4-Layer Rogers RT/duroid 6202 Hybrid PCB 1.014mm Gold Plated Circuit Board

This 4-layer hybrid Rogers RT/duroid 6202 PCB is engineered for high-reliability microwave and RF multilayer circuit applications. It adopts a hybrid stackup of 0.127mm RT/duroid 6202 dielectric, 0.381mm PP bonding sheet and 0.4mm FR-4 substrate, forming a total pressed thickness of 1.014mm. The PCB features 0.5oz inner copper and 1oz outer copper, paired with immersion gold surface finishing, blue solder mask and white silkscreen for stable conductivity and clear circuit marking. Built to strict IPC-6012 Class 3 standards, it adopts 25μm hole copper thickness, resin plug holes and electroplated filled via-in-pad technology to ensure outstanding structural integrity. Equipped with process edges, positioning holes and optical alignment points, this 110mm × 35mm high-frequency PCB supports precise assembly and mass production, ideal for aerospace, radar and precision communication systems.

PCB Specifications

PCB Stack-up

RT/duroid 6202 Material Introduction

RT/duroid 6202 is a professional low-loss high-frequency laminate from Rogers, customized for complex microwave structures and high-precision multilayer RF circuits. Reinforced with optimized woven glass fiber, the material features extremely low thermal shrinkage and outstanding dimensional stability. It supports tight dielectric constant and thickness control, alongside an ultra-low thermal coefficient of dielectric constant. These core properties ensure highly stable electrical performance under wide temperature variations, effectively reducing high-frequency signal attenuation and maintaining consistent signal integrity during long-term operation.

Different from ordinary high-frequency substrates, RT/duroid 6202 delivers excellent mechanical compatibility with copper foil, with matched in-plane expansion coefficient and minimal etch shrinkage. It avoids positioning deviation during mass production and removes the need for secondary double etching, greatly improving manufacturing accuracy and yield rate. Supporting flexible copper foil options ranging from 0.5oz to 2oz, the material adapts to flat, non-planar and complex multilayer stackup designs. It has become a mainstream high-reliability substrate for aerospace, defense, radar and precision satellite communication equipment.

Core Performance Features

Ultra-Low High-Frequency Loss: Delivers excellent signal transmission efficiency with minimal attenuation, fully adapting to high-frequency microwave and millimeter-wave circuit operation requirements.

Superior Dimensional Stability: Low thermal expansion rate and ultra-low etch shrinkage maintain precise circuit positioning tolerance, supporting high-precision fine-line production.

Stable Electrical Parameters: Features tight Dk tolerance and ultra-low temperature drift, ensuring consistent dielectric performance in complex temperature fluctuation scenarios.

High-Reliability Plug Hole Process: Resin plug holes and electroplated filled via-in-pad eliminate hollow vias, enhancing structural tightness, conductivity stability and soldering reliability.

Hybrid Structure Advantage: Combines RT/duroid 6202 high-frequency performance with FR-4 cost efficiency, balancing professional RF performance and commercial cost-effectiveness.

Typical Applications

• Phased Array Antennas
• Ground Based and Airborne Radar Systems
• Global Positioning System Antennas
• Power Backplanes
• High Reliability Complex Multilayer Circuits
• Commercial Airline Collision Avoidance Systems
• Beam Forming Networks

Conclusion

Built with premium Rogers RT/duroid 6202 high-frequency dielectric material, advanced filled-via processing, and IPC Class 3 graded manufacturing, this 4-layer hybrid PCB delivers consistent low-loss electrical performance, precise dimensional stability, and superior thermal reliability. It effectively overcomes the signal loss and accuracy limitations of conventional FR-4 boards under high-frequency operating conditions. By combining professional microwave-grade substrate with cost-effective FR-4 structure, this hybrid construction optimizes overall performance and affordability, serving as a highly reliable solution for aerospace, satellite communication, precision radar, and complex multilayer RF circuit applications.