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4 Layer 2oz RO4003C Multi Layer PCB High Frequency For Automotive Radar

Certification
China Bicheng Electronics Technology Co., Ltd certification
China Bicheng Electronics Technology Co., Ltd certification
Kevin, Received and tested the boards - thanks very much. These are perfect, exactly what we needed. rgds Rich

—— Rich Rickett

Ruth, I got the PCB today, and they are just perfect. Please stay a little patience, my next order is coming soon. Kind regards from Hamburg Olaf

—— Olaf Kühnhold

Hi Natalie. It was perfect, I attach some pictures for your reference. And I send you next 2 projects to budget. Thanks a lot again

—— Sebastian Toplisek

Kevin, Thanks, they were perfectly made, and work well. As promised, here are the links for my latest project, using the PCBs you manufactured for me: Regards, Daniel

—— Daniel Ford

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4 Layer 2oz RO4003C Multi Layer PCB High Frequency For Automotive Radar

4 Layer 2oz RO4003C Multi Layer PCB High Frequency For Automotive Radar
4 Layer 2oz RO4003C Multi Layer PCB High Frequency For Automotive Radar 4 Layer 2oz RO4003C Multi Layer PCB High Frequency For Automotive Radar 4 Layer 2oz RO4003C Multi Layer PCB High Frequency For Automotive Radar 4 Layer 2oz RO4003C Multi Layer PCB High Frequency For Automotive Radar 4 Layer 2oz RO4003C Multi Layer PCB High Frequency For Automotive Radar

Large Image :  4 Layer 2oz RO4003C Multi Layer PCB High Frequency For Automotive Radar

Product Details:
Place of Origin: CHINA
Brand Name: Bicheng
Certification: UL, ISO9001, IATF16949
Model Number: BIC-075.V1.0
Payment & Shipping Terms:
Minimum Order Quantity: 1PCS
Price: USD9.99-99.99
Packaging Details: Vacuum bags+Cartons
Delivery Time: 8-9 working days
Payment Terms: T/T
Supply Ability: 5000PCS per month
Detailed Product Description
Base Material: RO4350B + FR4; RO4003C + FR4; F4B + FR4; Duroid/RT5880 + RO4350B; Duroid/RT5880 + FR4 Layer Count: 4 Layer, 6 Layer, Multilayer
PCB Thickness: 1.0-5.0mm PCB Size: ≤400mm X 500mm
Solder Mask: Green, Red, Blue, Black, Yellow Copper Weight: 0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
Surface Finish: Bare Copper, HASL, ENIG, Immersion Tin, OSP
High Light:

Automotive Radar Multi Layer PCB

,

2oz Multi Layer PCB

,

2oz Four Layer PCB

 

4 Layer High Frequency PCB Board Bulit On Rogers 12mil RO4003C and FR-4 for Automotive Radar and Sensors

(PCB’s are custom-made products, the picture and parameters shown are just for reference)

 

Hi Everyone,

Today, we’re going to talk about 4-layer high frequency PCB made on 12mil RO4003C and FR-4 combined.

 

The board is designed as a 4-layer structure, because 4-layer PCB is relatively simple and inexpensive, which is helpful to open up a new market.

 

Let’s see today’s first board.

4 Layer 2oz RO4003C Multi Layer PCB High Frequency For Automotive Radar 0

 

Viewing from stack up, we can see the 1st layer to the 2nd layer and 4th layer to 3rd layer are 12mil core of RO4003C, the core has fixed thickness which is very important to the electrical length of RF lines on the circuit board, and the rest are FR-4 materials. Copper weight on inner layer and outer layer is 1 ounce.

 

The 2nd board FR-4 is moved to layer 3 and layer 4. According to the actual applications, the thickness of dielectric material and FR-4 can be adjusted.

4 Layer 2oz RO4003C Multi Layer PCB High Frequency For Automotive Radar 1

 

The applications of 12mil RO4003C hybrid PCB is wide, such as Modular oscilloscope, antenna combiner, balanced amplifier, 4G antenna etc.

