Low DK RF PCB Blog,
Via Filled PCB Blog,
RO4003C RF PCB Board
Today's PCB sharing is a via filled by resin and capped PCB. Made from RO4003C hydrocarbon ceramic laminates, this PCB is ideal for use in a variety of applications. With a lead-free process and -40℃ to +85℃ temperature range, this PCB is environmentally friendly and can operate in extreme temperatures.
The PCB measures 136mm x 96mm, with a finished board thickness of 0.6mm and finished copper weight of 1.5 oz (2.1 mils) all layers. It features 96 components and 128 total pads, including 54 thru-hole pads, 72 top SMT pads, and 0 bottom SMT pads. With a minimum trace/space
of 4/4 mils and minimum hole size of 0.2mm, this PCB provides high-density interconnectivity.
The PCB is constructed using electroless nickle immersion gold (ENIG) surface finish for improved solderability and corrosion resistance. It also features a green top and bottom solder mask, with no silkscreen on the solder pads. The slotted holes defined as per Gerber are plated through, with side-by-side holes defining the dimensions of the slots.
The PCB meets IPC-Class-2 standards and has been 100% electrically tested to ensure reliability. It also features 0.2mm and 0.5mm via filled by resin and capped as per IPC-4761 Type VII. With worldwide service area, this PCB is perfect for a wide range of applications.
|Dielectric Constant,εProcess||3.38±0.05||Z||10 GHz/23℃||IPC-TM-650 188.8.131.52 Clamped Stripline|
|Dielectric Constant,εDesign||3.55||Z||8 to 40 GHz||Differential Phase Length Method|
|Thermal Coefficient of ε||+40||Z||ppm/℃||-50℃to 150℃||IPC-TM-650 184.108.40.206|
|Volume Resistivity||1.7 x 1010||MΩ.cm||COND A||IPC-TM-650 220.127.116.11|
|Surface Resistivity||4.2 x 109||MΩ||COND A||IPC-TM-650 18.104.22.168|
|Electrical Strength||31.2(780)||Z||Kv/mm(v/mil)||0.51mm(0.020")||IPC-TM-650 22.214.171.124|
|MPa(ksi)||RT||ASTM D 638|
|MPa(ksi)||RT||ASTM D 638|
|after etch+E2/150℃||IPC-TM-650 2.4.39A|
|Coefficient of Thermal Expansion||11
|Tg||>280||℃ TMA||A||IPC-TM-650 126.96.36.199|
|Td||425||℃ TGA||ASTM D 3850|
|Thermal Conductivity||0.71||W/M/oK||80℃||ASTM C518|
|Moisture Absorption||0.06||%||48hrs immersion 0.060"
sample Temperature 50℃
|ASTM D 570|
|Density||1.79||gm/cm3||23℃||ASTM D 792|
|Copper Peel Stength||1.05
|after solder float 1 oz.
|Lead-free Process Compatible||Yes|
Why sugguest RO4003C?
RO4003C boasts a dielectric constant of 3.38±0.05 and a design dielectric constant of 3.55, making it the ideal material for high-frequency applications. It also has a low dissipation factor of 0.0027 and 0.0021 at 10 GHz/23℃ and 2.5 GHz/23℃, respectively, ensuring excellent signal integrity. Plus, with a thermal coefficient of ε of +40 ppm/℃ from -50℃ to 150℃, RO4003C can withstand even the most extreme temperatures!
But that's not all – RO4003C provides several advantages over other PCB materials. It ensures superior signal integrity due to its low dielectric constant and dissipation factor, making it an ideal choice for high-frequency and high-speed digital applications. Its low thermal coefficient of ε also makes it suitable for use in high-temperature environments, and it is lead-free process compatible, making it an environmentally friendly option.
RO4003C is suitable for a wide range of demanding applications, including RF/microwave applications, high-speed digital applications, and aerospace and defense. It can even operate in temperatures ranging from -40℃ to +85℃, making it ideal for harsh environments and extreme conditions.
Compared to other PCB materials, RO4003C provides superior high-frequency performance and signal integrity. Its low thermal coefficient of ε also ensures better performance in high-temperature environments. And, with its cost-effectiveness, RO4003C is a popular choice for PCB manufacturing.
Don't miss out on the future of PCB event – choose RO4003C for your next project! With its excellent properties and versatility, RO4003C is sure to impress and provide the high-performance results you need. Contact us today to learn more about how RO4003C can take your PCB to the next level!
Contact Person: Ms. Ivy Deng