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TMM13i High Frequency Printed Circuit Board 60mil 1.524mm Rogers Higher DK12.85 RF PCB With Immersion Gold

Certification
China Bicheng Electronics Technology Co., Ltd certification
China Bicheng Electronics Technology Co., Ltd certification
Kevin, Received and tested the boards - thanks very much. These are perfect, exactly what we needed. rgds Rich

—— Rich Rickett

Ruth, I got the PCB today, and they are just perfect. Please stay a little patience, my next order is coming soon. Kind regards from Hamburg Olaf

—— Olaf Kühnhold

Hi Natalie. It was perfect, I attach some pictures for your reference. And I send you next 2 projects to budget. Thanks a lot again

—— Sebastian Toplisek

Kevin, Thanks, they were perfectly made, and work well. As promised, here are the links for my latest project, using the PCBs you manufactured for me: Regards, Daniel

—— Daniel Ford

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TMM13i High Frequency Printed Circuit Board 60mil 1.524mm Rogers Higher DK12.85 RF PCB With Immersion Gold

TMM13i High Frequency Printed Circuit Board 60mil 1.524mm Rogers Higher DK12.85 RF PCB With Immersion Gold
TMM13i High Frequency Printed Circuit Board 60mil 1.524mm Rogers Higher DK12.85 RF PCB With Immersion Gold TMM13i High Frequency Printed Circuit Board 60mil 1.524mm Rogers Higher DK12.85 RF PCB With Immersion Gold TMM13i High Frequency Printed Circuit Board 60mil 1.524mm Rogers Higher DK12.85 RF PCB With Immersion Gold

Large Image :  TMM13i High Frequency Printed Circuit Board 60mil 1.524mm Rogers Higher DK12.85 RF PCB With Immersion Gold

Product Details:
Place of Origin: CHINA
Brand Name: Bicheng
Certification: UL, ISO9001, IATF16949
Model Number: BIC-160.V1.0
Payment & Shipping Terms:
Minimum Order Quantity: 1PCS
Price: USD9.99-99.99
Packaging Details: Vacuum bags+Cartons
Delivery Time: 8-9 working days
Payment Terms: T/T
Supply Ability: 5000PCS per month
Detailed Product Description
Base Material: Ceramic, Hydrocarbon, Thermoset Polymer Composites Layer Count: Double Layer, Multilayer, Hybrid PCB
PCB Thickness: 15mil (0.381mm), 20mil (0.508mm), 25mil (0.635mm), 30mil(0.762mm), 50mil (1.27mm), 60mil (1.524mm), 75mil(1.905mm), 100mil (2.54mm), 125mil (3.175mm), 150mil (3.81mm), 200mil (5.08mm), 250mil (6.35mm), 275mil (6.985mm), 300mil (7.62mm), 500mil (12.7mm) PCB Size: ≤400mm X 500mm
Solder Mask: Green, Black, Blue, Yellow, Red Etc. Copper Weight: 0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
Surface Finish: Bare Copper, HASL, ENIG, OSP, Immersin Tin, Immersion Silver, Pure Gold Plated Etc..
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TMM13i High Frequency Printed Circuit Board 60mil 1.524mm Rogers Higher DK12.85 RF PCB With Immersion Gold

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)

 

General Description

This type of high frequency PCB is made on Rogers TMM13i 60mil substrate. It’s a double sided board with immersion gold on pads, half ounces copper starts ending with 1oz copper. Green solder mask is printed on top side. The boards are manufactured as per IPC class 2 standard and 100% electrical tested before shipment. Every 25 boards are vacuum-packed for delivery.

 

PCB Specifications

PCB SIZE 100 x 100mm=1up
BOARD TYPE Double sided PCB
Number of Layers 2 layers
Surface Mount Components YES
Through Hole Components NO
LAYER STACKUP copper ------- 17um(0.5 oz)+plate TOP layer
TMM13i 1.524mm
copper ------- 17um(0.5 oz) + plate BOT Layer
TECHNOLOGY  
Minimum Trace and Space: 4 mil / 5 mil
Minimum / Maximum Holes: 0.35 mm / 2.0 mm
Number of Different Holes: 8
Number of Drill Holes: 1525
Number of Milled Slots: 3
Number of Internal Cutouts: no
Impedance Control: no
Number of Gold finger: 0
BOARD MATERIAL  
Glass Epoxy: TMM13i 1.524mm
Final foil external: 1.0 oz
Final foil internal: N/A
Final height of PCB: 1.6mm ±0.1
PLATING AND COATING  
Surface Finish Immersion gold, 67%
Solder Mask Apply To: Top Layer
Solder Mask Color: Green
Solder Mask Type: LPI
CONTOUR/CUTTING Routing
MARKING  
Side of Component Legend Component Side
Colour of Component Legend White
Manufacturer Name or Logo: Kuangshun
VIA Plated through hole(PTH), minimum size 0.35mm.
FLAMIBILITY RATING 94V-0
DIMENSION TOLERANCE  
Outline dimension: 0.0059"
Board plating: 0.0029"
Drill tolerance: 0.002"
TEST 100% Electrical Test prior shipment
TYPE OF ARTWORK TO BE SUPPLIED email file, Gerber RS-274-X, PCBDOC etc
SERVICE AREA Worldwide, Globally.

