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Rogers 4350 Dual Layer 6.6 Mil High Frequency PCB With Immersion Gold

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Rogers 4350 Dual Layer 6.6 Mil High Frequency PCB With Immersion Gold

MOQ:	1PCS
Price:	USD9.99-99.99
Standard Packaging:	Vacuum bags+Cartons
Delivery Period:	8-9 working days
Payment Method:	T/T
Supply Capacity:	5000PCS per month

Details Information

Product Description

Detail Information

Place of Origin

CHINA

Brand Name

Bicheng

Certification

UL, ISO9001, IATF16949

Model Number

BIC-2.V1.0

Based Material:

Rogers 4350

PCB Thickness:

6.6 Mil

PCB Size:

≤400mm X 500mm

Surface:

Highlight:

Dual Layer High Frequency PCB

6.6 Mil High Frequency PCB

Immersion Gold Two Layer Pcb

Product Description

Rogers 4350 Dual layer 6.6 mil High frequency PCB with Immersion Gold

The qualities required by designers of RF microwave circuits, matching networks, and controlled impedance transmission lines are present in the material RO4350B. Since standard circuit board materials cannot be used in many applications due to higher operating frequencies, low dielectric loss makes it possible to employ RO4350B material in these applications.

The dielectric constant is consistent across a wide frequency range and has one of the lowest temperature coefficients of any circuit board material.

Main applications:

Low Noise Block

Power amplifiers

RFID

RO4350B Typical Value
Property	RO4350B	Direction	Units	Condition	Test Method
Dielectric Constant,εProcess	3.48±0.05	Z		10 GHz/23℃	IPC-TM-650 2.5.5.5 Clamped Stripline
Dielectric Constant,εDesign	3.66	Z		8 to 40 GHz	Differential Phase Length Method
Dissipation Factortan,δ	0.0037 0.0031	Z		10 GHz/23℃ 2.5 GHz/23℃	IPC-TM-650 2.5.5.5
Thermal Coefficient of ε	+50	Z	ppm/℃	-50℃to 150℃	IPC-TM-650 2.5.5.5
Volume Resistivity	1.2 x 10¹⁰		MΩ.cm	COND A	IPC-TM-650 2.5.17.1
Surface Resistivity	5.7 x10⁹		MΩ	COND A	IPC-TM-650 2.5.17.1
Electrical Strength	31.2(780)	Z	Kv/mm(v/mil)	0.51mm(0.020")	IPC-TM-650 2.5.6.2
Tensile Modulus	16,767(2,432) 14,153(2,053)	X Y	MPa(ksi)	RT	ASTM D 638
Tensile Strength	203(29.5) 130(18.9)	X Y	MPa(ksi)	RT	ASTM D 638
Flexural Strength	255 (37)		MPa (kpsi)		IPC-TM-650 2.4.4
Dimensional Stability	<0.5	X,Y	mm/m (mil/inch)	after etch+E2/150℃	IPC-TM-650 2.4.39A
Coefficient of Thermal Expansion	10 12 32	X Y Z	ppm/℃	-55℃to288℃	IPC-TM-650 2.4.41
Tg	>280		℃ TMA	A	IPC-TM-650 2.4.24.3
Td	390		℃ TGA		ASTM D 3850
Thermal Conductivity	0.69		W/M/oK	80℃	ASTM C518
Moisture Absorption	0.06		%	48hrs immersion 0.060" sample Temperature 50℃	ASTM D 570
Density	1.86		gm/cm³	23℃	ASTM D 792
Copper Peel Stength	0.88 (5.0)		N/mm (pli)	after solder float 1 oz. EDC Foil	IPC-TM-650 2.4.8
Flammability	⁽³⁾V-0				UL 94
Lead-free Process Compatible	Yes

Rogers 4350 Dual Layer 6.6 Mil High Frequency PCB With Immersion Gold 0

Tags:

Products

MOQ:	1PCS
Price:	USD9.99-99.99
Standard Packaging:	Vacuum bags+Cartons
Delivery Period:	8-9 working days
Payment Method:	T/T
Supply Capacity:	5000PCS per month

