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Rogers 4003 Low PIM 400mmx500mm Rogers PCB Board ENIG Surface Finish
  • name
  • name

Rogers 4003 Low PIM 400mmx500mm Rogers PCB Board ENIG Surface Finish

MOQ: 1PCS
Price: USD9.99-99.99
Standard Packaging: Vacuum bags+Cartons
Delivery Period: 8-9 working days
Payment Method: T/T
Supply Capacity: 5000PCS per month
Details Information
Product Description
Detail Information
Place of Origin
CHINA
Brand Name
Bicheng
Certification
UL, ISO9001, IATF16949
Model Number
BIC-132.V1.0
Base Material:
Hydrocarbon Ceramic Laminates
Layer Count:
Double Layer, Multilayer, Hybrid PCB
PCB Thickness:
12.7mil (0.323mm), 16.7mil (0.424mm), 20.7mil(0.526mm), 32.7mil (0.831mm), 60.7mil(1.542mm)
PCB Size:
≤400mm X 500mm
Solder Mask:
Green, Black, Blue, Yellow, Red Etc.
Copper Weight:
0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
Surface Finish:
Bare Copper, HASL, ENIG, OSP, Immersion Tin Etc..
Highlight:

400mmx500mm Rogers PCB Board

,

Low PIM Rogers PCB Board

,

Low PIM ENIG Surface Finish PCB

Product Description

 

Double Layer Rogers PCB Built on 32.7mil RO4003C LoPro Reverse Treated Foil for Cellular Base Station Antennas

 

RO4003C LoPro laminates use a proprietary Rogers' technology that allows reverse treated foil to bond to standard RO4003C dielectric. This results in a laminate with low conductor loss for improved insertion loss and signal integrity while maintaining all other desirable attributes of the standard RO4003C laminate system.

 

Features and Benefits:

RO4003C materials are reinforced hydrocarbon/ceramic laminates with very low profile reverse treated foil.

1. Lower insertion loss

2. Low PIM

3. Increased signal integrity

4. High circuit density

 

Low Z-axis coefficient of thermal expansion

1. Multi-layer board capability

2. Design flexibility

 

Lead-free process compatible

1. High temperature processing

2. Meets environmental concerns

 

CAF resistant

 

Our PCB Capability (RO4003C LoPro)

Our PCB Capability (RO4003C LoPro)
PCB Material: Hydrocarbon Ceramic Laminates
Designation: RO4003C LoPro
Dielectric constant: 3.38±0.05
Layer count: Double Layer, Multilayer, Hybrid PCB
Copper weight: 0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
PCB thickness: 12.7mil (0.323mm), 16.7mil (0.424mm), 20.7mil(0.526mm), 32.7mil (0.831mm), 60.7mil(1.542mm)
PCB size: ≤400mm X 500mm
Solder mask: Green, Black, Blue, Yellow, Red etc.
Surface finish: Bare copper, HASL, ENIG, OSP, Immersion tin etc..

 

Some Typical Applications:

1. Digital applications such as servers, routers, and high speed back planes

2. Cellular base station antennas and power amplifiers

3. LNB’s for direct broadcast satellites

4. RF Identification Tags

 