 

TMM13i High Frequency Printed Circuit Board 60mil 1.524mm Rogers Higher DK12.85 RF PCB With Immersion Gold 0

 

Typical Applications:

1. Chip testers

2. Dielectric polarizers and lenses

3. Filters and coupler

4. Global Positioning Systems Antennas

5. Patch Antennas

6. Power amplifiers and combiners

7. RF and microwave circuitry

8. Satellite communication systems

 

Our PCB Capability(TMM13i)

PCB Material: Ceramic, Hydrocarbon, Thermoset Polymer Composites
Designation: TMM13i
Dielectric constant: 12.85
Layer count: Double Layer, Multilayer, Hybrid PCB
Copper weight: 0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
PCB thickness: 15mil (0.381mm), 20mil (0.508mm), 25mil (0.635mm), 30mil(0.762mm), 50mil (1.27mm), 60mil (1.524mm), 75mil(1.905mm), 100mil (2.54mm), 125mil (3.175mm), 150mil (3.81mm), 200mil (5.08mm), 250mil (6.35mm), 275mil (6.985mm), 300mil (7.62mm), 500mil (12.7mm)
PCB size: ≤400mm X 500mm
Solder mask: Green, Black, Blue, Yellow, Red etc.
Surface finish: Bare copper, HASL, ENIG, OSP, Immersin tin, Immersion silver, Pure gold plated etc..

 

Data Sheet of TMM13i

Property TMM13i Direction Units Condition Test Method
Dielectric Constant,εProcess 12.85±0.35 Z   10 GHz IPC-TM-650 2.5.5.5
Dielectric Constant,εDesign 12.2 - - 8GHz to 40 GHz Differential Phase Length Method
Dissipation Factor (process) 0.0019 Z - 10 GHz IPC-TM-650 2.5.5.5
Thermal Coefficient of dielectric constant -70 - ppm/°K -55-125 IPC-TM-650 2.5.5.5
Insulation Resistance >2000 - Gohm C/96/60/95 ASTM D257
Volume Resistivity - - Mohm.cm - ASTM D257
Surface Resistivity - - Mohm - ASTM D257
Electrical Strength(dielectric strength) 213 Z V/mil - IPC-TM-650 method 2.5.6.2
Thermal Properties
Decompositioin Temperature(Td) 425 425 TGA - ASTM D3850
Coefficient of Thermal Expansion - x 19 X ppm/K 0 to 140 ASTM E 831 IPC-TM-650, 2.4.41
Coefficient of Thermal Expansion - Y 19 Y ppm/K 0 to 140 ASTM E 831 IPC-TM-650, 2.4.41
Coefficient of Thermal Expansion - Z 20 Z ppm/K 0 to 140 ASTM E 831 IPC-TM-650, 2.4.41
Thermal Conductivity - Z W/m/K 80 ASTM C518
Mechanical Properties
Copper Peel Strength after Thermal Stress 4.0 (0.7) X,Y lb/inch (N/mm) after solder float 1 oz. EDC IPC-TM-650 Method 2.4.8
Flexural Strength (MD/CMD) - X,Y kpsi A ASTM D790
Flexural Modulus (MD/CMD) - X,Y Mpsi A ASTM D790
Physical Properties
Moisture Absorption (2X2) 1.27mm (0.050") 0.16 - % D/24/23 ASTM D570
3.18mm (0.125") 0.13
Specific Gravity 3 - - A ASTM D792
Specific Heat Capacity - - J/g/K A Calculated
Lead-Free Process Compatible YES - - - -

 

Contact Details
Bicheng Electronics Technology Co., Ltd

Contact Person: i.deng

Tel: +8613481420915

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