|
Product Details:
Payment & Shipping Terms:
|
| PCB Material: | Polyimide Glass Fabric Copper-clad Laminates | Dielectric Constant: | 4.12 |
|---|---|---|---|
| Layer Count: | Sinlge-sided PCB, Double-sided PCB, Multi-layer PCB, Hybrid PCB | Copper Weight: | 1oz (35µm), 2oz (70µm) |
| Solder Mask: | Green, Black, Blue, Red, Yellow Etc. | Surface Finish: | Electroless Nickel And Immersion Gold (ENIG), HASL, Immersion Silver, Immersion Tin, Bare Copper, OSP, ENEPIG (Electroless Nickel Electroless Palladium Immersion Gold), Pure Gold Plated Etc.. |
| High Light: | High Frequency Polyimide PCBs,High Temperature Resistant Polyimide PCBs,1oz Polyimide PCB Material |
||
Brief Introduction
TB-73 high-temperature resistant and high-frequency Polyimide copper-clad laminates are designed to withstand high temperatures and high frequencies. They are used in the manufacture of special high-temperature and high-frequency circuit boards for electronic equipment in demanding industries such as aerospace, aviation, military, and underground petroleum exploration, among others. The material has excellent high-frequency dielectric properties, high-temperature resistance, and radiation resistance. Its nominal thickness ranges from 0.1mm to 10mm
Chemical Test Report
TB-73 meets the technical conditions outlined in the Q/XA50089-2004 standard. The material has undergone a series of tests to ensure its quality and performance.
The peel strength of TB-73 after thermal stress is ≥1.0 N/mm, and the actual test result is 1.42 N/mm, which is a pass. Similarly, the peel strength at 170℃ is ≥0.7 N/mm, and the actual test result is a pass as well.
The volume resistivity is ≥5×10^6 MΩ·cm according to the C-96/35/90 standard, and it achieved a test result of 6.6×10^7 MΩ·cm, which is a pass. According to the E-24/204 standard, the volume resistivity is also ≥5×10^6 MΩ·cm, and the actual test result is 6.2×10^8 MΩ·cm, which is also a pass.
The surface resistivity is also within the specified range. The actual test result for the C-96/35/90 standard is 3.4×10^7 MΩ, and for the E-24/204 standard, it is 2.3×10^8 MΩ, both of which are a pass.
TB-73 has a low moisture absorption rate of ≤0.35%, and the actual test result is 0.11%, which is a pass. The breakdown voltage is also satisfactory, with a test result of 44.3 kV, which is higher than the minimum requirement of 40 kV.
The dielectric constant at 1MHz is ≤4.5, and the actual test result is 4.12, which is a pass. Similarly, the dissipation factor at 1MHz is ≤0.01, and the actual test result is 0.0072, which is a pass as well.
TB-73 has a bending strength of ≥400 N/mm² in the machine direction and ≥300 N/mm² in the cross direction, both of which are a pass. The material can also withstand thermal stress at 288℃ for 180 seconds without delamination or blistering.
The glass transition temperature (Tg value) of TB-73 is 257℃, meeting the specified requirement.
Our PCB Capability (TB-73 Polyimide RF PCB)
| PCB material: | Polyimide Glass Fabric Copper-clad Laminates |
| Designation: | TB-73 |
| Dielectric constant: | 4.12 |
| Layer count: | Sinlge-sided PCB, Double-sided PCB, Multi-layer PCB, Hybrid PCB |
| Dielectric thickness: | 5mil (0.127mm), 10mil(0.254mm), 20mil (0.508mm), 30mil (0.762mm), 50mil (1.27mm), 60mil (1.524mm) etc. |
| Copper weight: | 1oz (35µm), 2oz (70µm) |
| PCB size: | ≤400mm X 500mm |
| Solder mask: | Green, Black, Blue, Red, Yellow etc. |
| Surface finish: | Electroless Nickel and Immersion Gold (ENIG), HASL, Immersion silver, Immersion tin, Bare copper, OSP, ENEPIG (Electroless Nickel Electroless Palladium Immersion Gold), Pure gold plated etc.. |
About Bicheng
Bicheng PCB is a leading supplier of high-quality printed circuit boards (PCBs) based in Shenzhen, China. Established in 2003, the company has over 20 years of experience in the industry and has built a reputation for delivering reliable and cost-effective PCB solutions to customers across the globe.
Bicheng PCB's manufacturing capabilities cover a wide range of PCB types, including single-sided, double-sided, and multilayer boards, with layer counts ranging from 1 to 32. The company's PCBs are used in a variety of industries, including telecommunications, aerospace, defense, medical, and industrial electronics.
Bicheng PCB offers a wide range of substrate materials for its PCBs, including high-frequency materials such as RO4003C, RO4350B, and RO4730G3, as well as standard FR-4 materials like high-Tg S1000-2M, TU-872 SLK, TU-768, IT-180A, and Isola 370HR. The company also offers metal core, polyimide, and PET substrates, among others.
Bicheng PCB's advanced manufacturing capabilities allow for a range of options that can be customized to meet specific customer needs. For example, the company can produce PCBs in sizes up to 1100mm by 600mm, with a board outline tolerance of ±0.0059" (0.15mm) and thickness tolerance of ±8% for T≥0.8mm and ±10% for t＜0.8mm. The company can also accommodate a range of copper thicknesses, from 17µm to 350µm (0.5oz to 10oz), and drill hole diameters from 0.0079" to 0.25" (0.2mm to 6.35mm).
Bicheng PCB's commitment to quality and customer satisfaction is reflected in its ISO 9001:2015 certification. The company's experienced engineers and technicians work closely with customers to ensure that their specific requirements are met and that their PCBs are delivered on time and within budget.
Appendix: Data Sheet (TB-73 laminates)
| No. | Item | Processing Condition | Standard Specification | Test Results | Conclusion |
| 1 | Peel Strength (N/mm) | After Thermal Stress | ≥1.0 | 1.42 | Pass |
| 170℃ | ≥0.7 | Pass | Pass | ||
| After Process Solution | ≥0.95 | 1.13 | Pass | ||
| 2 | Volume Resistivity (MΩ·cm) | C-96/35/90 | ≥5×10^6 | 6.6×10^7 | Pass |
| E-24/204 | ≥5×10^6 | 6.2×10^8 | Pass | ||
| 3 | Surface Resistivity (MΩ) | C-96/35/90 | ≥1×10^6 | 3.4×10^7 | Pass |
| E-24/204 | ≥1×10^6 | 2.3×10^8 | Pass | ||
| 4 | Moisture Absorption Rate( %) | D-24/23 | ≤0.35% | 0.11 | Pass |
| 5 | Breakdown Voltage (kV) | D-48/50+ D-0.5/23 | ≥40 kV | 44.3 | Pass |
| 6 | Dielectric Constant at 1MHz | As Received | ≤4.5 | 4.12 | Pass |
| 7 | Dissipation Factor at 1MHz | As Received | ≤0.01 | 0.0072 | Pass |
| 8 | Bending Strength Machine Direction Cross Direction | As Received | ≥400 N/mm² | 410.2 | Pass |
| As Received | ≥300 N/mm² | 355.1 | Pass | ||
| 9 | Thermal Stress (288℃) | As Received | 180s, no delamination, no blistering | Pass | Pass |
| 10 | Glass Transition Temperature (Tg Value) | As Received | 257℃ | Pass | Pass |
Contact Person: Ms. Ivy Deng
Tel: 86-755-27374946
Fax: 86-755-27374848
