequency performance and signal integrity. Its low thermal coefficient of ε also ensures better performance in high-temperature environments. And, with its cost-effectiveness, RO4003C is a popular choice for PCB manufacturing.


Don't miss out on the future of PCB event – choose RO4003C for your next project! With its excellent properties and versatility, RO4003C is sure to impress and provide the high-performance results you need. Contact us today to learn more about how RO4003C can take your PCB to the next level!


RO4003C Via Filled PCB Blog Low DK For RF Applications 0

Contact Details
Bicheng Electronics Technology Co., Ltd

Contact Person: Ms. Ivy Deng

Tel: 86-755-27374946

Fax: 86-755-27374848

Send your inquiry directly to us (0 / 3000)