Typical Properties of RO4003C LoPro

RO4003C LoPro
Property Typical Value Direction Units Condition Test Method
Dielectric Constant, Process 3.38 ± 0.05 z -- 10 GHz/23°C IPC-TM-650 2.5.5.5 Clamped Stripline
Dielectric Constant, Design 3.5 z -- 8 to 40 GHz Differential Phase Length Method
Dissipation Factor tan, 0.0027 0.0021 z -- 10 GHz/23°C 2.5 GHz/23°C IPC-TM-650 2.5.5.5
Thermal Coeffifi cient of r 40 z ppm/°C -50°C to 150°C IPC-TM-650 2.5.5.5
Volume Resistivity 1.7 X 1010   MΩ•cm COND A IPC-TM-650 2.5.17.1
Surface Resistivity 4.2 X 109   MΩ COND A IPC-TM-650 2.5.17.1
Electrical Strength 31.2(780) z KV/mm(V/mil) 0.51mm(0.020”) IPC-TM-650 2.5.6.2
Tensile Modulus 26889(3900) Y MPa(kpsi) RT ASTM D638
Tensile Strength 141(20.4) Y MPa(kpsi) RT ASTM D638
Flexural Strength 276(40)   MPa(kpsi)   IPC-TM-650 2.4.4
Dimensional Stability <0.3 X,Y mm/m(mils/inch) after etch +E2/150°C IPC-TM-650 2.4.39A
Coeffifi cient of Thermal Expansion 11 x ppm/°C -55 to 288°C IPC-TM-650 2.1.41
14 y
46 z
Tg >280   °C TMA A IPC-TM-650 2.4.24.3
Td 425   °C TGA   ASTM D3850
Thermal Conductivity 0.64   W/m/°K 80°C ASTM C518
Moisture Absorption 0.06   % 48 hrs immersion 0.060” sample Temperature 50°C ASTM D570
Density 1.79   gm/cm3 23°C ASTM D792
Copper Peel Strength 1.05(6.0)   N/mm(pli) after solder float 1 oz. TC Foil IPC-TM-650 2.4.8
Flammability N/A       UL 94
Lead-Free Process Compatible Yes        

 

Rogers 4003 Low PIM 400mmx500mm Rogers PCB Board ENIG Surface Finish 0

 

Tags: 

RO4003C LoPro Rogers PCB Board,  

8mil Rogers PCB Board,  

0.5oz Rogers PCB Board

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products
PRODUCTS DETAILS
Products

RF PCB Board

Rogers PCB Board

PTFE PCB Board

High TG PCB

Multi Layer PCB

Taconic PCB

HDI PCB Board

High Speed PCB

Impedance Controlled PCB

Flexible PCB Board

FR4 PCB Board

PCB Stencil

Metal Core PCB
Rogers 4003 Low PIM 400mmx500mm Rogers PCB Board ENIG Surface Finish
  • name
  • name
Rogers 4003 Low PIM 400mmx500mm Rogers PCB Board ENIG Surface Finish
MOQ: 1PCS
Price: USD9.99-99.99
Standard Packaging: Vacuum bags+Cartons
Delivery Period: 8-9 working days
Payment Method: T/T
Supply Capacity: 5000PCS per month
Detail Information
Product Description
Detail Information
Place of Origin
CHINA
Brand Name
Bicheng
Certification
UL, ISO9001, IATF16949
Model Number
BIC-132.V1.0
Base Material:
Hydrocarbon Ceramic Laminates
Layer Count:
Double Layer, Multilayer, Hybrid PCB
PCB Thickness:
12.7mil (0.323mm), 16.7mil (0.424mm), 20.7mil(0.526mm), 32.7mil (0.831mm), 60.7mil(1.542mm)
PCB Size:
≤400mm X 500mm
Solder Mask:
Green, Black, Blue, Yellow, Red Etc.
Copper Weight:
0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
Surface Finish:
Bare Copper, HASL, ENIG, OSP, Immersion Tin Etc..
Minimum Order Quantity:
1PCS
Price:
USD9.99-99.99
Packaging Details:
Vacuum bags+Cartons
Delivery Time:
8-9 working days
Payment Terms:
T/T
Supply Ability:
5000PCS per month
Highlight

400mmx500mm Rogers PCB Board

,

Low PIM Rogers PCB Board

,

Low PIM ENIG Surface Finish PCB

Product Description

 

Double Layer Rogers PCB Built on 32.7mil RO4003C LoPro Reverse Treated Foil for Cellular Base Station Antennas

 

RO4003C LoPro laminates use a proprietary Rogers' technology that allows reverse treated foil to bond to standard RO4003C dielectric. This results in a laminate with low conductor loss for improved insertion loss and signal integrity while maintaining all other desirable attributes of the standard RO4003C laminate system.