Detail Information

Product Description

Detail Information

Place of Origin

CHINA

Brand Name

Bicheng

Certification

UL, ISO9001, IATF16949

Model Number

BIC-2.V1.0

Based Material:

Rogers 4350

PCB Thickness:

6.6 Mil

PCB Size:

≤400mm X 500mm

Surface:

Gold

Minimum Order Quantity:

1PCS

Price:

USD9.99-99.99

Packaging Details:

Vacuum bags+Cartons

Delivery Time:

8-9 working days

Payment Terms:

T/T

Supply Ability:

5000PCS per month

Highlight

Dual Layer High Frequency PCB

6.6 Mil High Frequency PCB

Immersion Gold Two Layer Pcb

Product Description

Rogers 4350 Dual layer 6.6 mil High frequency PCB with Immersion Gold

The dielectric constant is consistent across a wide frequency range and has one of the lowest temperature coefficients of any circuit board material.

Main applications:

Low Noise Block

Power amplifiers

RFID

RO4350B Typical Value
Property	RO4350B	Direction	Units	Condition	Test Method
Dielectric Constant,εProcess	3.48±0.05	Z		10 GHz/23℃	IPC-TM-650 2.5.5.5 Clamped Stripline
Dielectric Constant,εDesign	3.66	Z		8 to 40 GHz	Differential Phase Length Method
Dissipation Factortan,δ	0.0037 0.0031	Z		10 GHz/23℃ 2.5 GHz/23℃	IPC-TM-650 2.5.5.5
Thermal Coefficient of ε	+50	Z	ppm/℃	-50℃to 150℃	IPC-TM-650 2.5.5.5
Volume Resistivity	1.2 x 10¹⁰		MΩ.cm	COND A	IPC-TM-650 2.5.17.1
Surface Resistivity	5.7 x10⁹		MΩ	COND A	IPC-TM-650 2.5.17.1
Electrical Strength	31.2(780)	Z	Kv/mm(v/mil)	0.51mm(0.020")	IPC-TM-650 2.5.6.2
Tensile Modulus	16,767(2,432) 14,153(2,053)	X Y	MPa(ksi)	RT	ASTM D 638
Tensile Strength	203(29.5) 130(18.9)	X Y	MPa(ksi)	RT	ASTM D 638
Flexural Strength	255 (37)		MPa (kpsi)		IPC-TM-650 2.4.4
Dimensional Stability	<0.5	X,Y	mm/m (mil/inch)	after etch+E2/150℃	IPC-TM-650 2.4.39A
Coefficient of Thermal Expansion	10 12 32	X Y Z	ppm/℃	-55℃to288℃	IPC-TM-650 2.4.41
Tg	>280		℃ TMA	A	IPC-TM-650 2.4.24.3
Td	390		℃ TGA		ASTM D 3850
Thermal Conductivity	0.69		W/M/oK	80℃	ASTM C518
Moisture Absorption	0.06		%	48hrs immersion 0.060" sample Temperature 50℃	ASTM D 570
Density	1.86		gm/cm³	23℃	ASTM D 792
Copper Peel Stength	0.88 (5.0)		N/mm (pli)	after solder float 1 oz. EDC Foil	IPC-TM-650 2.4.8
Flammability	⁽³⁾V-0				UL 94
Lead-free Process Compatible	Yes

Rogers 4350 Dual Layer 6.6 Mil High Frequency PCB With Immersion Gold 0

Tags:

RF PCB Board

Rogers PCB Board

PTFE PCB Board

High TG PCB

Multi Layer PCB

Taconic PCB

HDI PCB Board

High Speed PCB

Impedance Controlled PCB

Flexible PCB Board

FR4 PCB Board

PCB Stencil

Metal Core PCB

Rogers 4350 Dual Layer 6.6 Mil High Frequency PCB With Immersion Gold

Dual Layer High Frequency PCB

6.6 Mil High Frequency PCB

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Rogers PCB Board

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High Speed PCB

Impedance Controlled PCB

Flexible PCB Board

FR4 PCB Board

PCB Stencil

Metal Core PCB

Dual Layer High Frequency PCB

6.6 Mil High Frequency PCB

Immersion Gold Two Layer Pcb

RO4003C LoPro Rogers PCB Board,

8mil Rogers PCB Board,