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|Base Material:||Ceramic-filled Laminates Reinforced With Woven Fiberglass||Layer Count:||Double Layer, Multilayer, Hybrid PCB|
|PCB Thickness:||10mil (0.254mm), 20mil(0.508mm), 30mil (0.762mm), 60mil(1.524mm)||PCB Size:||≤400mm X 500mm|
|Solder Mask:||Green, Black, Blue, Yellow, Red Etc.||Copper Weight:||0.5oz (17 µm), 1oz (35µm), 2oz (70µm)|
|Surface Finish:||Bare Copper, HASL, ENIG, OSP Etc..|
30mil Printed Circuit Boards,
Wireless Telecommunications Rogers PCB Board,
RO3203 Printed Circuit Boards
Rogers RO3203 Double Sided 30mil High Frequency PCB With Green Mask For Wireless Telecommunications Systems
(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)
RO3203 High Frequency Circuit Materials of Rogers Corporation are ceramic-filled laminates reinforced with woven fiberglass. This material is engineered to offer exceptional electrical performance and mechanical stability at competitive prices. The dielectric constant of RO3203 High Frequency Circuit Materials is 3.02. This, along with a dissipation factor of 0.0016, extends the useful frequency range beyond 40 GHz.
RO3203 laminates combine the surface smoothness of a non-woven PTFE laminate, for finer line etching tolerances, with the rigidity of a woven-glass PTFE laminate. These materials can be fabricated into printed circuit boards using
standard PTFE circuit board processing techniques. Available cladding options are 0.5, 1 or 2 oz./ft2 (17, 35, 70 micron thick) electrodeposited copper foil. These laminates are manufactured under an ISO 9002 certified quality system.
1. Woven glass reinforcement improves rigidity for easier handling.
2. Low dielectric loss for high frequency performance can be used in applications exceeding 20 GHz.
3. Low in-plane expansion coefficient (matched to copper) is suitable for use with epoxy glass multilayer board hybrid designs and reliable surface mounted assemblies.
4. Surface smoothness allows for finer line etching tolerances
1. Base Station Infrastructure
2. Remote Meter Readers
3. Wireless Telecommunications Systems
PCB Capability (RO3203)
|PCB Material:||Ceramic-filled Laminates Reinforced with Woven Fiberglass|
|Layer count:||Double Layer, Multilayer, Hybrid PCB|
|Copper weight:||0.5oz (17 µm), 1oz (35µm), 2oz (70µm)|
|PCB thickness:||10mil (0.254mm), 20mil(0.508mm), 30mil (0.762mm), 60mil(1.524mm)|
|PCB size:||≤400mm X 500mm|
|Solder mask:||Green, Black, Blue, Yellow, Red etc.|
|Surface finish:||Bare copper, HASL, ENIG, OSP etc..|
Data Sheet of RO3203
|RO3203 Typical Value|
|Dielectric Constant,εProcess||3.02±0.04||Z||10 GHz/23℃||IPC-TM-650 22.214.171.124|
|Dissipation Factor,tanδ||0.0016||Z||10 GHz/23℃||IPC-TM-650 126.96.36.199|
|Thermal Conductivity||0.47 (3.2)||W/mK||Float 100℃||ASTM C518|
|Volume Resistivity||107||MΩ.cm||A||ASTM D257|
|Surface Resistivity||107||MΩ||A||ASTM D257|
|Dimensional Stability||0.08||X, Y||mm/m +E2/150||after etch||IPC-TM-650 188.8.131.52|
|Tensile Modulus||X Y||kpsi||RT||ASTM D638|
|Flexural Modulus||400 300||X Y||kpsi||A||ASTM D790|
|Tensile Strength||12.5 13||X Y||kpsi||RT||ASTM D638|
|Flexural Strength||9 8||X Y||kpsi||A||ASTM D790|
|Moisure Absorption||<0.1||%||D24/23||IPC-TM-650 184.108.40.206|
|Coefficient of Thermal Expansion||58 13||Z X,Y||ppm/℃||-50 ℃to 288℃||ASTM D3386|
|Copper Peel Stength||10 (1.74)||lbs/in (N/mm)||After solder||IPC-TM-650 2.4.8|
|Lead-Free Process Compatible||Yes|