RO3010 RF PCB Board,
RF PCB Materials Board,
RO3010 RF Circuit Board
Hi, today we are happy to introduce the latest PCB from Bicheng Limited, the industry leader in high-quality printed circuit boards. This double-sided PCB is constructed with Rogers RO3010 material and a lead-free process, ensuring a reliable and environmentally-friendly product.
With a working temperature range of -40℃ to +85℃, this PCB is designed to withstand extreme conditions. The board dimensions are 8.00 x 8.00 mm, with a minimum trace/space of 5/5 mils and a minimum hole size of 10 mils. The finished board thickness is 0.8 mm, with a finished copper weight of 1 oz (1.4 mils) and via plating thickness of 1 mil.
This PCB is perfect for small-scale projects, with just one component and three total pads, including one thru-hole pad, one top SMT pad, and one bottom SMT pad. There are also two vias and one net.
The lack of surface finish on this PCB means that the copper is exposed, making it ideal for custom applications where specific finishes are required. There is no silkscreen on the solder pads, but the board is 100% electrically tested to ensure reliability.
For any technical questions, please contact Ivy at email@example.com. Trust Bicheng Limited for all of your printed circuit board needs. Copyright Bicheng Limited., 2023. All rights reserved.
|IPC-TM-650 22.214.171.124 Clamped Stripline
|8GHz to 40 GHz
|Differential Phase Length Method
|Thermal Coefficient of ε
|10 GHz -50℃to 150℃
|ASTM D 638
|ASTM D 5470
|Coefficient of Thermal Expansion
(-55 to 288℃)
|ASTM D 3850
|ASTM D 792
|Copper Peel Stength
|1oz,EDC After Solder Float
|Lead-free Process Compatible
Discover the Benefits of RO3010 PCB Material
---RO3010: The Ultimate Choice for High-Performance PCBs
When it comes to creating high-performance printed circuit boards, selecting the right materials is critical. Enter RO3010, a leading PCB material known for its versatility and high quality. In this article, we'll take a comprehensive look at RO3010, exploring its properties, characteristics, and applications.
Introducing RO3010 PCB Material
RO3010 is a high-frequency laminate material constructed from woven glass reinforced hydrocarbon/ceramic material. With a low dielectric constant of 10.2±0.5, RO3010 is ideal for high-frequency applications, while its low dissipation factor of 0.0027 is essential for minimizing signal loss.
Understanding RO3010's Properties and Characteristics
RO3010 has numerous properties that make it an appealing choice for PCB designers. Its thermal conductivity of 0.81 W/M/K is critical for dissipating heat from high-power components. RO3010 also has a low coefficient of thermal expansion of 13 ppm/℃ in the X and Y directions and 34 ppm/℃ in the Z direction, rendering it stable over a wide temperature range.
Applications of RO3010 PCB Material
RO3010 is commonly used in high-speed digital and radio frequency (RF) applications. Due to its low loss and high thermal conductivity, this material is ideal for microwave and millimeter-wave applications. Moreover, RO3010 is environmentally-friendly as it is compatible with lead-free processes.
Advantages of RO3010 Over Other PCB Materials
Compared to other PCB materials, RO3010 offers several advantages. RO3010 has a high thermal coefficient of ε, which means that its dielectric constant is stable over a wide temperature range. Additionally, the material has excellent dimensional stability, making it ideal for applications where precision is crucial.
Design Considerations for RO3010 PCBs
When designing with RO3010, it's important to take the material's properties and characteristics into account. RO3010 has a high glass transition temperature of 200℃, which means that it can withstand high temperatures without losing its structural integrity. Additionally, the material's copper peel strength is critical, measuring 11 pli for 1oz EDC after solder float.
Manufacturing Process for RO3010 PCBs
The manufacturing process for RO3010 PCBs is comparable to other laminate materials. However, due to the material's high thermal conductivity, it's critical to optimize the bonding process to reduce thermal stress. It's also essential to use high-quality copper foils to ensure good adhesion and minimize the risk of delamination.
Testing and Quality Control for RO3010 PCBs
RO3010 PCBs undergo rigorous testing and quality control to ensure that they meet industry standards. The material's dielectric constant and dissipation factor are tested using IPC-TM-650 126.96.36.199, while ASTM D257 tests the material's dimensional stability. IPC 188.8.131.52 tests the material's volume and surface resistivity, and IPC-TM 2.4.8 tests the material's copper peel strength.
Cost and Availability of RO3010 PCB Material
RO3010 PCB material is widely available and can be purchased from a variety of suppliers. The cost of RO3010 PCB material is generally higher than other PCB materials due to its unique properties and characteristics.
Future Developments in RO3010 Technology
As technology continues to advance, we can expect to see further developments in RO3010 technology. One area of focus is reducing the material's thermal coefficient of ε to improve its stability over a wide temperature range. Another area of research is developing new bonding processes that can withstand even higher temperatures.
Conclusion: Is RO3010 the Right Choice for Your PCB Project?
RO3010 is a versatile, high-quality PCB material that offers several advantages over other materials. Its low dielectric constant, low dissipation factor, and high thermal conductivity make it an ideal choice for high-frequency applications. However, it's essential to consider the material's properties and characteristics when designing with RO3010. In conclusion, if you're looking for a reliable, high-performance PCB material, RO3010 is an excellent choice.
Contact Person: Ms. Ivy Deng