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RT/Duroid 6035HTC 10mil Rogers PCB Board High Frequency For Filters

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Kevin, Received and tested the boards - thanks very much. These are perfect, exactly what we needed. rgds Rich

—— Rich Rickett

Ruth, I got the PCB today, and they are just perfect. Please stay a little patience, my next order is coming soon. Kind regards from Hamburg Olaf

—— Olaf Kühnhold

Hi Natalie. It was perfect, I attach some pictures for your reference. And I send you next 2 projects to budget. Thanks a lot again

—— Sebastian Toplisek

Kevin, Thanks, they were perfectly made, and work well. As promised, here are the links for my latest project, using the PCBs you manufactured for me: Regards, Daniel

—— Daniel Ford

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RT/Duroid 6035HTC 10mil Rogers PCB Board High Frequency For Filters

Large Image : RT/Duroid 6035HTC 10mil Rogers PCB Board High Frequency For Filters

Product Details:

Place of Origin:	CHINA
Brand Name:	Bicheng
Certification:	UL, ISO9001, IATF16949
Model Number:	BIC-125.V1.0

Payment & Shipping Terms:

Minimum Order Quantity:	1PCS
Packaging Details:	Vacuum bags+Cartons
Delivery Time:	8-9 working days
Payment Terms:	T/T
Supply Ability:	5000PCS per month

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Detailed Product Description

Base Material:	Ceramic-filled PTFE Composites	Layer Count:	Double Layer, Multilayer, Hybrid PCB
PCB Thickness:	10mil (0.254mm), 20mil(0.508mm), 30mil (0.762mm), 60mil(1.524mm)	PCB Size:	≤400mm X 500mm
Solder Mask:	Green, Black, Blue, Yellow, Red Etc.	Copper Weight:	0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
Surface Finish:	Bare Copper, HASL, ENIG, OSP Etc..
High Light:	10mil Rogers PCB Board , Ceramic Filled PTFE Rogers PCB Board , Multilayer Rogers PCB Board

Double Sided Rogers High Frequency PCB Built On 10mil RT/duroid 6035HTC With Immersion Gold for Filters

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)

RT/duroid 6035HTC high frequency circuit materials of Rogers Corporation are ceramic filled PTFE composites for use in high power RF and microwave applications. With a thermal conductivity of almost 2.4 times the standard RT/duroid 6000 products, and copper foil (electrodeposited and reverse treat) with excellent long term thermal stability, RT/duroid 6035HTC laminates are an exceptional choice for high power applications.

Features/Benefits:

1. High Thermal conductivity

Improved dielectric heat dissipation enables lower operating temperatures for high power applications

2. Low loss tangent

Excellent high frequency performance

3. Thermally stable low profile and reverse treat copper foil

Lower insertion loss and excellent thermal stability of traces

4. Advanced filler system

Improved drill ability and extended tool life compared to alumina containing circuit materials

Some Typical Applications:

1. High Power RF and Microwave Amplifiers

2.Power amplifiers, Couplers, Filters

3.Combiners, Power Dividers

PCB Capability (RT/duroid 6035HTC)

PCB Material:	Ceramic-filled PTFE composites
Designation:	RT/duroid 6035HTC
Dielectric constant:	3.50±0.05
Layer count:	Double Layer, Multilayer, Hybrid PCB
Copper weight:	0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
PCB thickness:	10mil (0.254mm), 20mil(0.508mm), 30mil (0.762mm), 60mil(1.524mm)
PCB size:	≤400mm X 500mm
Solder mask:	Green, Black, Blue, Yellow, Red etc.
Surface finish:	Bare copper, HASL, ENIG, OSP etc..

RT/Duroid 6035HTC 10mil Rogers PCB Board High Frequency For Filters 0

Data Sheet of RT/duroid 6035HTC

RT/duroid 6035HTC Typical Value
Property	RT/duorid 6035HTC	Direction	Units	Condition	Test Method
Dielectric Constant,εProcess	3.50±0.05	Z		10 GHz/23℃	IPC-TM-650 2.5.5.5 Clamped Stripline
Dielectric Constant,εProcess	3.50±0.05	Z		10 GHz/23℃	IPC-TM-650 2.5.5.5 Clamped Stripline
Dielectric Constant,εDesign	3.6	Z		8 GHz - 40 GHz	Differential Phase Length Method
Dielectric Constant,εDesign	3.6	Z		8 GHz - 40 GHz	Differential Phase Length Method
Dissipation Factor	0.0013	Z		10 GHz/23℃	IPC-TM-650 2.5.5.5
Thermal Coefficient of ε	-66	Z	ppm/℃	-50 ℃to 150℃	mod IPC-TM-650, 2.5.5.5
Volume Resistivity	108		MΩ.cm	A	IPC-TM-650, 2.5.17.1
Surface Resistivity	108		MΩ	A	IPC-TM-650, 2.5.17.1
Dimensional Stability	-0.11 -0.08	CMD MD	mm/m (mils/inch)	0.030" 1oz EDC foil Thickness after etch '+E4/105	IPC-TM-650 2.4.39A
Tensile Modulus	329 244	MD CMD	kpsi	40 hrs @23℃/50RH	ASTM D638
Moisure Absorption	0.06		%	D24/23	IPC-TM-650 2.6.2.1 ASTM D570
Coefficient of Thermal Expansion (-50 ℃to 288 ℃)	19 19 39	X Y Z	ppm/℃	23℃ / 50% RH	IPC-TM-650 2.4.41
Thermal Conductivity	1.44		W/m/k	80℃	ASTM C518
Density	2.2		gm/cm³	23℃	ASTM D792
Copper Peel Stength	7.9		pli	20 sec. @288 ℃	IPC-TM-650 2.4.8
Flammability	V-0				UL 94
Lead-Free Process Compatible	Yes