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Rogers 4003 Low PIM 400mmx500mm Rogers PCB Board ENIG Surface Finish

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Kevin, Received and tested the boards - thanks very much. These are perfect, exactly what we needed. rgds Rich

—— Rich Rickett

Ruth, I got the PCB today, and they are just perfect. Please stay a little patience, my next order is coming soon. Kind regards from Hamburg Olaf

—— Olaf Kühnhold

Hi Natalie. It was perfect, I attach some pictures for your reference. And I send you next 2 projects to budget. Thanks a lot again

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Kevin, Thanks, they were perfectly made, and work well. As promised, here are the links for my latest project, using the PCBs you manufactured for me: Regards, Daniel

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Rogers 4003 Low PIM 400mmx500mm Rogers PCB Board ENIG Surface Finish

Large Image : Rogers 4003 Low PIM 400mmx500mm Rogers PCB Board ENIG Surface Finish

Product Details:

Place of Origin:	CHINA
Brand Name:	Bicheng
Certification:	UL, ISO9001, IATF16949
Model Number:	BIC-132.V1.0

Payment & Shipping Terms:

Minimum Order Quantity:	1PCS
Price:	USD9.99-99.99
Packaging Details:	Vacuum bags+Cartons
Delivery Time:	8-9 working days
Payment Terms:	T/T
Supply Ability:	5000PCS per month

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Detailed Product Description

Base Material:	Hydrocarbon Ceramic Laminates	Layer Count:	Double Layer, Multilayer, Hybrid PCB
PCB Thickness:	12.7mil (0.323mm), 16.7mil (0.424mm), 20.7mil(0.526mm), 32.7mil (0.831mm), 60.7mil(1.542mm)	PCB Size:	≤400mm X 500mm
Solder Mask:	Green, Black, Blue, Yellow, Red Etc.	Copper Weight:	0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
Surface Finish:	Bare Copper, HASL, ENIG, OSP, Immersion Tin Etc..
High Light:	400mmx500mm Rogers PCB Board , Low PIM Rogers PCB Board , Low PIM ENIG Surface Finish PCB

Double Layer Rogers PCB Built on 32.7mil RO4003C LoPro Reverse Treated Foil for Cellular Base Station Antennas

RO4003C LoPro laminates use a proprietary Rogers' technology that allows reverse treated foil to bond to standard RO4003C dielectric. This results in a laminate with low conductor loss for improved insertion loss and signal integrity while maintaining all other desirable attributes of the standard RO4003C laminate system.

Rogers 4003 Low PIM 400mmx500mm Rogers PCB Board ENIG Surface Finish 0

Features and Benefits:

RO4003C materials are reinforced hydrocarbon/ceramic laminates with very low profile reverse treated foil.

1. Lower insertion loss

2. Low PIM

3. Increased signal integrity

4. High circuit density

Low Z-axis coefficient of thermal expansion

1. Multi-layer board capability

2. Design flexibility

Lead-free process compatible

1. High temperature processing

2. Meets environmental concerns

CAF resistant

Rogers 4003 Low PIM 400mmx500mm Rogers PCB Board ENIG Surface Finish 1

Our PCB Capability (RO4003C LoPro)

Our PCB Capability (RO4003C LoPro)
PCB Material:	Hydrocarbon Ceramic Laminates
Designation:	RO4003C LoPro
Dielectric constant:	3.38±0.05
Layer count:	Double Layer, Multilayer, Hybrid PCB
Copper weight:	0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
PCB thickness:	12.7mil (0.323mm), 16.7mil (0.424mm), 20.7mil(0.526mm), 32.7mil (0.831mm), 60.7mil(1.542mm)
PCB size:	≤400mm X 500mm
Solder mask:	Green, Black, Blue, Yellow, Red etc.
Surface finish:	Bare copper, HASL, ENIG, OSP, Immersion tin etc..

Some Typical Applications:

1. Digital applications such as servers, routers, and high speed back planes

2. Cellular base station antennas and power amplifiers

3. LNB’s for direct broadcast satellites

4. RF Identification Tags

Typical Properties of RO4003C LoPro

RO4003C LoPro
Property	Typical Value	Direction	Units	Condition	Test Method
Dielectric Constant, Process	3.38 ± 0.05	z	--	10 GHz/23°C	IPC-TM-650 2.5.5.5 Clamped Stripline
Dielectric Constant, Design	3.5	z	--	8 to 40 GHz	Differential Phase Length Method
Dissipation Factor tan,	0.0027 0.0021	z	--	10 GHz/23°C 2.5 GHz/23°C	IPC-TM-650 2.5.5.5
Thermal Coeffifi cient of r	40	z	ppm/°C	-50°C to 150°C	IPC-TM-650 2.5.5.5
Volume Resistivity	1.7 X 10¹⁰		MΩ•cm	COND A	IPC-TM-650 2.5.17.1
Surface Resistivity	4.2 X 10⁹		MΩ	COND A	IPC-TM-650 2.5.17.1
Electrical Strength	31.2(780)	z	KV/mm(V/mil)	0.51mm(0.020”)	IPC-TM-650 2.5.6.2
Tensile Modulus	26889(3900)	Y	MPa(kpsi)	RT	ASTM D638
Tensile Strength	141(20.4)	Y	MPa(kpsi)	RT	ASTM D638
Flexural Strength	276(40)		MPa(kpsi)		IPC-TM-650 2.4.4
Dimensional Stability	<0.3	X,Y	mm/m(mils/inch)	after etch +E2/150°C	IPC-TM-650 2.4.39A
Coeffifi cient of Thermal Expansion	11	x	ppm/°C	-55 to 288°C	IPC-TM-650 2.1.41
	14	y
	46	z
Tg	>280		°C TMA	A	IPC-TM-650 2.4.24.3
Td	425		°C TGA		ASTM D3850
Thermal Conductivity	0.64		W/m/°K	80°C	ASTM C518
Moisture Absorption	0.06		%	48 hrs immersion 0.060” sample Temperature 50°C	ASTM D570
Density	1.79		gm/cm³	23°C	ASTM D792
Copper Peel Strength	1.05(6.0)		N/mm(pli)	after solder float 1 oz. TC Foil	IPC-TM-650 2.4.8
Flammability	N/A				UL 94
Lead-Free Process Compatible	Yes