 

Features and Benefits:

RO4003C materials are reinforced hydrocarbon/ceramic laminates with very low profile reverse treated foil.

1. Lower insertion loss

2. Low PIM

3. Increased signal integrity

4. High circuit density

 

Low Z-axis coefficient of thermal expansion

1. Multi-layer board capability

2. Design flexibility

 

Lead-free process compatible

1. High temperature processing

2. Meets environmental concerns

 

CAF resistant

 

Our PCB Capability (RO4003C LoPro)

Our PCB Capability (RO4003C LoPro)
PCB Material: Hydrocarbon Ceramic Laminates
Designation: RO4003C LoPro
Dielectric constant: 3.38±0.05
Layer count: Double Layer, Multilayer, Hybrid PCB
Copper weight: 0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
PCB thickness: 12.7mil (0.323mm), 16.7mil (0.424mm), 20.7mil(0.526mm), 32.7mil (0.831mm), 60.7mil(1.542mm)
PCB size: ≤400mm X 500mm
Solder mask: Green, Black, Blue, Yellow, Red etc.
Surface finish: Bare copper, HASL, ENIG, OSP, Immersion tin etc..

 

Some Typical Applications:

1. Digital applications such as servers, routers, and high speed back planes

2. Cellular base station antennas and power amplifiers

3. LNB’s for direct broadcast satellites

4. RF Identification Tags

 

Typical Properties of RO4003C LoPro

RO4003C LoPro
Property Typical Value Direction Units Condition Test Method
Dielectric Constant, Process 3.38 ± 0.05 z -- 10 GHz/23°C IPC-TM-650 2.5.5.5 Clamped Stripline
Dielectric Constant, Design 3.5 z -- 8 to 40 GHz Differential Phase Length Method
Dissipation Factor tan, 0.0027 0.0021 z -- 10 GHz/23°C 2.5 GHz/23°C IPC-TM-650 2.5.5.5
Thermal Coeffifi cient of r 40 z ppm/°C -50°C to 150°C IPC-TM-650 2.5.5.5
Volume Resistivity 1.7 X 1010   MΩ•cm COND A IPC-TM-650 2.5.17.1
Surface Resistivity 4.2 X 109   MΩ COND A IPC-TM-650 2.5.17.1
Electrical Strength 31.2(780) z KV/mm(V/mil) 0.51mm(0.020”) IPC-TM-650 2.5.6.2
Tensile Modulus 26889(3900) Y MPa(kpsi) RT ASTM D638
Tensile Strength 141(20.4) Y MPa(kpsi) RT ASTM D638
Flexural Strength 276(40)   MPa(kpsi)   IPC-TM-650 2.4.4
Dimensional Stability <0.3 X,Y mm/m(mils/inch) after etch +E2/150°C IPC-TM-650 2.4.39A
Coeffifi cient of Thermal Expansion 11 x ppm/°C -55 to 288°C IPC-TM-650 2.1.41
14 y
46 z
Tg >280   °C TMA A IPC-TM-650 2.4.24.3
Td 425   °C TGA   ASTM D3850
Thermal Conductivity 0.64   W/m/°K 80°C ASTM C518
Moisture Absorption 0.06   % 48 hrs immersion 0.060” sample Temperature 50°C ASTM D570
Density 1.79   gm/cm3 23°C ASTM D792
Copper Peel Strength 1.05(6.0)   N/mm(pli) after solder float 1 oz. TC Foil IPC-TM-650 2.4.8
Flammability N/A       UL 94
Lead-Free Process Compatible Yes        

 

Rogers 4003 Low PIM 400mmx500mm Rogers PCB Board ENIG Surface Finish 0

 

Tags: 

RO4003C LoPro Rogers PCB Board,

8mil Rogers PCB Board,

0.5oz Rogers PCB Board

Bicheng Electronics Technology Co., Ltd
6-11C Shidai Jingyuan,Fuyong, Baoan, Shenzhen, Guangdong, China 518103
Tel: 86-755-27374946
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