RO4003C Via Filled PCB Low DK For RF Applications

Today's PCB sharing is a via filled by resin and capped PCB. Made from RO4003C hydrocarbon ceramic laminates, this PCB is ideal for use in a variety of applications. With a lead-free process and -40℃ to +85℃ temperature range, this PCB is environmentally friendly and can operate in extreme temperatures.

The PCB measures 136mm x 96mm, with a finished board thickness of 0.6mm and finished copper weight of 1.5 oz (2.1 mils) all layers. It features 96 components and 128 total pads, including 54 thru-hole pads, 72 top SMT pads, and 0 bottom SMT pads. With a minimum trace/space

of 4/4 mils and minimum hole size of 0.2mm, this PCB provides high-density interconnectivity.

The PCB is constructed using electroless nickle immersion gold (ENIG) surface finish for improved solderability and corrosion resistance. It also features a green top and bottom solder mask, with no silkscreen on the solder pads. The slotted holes defined as per Gerber are plated through, with side-by-side holes defining the dimensions of the slots.

The PCB meets IPC-Class-2 standards and has been 100% electrically tested to ensure reliability. It also features 0.2mm and 0.5mm via filled by resin and capped as per IPC-4761 Type VII. With worldwide service area, this PCB is perfect for a wide range of applications.

Why sugguest RO4003C?

RO4003C boasts a dielectric constant of 3.38±0.05 and a design dielectric constant of 3.55, making it the ideal material for high-frequency applications. It also has a low dissipation factor of 0.0027 and 0.0021 at 10 GHz/23℃ and 2.5 GHz/23℃, respectively, ensuring excellent signal integrity. Plus, with a thermal coefficient of ε of +40 ppm/℃ from -50℃ to 150℃, RO4003C can withstand even the most extreme temperatures!

But that's not all – RO4003C provides several advantages over other PCB materials. It ensures superior signal integrity due to its low dielectric constant and dissipation factor, making it an ideal choice for high-frequency and high-speed digital applications. Its low thermal coefficient of ε also makes it suitable for use in high-temperature environments, and it is lead-free process compatible, making it an environmentally friendly option.

RO4003C is suitable for a wide range of demanding applications, including RF/microwave applications, high-speed digital applications, and aerospace and defense. It can even operate in temperatures ranging from -40℃ to +85℃, making it ideal for harsh environments and extreme conditions.

Compared to other PCB materials, RO4003C provides superior high-frequency performance and signal integrity. Its low thermal coefficient of ε also ensures better performance in high-temperature environments. And, with its cost-effectiveness, RO4003C is a popular choice for PCB manufacturing.

Don't miss out on the future of PCB event – choose RO4003C for your next project! With its excellent properties and versatility, RO4003C is sure to impress and provide the high-performance results you need. Contact us today to learn more about how RO4003C can take your PCB to the next level!