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4 Layer 0.4mm FR4 Thin PCB Board With Immersion Gold For Data Acquisition

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4 Layer 0.4mm FR4 Thin PCB Board With Immersion Gold For Data Acquisition

MOQ:	1PCS
Price:	USD9.99-99.99
Standard Packaging:	Vacuum bags+Cartons
Delivery Period:	8-9 working days
Payment Method:	T/T
Supply Capacity:	5000PCS per month

Details Information

Product Description

Detail Information

Place of Origin

CHINA

Brand Name

Bicheng

Certification

UL, ISO9001, IATF16949

Model Number

BIC-498.V1.0

Base Material:

Layer Count:

4 Layers

PCB Thickness:

0.4mm +/-0.04

PCB Size:

181 X 121mm=8UP

Solder Mask:

Green

Silkscreen:

White

Copper Weight:

Surface Finish:

Immersion Gold

Highlight:

FR4 Thin PCB Board

0.4mm Thin PCB Board

0.4mm Thin Circuit Board

Product Description

Thin PCB 4 Layer Thiner Circuit Board Built On 0.4mm FR-4 With Immersion Gold for Data Acquisition

1.1 General description

This is a type of 4 layer PCB board built on FR-4 Tg135 substrate for the application of Data Acquisition Systems. It's 0.4 mm thick with white silkscreen on green solder mask and immersion gold on pads. The base material is from ITEQ supplying 8 up boards per panel. They're fabricated per IPC 6012 Class 2 using supplied Gerber data. Each 50 panels are packed for shipment.

1.2 Features and benifits

It's suitable for handheld and consumer applications.

Good oxidation resistance and good heat dissipation.

Comprehensive equipment management and maintenance and process control

UL, ISO9001, IATF16949 certified

Money-saving, Worry-saving and Labor-saving

No MOQ, low cost for prototypes and small runs quantity.

1.3 Applications

GPS Navigator,

Access Control System,

Antenna Wireless,

1.4 Parameter and data sheet

Number of Layers	4
Board Type	Multilayer PCB
Board Size	181 x 121mm=8UP
Board Thickness	0.4mm +/-0.04
Board Material	FR-4
Board Material Supplier	ITEQ
Tg Value of Board Material	135℃

PTH Cu thickness	≥20 um (See hole wall details)
Inner Iayer Cu thicknes	17 um (0.5 oz)
Surface Cu thickness	35 um (1oz)

Solder Mask Type and Model No.	LPSM, PSR-2000GT600D
Solder Mask Supplier	TAIYO
Solder Mask Colour	Green
Number of Solder Masks	2
Thickness of Solder Mask	13um

Type of Silkscreen Ink	IJR-4000 MW300
Supplier of Silkscreen	TAIYO
Color of Silkscreen	White
Number of Silkscreen	2

Mininum Trace (mil)	4 mil
Minimum Gap(mil)	4 mil

Surface Finish	Immersion gold
RoHS Required	Yes
Warpage	0.18%

Thermal Shock Test	Pass, 288±5℃,10 seconds, 3 cycles. No delamination, no blistering.
Solderablity Test	Pass, 255±5℃,5 seconds Wetting Area Least 95%
Function	100% Pass electrical test
Workmanship	Compliance with IPC-A-600H & IPC-6012C Class 2
Drill table (mm)	T1: 0.600
	T2: 0.890
	T3: 1.025
	T4: 1.125
	T5: 3.500

Tags:

Products

MOQ:	1PCS
Price:	USD9.99-99.99
Standard Packaging:	Vacuum bags+Cartons
Delivery Period:	8-9 working days
Payment Method:	T/T
Supply Capacity:	5000PCS per month

Detail Information

Product Description

Detail Information

Place of Origin

CHINA

Brand Name

Bicheng

Certification

UL, ISO9001, IATF16949

Model Number

BIC-498.V1.0

Base Material:

FR-4

Layer Count:

4 Layers

PCB Thickness:

0.4mm +/-0.04

PCB Size:

181 X 121mm=8UP

Solder Mask:

Green

Silkscreen:

White

Copper Weight:

1oz

Surface Finish:

Immersion Gold

Minimum Order Quantity:

1PCS

Price:

USD9.99-99.99

Packaging Details:

Vacuum bags+Cartons

Delivery Time:

8-9 working days

Payment Terms:

T/T

Supply Ability:

5000PCS per month

Highlight

FR4 Thin PCB Board

0.4mm Thin PCB Board

0.4mm Thin Circuit Board

Product Description

Thin PCB 4 Layer Thiner Circuit Board Built On 0.4mm FR-4 With Immersion Gold for Data Acquisition

1.1 General description

1.2 Features and benifits

It's suitable for handheld and consumer applications.

Good oxidation resistance and good heat dissipation.

Comprehensive equipment management and maintenance and process control

UL, ISO9001, IATF16949 certified

Money-saving, Worry-saving and Labor-saving

No MOQ, low cost for prototypes and small runs quantity.

1.3 Applications

GPS Navigator,

Access Control System,

Antenna Wireless,

1.4 Parameter and data sheet

Number of Layers	4
Board Type	Multilayer PCB
Board Size	181 x 121mm=8UP
Board Thickness	0.4mm +/-0.04
Board Material	FR-4
Board Material Supplier	ITEQ
Tg Value of Board Material	135℃

PTH Cu thickness	≥20 um (See hole wall details)
Inner Iayer Cu thicknes	17 um (0.5 oz)
Surface Cu thickness	35 um (1oz)

Solder Mask Type and Model No.	LPSM, PSR-2000GT600D
Solder Mask Supplier	TAIYO
Solder Mask Colour	Green
Number of Solder Masks	2
Thickness of Solder Mask	13um

Type of Silkscreen Ink	IJR-4000 MW300
Supplier of Silkscreen	TAIYO
Color of Silkscreen	White
Number of Silkscreen	2

Mininum Trace (mil)	4 mil
Minimum Gap(mil)	4 mil

Surface Finish	Immersion gold
RoHS Required	Yes
Warpage	0.18%

Thermal Shock Test	Pass, 288±5℃,10 seconds, 3 cycles. No delamination, no blistering.
Solderablity Test	Pass, 255±5℃,5 seconds Wetting Area Least 95%
Function	100% Pass electrical test
Workmanship	Compliance with IPC-A-600H & IPC-6012C Class 2
Drill table (mm)	T1: 0.600
	T2: 0.890
	T3: 1.025
	T4: 1.125
	T5: 3.500

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4 Layer 0.4mm FR4 Thin PCB Board With Immersion Gold For Data Acquisition

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