 

The advantages of 12mil RO4003C hybrid PCB are reflected in following 3 points:

1) RO4003C exhibits a stable dielectric constant over a broad frequency range. This makes it an ideal substrate for broadband applications.

2) Reducing signal loss in high frequency application meets the development needs of communication technology.

3) Cost reduced over stack-ups with all low loss material;

 

4 Layer 2oz RO4003C Multi Layer PCB High Frequency For Automotive Radar 2

 

At present, the mature mixed pressing materials are as follows:

RO4350B + FR4;

RO4003C + FR4;

F4B + FR4;

RT/duroid 5880 + RO4350B

RT/duroid 5880 + FR4

 

PCB Capability
PCB Type: Hybrid PCB, Mixed PCB
Mixed type: RO4350B + FR4;
  RO4003C + FR4;
  F4B + FR4;
  Duroid/RT5880 + RO4350B
  Duroid/RT5880 + FR4
Solder mask: Green, Red, Blue, Black, Yellow
Layer count: 4 Layer, 6 Layer, Multilayer
Copper weight: 0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
PCB thickness: 1.0-5.0mm
PCB size: ≤400mm X 500mm
Surface finish: Bare copper, HASL, ENIG, Immersion tin, OSP
   

 

At the same time, we are able to supply blind via board, buried via board and HDI board. All the PCB's of our company will go through AOI test, open and short circuit test, solderability test and 288 ℃ thermal stress test to ensure high quality PCB shipped to your hands.

 

Thank you for your reading. You’re welcome to contact us for your RF PCB enquiries.

 

Appendix: Data Sheet of RO4003C

RO4003C Typical Value
Property RO4003C Direction Units Condition Test Method
Dielectric Constant,εProcess 3.38±0.05 Z   10 GHz/23℃ IPC-TM-650 2.5.5.5 Clamped Stripline
Dielectric Constant,εDesign 3.55 Z   8 to 40 GHz Differential Phase Length Method
Dissipation Factortan,δ 0.0027
0.0021
Z   10 GHz/23℃
2.5 GHz/23℃
IPC-TM-650 2.5.5.5
Thermal Coefficient of ε +40 Z ppm/℃ -50℃to 150℃ IPC-TM-650 2.5.5.5
Volume Resistivity 1.7 x 1010   MΩ.cm COND A IPC-TM-650 2.5.17.1
Surface Resistivity 4.2 x 109   COND A IPC-TM-650 2.5.17.1
Electrical Strength 31.2(780) Z Kv/mm(v/mil) 0.51mm(0.020") IPC-TM-650 2.5.6.2
Tensile Modulus 19,650(2,850)
19,450(2,821)
X
Y
MPa(ksi) RT ASTM D 638
Tensile Strength 139(20.2)
100(14.5)
X
Y
MPa(ksi) RT ASTM D 638
Flexural Strength 276
(40)
  MPa
(kpsi)
  IPC-TM-650 2.4.4
Dimensional Stability <0.3 X,Y mm/m
(mil/inch)
after etch+E2/150℃ IPC-TM-650 2.4.39A
Coefficient of Thermal Expansion 11
14
46
X
Y
Z
ppm/℃ -55℃to288℃ IPC-TM-650 2.4.41
Tg >280   ℃ TMA A IPC-TM-650 2.4.24.3
Td 425   ℃ TGA   ASTM D 3850
Thermal Conductivity 0.71   W/M/oK 80℃ ASTM C518
Moisture Absorption 0.06   % 48hrs immersion 0.060"
sample Temperature 50℃
ASTM D 570
Density 1.79   gm/cm3 23℃ ASTM D 792
Copper Peel Stength 1.05
(6.0)
  N/mm
(pli)
after solder float 1 oz.
EDC Foil
IPC-TM-650 2.4.8
Flammability N/A       UL 94
Lead-free Process Compatible Yes        

 

Contact Details
Bicheng Electronics Technology Co., Ltd

Contact Person: i.deng

Tel: +8613481420915

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