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Multi Layer B Rogers 4350 3 Layer 1.88mm Immersion Gold PCB For Wireless Booster

China Bicheng Electronics Technology Co., Ltd certification
China Bicheng Electronics Technology Co., Ltd certification
Kevin, Received and tested the boards - thanks very much. These are perfect, exactly what we needed. rgds Rich

—— Rich Rickett

Ruth, I got the PCB today, and they are just perfect. Please stay a little patience, my next order is coming soon. Kind regards from Hamburg Olaf

—— Olaf Kühnhold

Hi Natalie. It was perfect, I attach some pictures for your reference. And I send you next 2 projects to budget. Thanks a lot again

—— Sebastian Toplisek

Kevin, Thanks, they were perfectly made, and work well. As promised, here are the links for my latest project, using the PCBs you manufactured for me: Regards, Daniel

—— Daniel Ford

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Multi Layer B Rogers 4350 3 Layer 1.88mm Immersion Gold PCB For Wireless Booster

Multi Layer B Rogers 4350 3 Layer 1.88mm Immersion Gold PCB For Wireless Booster
Multi Layer B Rogers 4350 3 Layer 1.88mm Immersion Gold PCB For Wireless Booster Multi Layer B Rogers 4350 3 Layer 1.88mm Immersion Gold PCB For Wireless Booster Multi Layer B Rogers 4350 3 Layer 1.88mm Immersion Gold PCB For Wireless Booster

Large Image :  Multi Layer B Rogers 4350 3 Layer 1.88mm Immersion Gold PCB For Wireless Booster

Product Details:
Place of Origin: CHINA
Brand Name: Bicheng
Certification: UL, ISO9001, IATF16949
Model Number: BIC-063.V1.0
Payment & Shipping Terms:
Minimum Order Quantity: 1PCS
Price: USD9.99-99.99
Packaging Details: Vacuum bags+Cartons
Delivery Time: 8-9 working days
Payment Terms: T/T
Supply Ability: 5000PCS per month
Detailed Product Description
Base Material: RO4350B
High Light:

ENIG Multi Layer PCB

,

1.88mm Multi Layer PCB

,

1.88mm 3 Layer PCB Board

 

3 Layer High Frequency PCB Built On 60mil RO4350B and 6.6mil RO4350B with ENIG for Wireless Booster

(PCB’s are custom-made products, the picture and parameters shown are just for reference)

 

Multilayer high frequency PCBs are made from all high frequency material inclusive of prepreg adhesive. For example, a 4-layer RO4350B PCB is a compound of 2 cores of RO4350B substrates. As is known to all, there’re 8 cores in RO4350B family, i.e. 4mil (0.101mm) to 60mil (1.524mm).

 

Multi Layer B Rogers 4350 3 Layer 1.88mm Immersion Gold PCB For Wireless Booster 0

 

So it’s very interesting that stack-up of 4 layers can be done in many different ways.

 

This 3-Layer high frequency PCB is built on 2 cores of RO4350B and one layer of copper is etched off, left 3 layers on.

 

Multi Layer B Rogers 4350 3 Layer 1.88mm Immersion Gold PCB For Wireless Booster 1

 

The structure is one sheet of 60mil RO4350B plus 4mil RO4450F prepreg and combined 6.6mil RO4350B. The board is a square with 110mm x 110mm, with immersion gold finishes on pads. They’re 20 pieces packed for shipment and used for wireless booster.

 

Following is the actual value in engineering manufacture.

 

Multi Layer B Rogers 4350 3 Layer 1.88mm Immersion Gold PCB For Wireless Booster 2

 

Features and benefits

1) Excellent high frequency performance due to low dielectric tolerance and loss;

2) Reducing signal loss in high frequency application meets the development needs of communication technology;

3) Professional and experienced engineers check your production files

4) Hassle-free, one-to-one after-sales service;

5) UL, ISO14001, IAFT16949 certified factory.

 

Applications

Amplifier, Antenna combiner, Frequency converter, Trunk amplifier, RF module, Power splitter, Low Noise Block, 4G antenna

 

Multi Layer B Rogers 4350 3 Layer 1.88mm Immersion Gold PCB For Wireless Booster 3

 

Parameter and data sheet

PCB SIZE 110 x 110mm=1PCS
BOARD TYPE Multilayer PCB
Number of Layers 3 layers
Surface Mount Components YES
Through Hole Components YES
LAYER STACKUP copper ------- 35µm(1 oz)+plate TOP layer
RO4350B 60mil (1.524mm)
copper ------- 35µm
Prepreg RO4450F 4mil (0.102mm)
copper ------- 0µm
RO4350B 6.6mil (0.167mm)
copper ------- 35µm(1oz) + plate BOT Layer
TECHNOLOGY  
Minimum Trace and Space: 4 mil / 4 mil
Minimum / Maximum Holes: 0.4 mm / 3.5 mm
Number of Different Holes: 12
Number of Drill Holes: 124
Number of Milled Slots: 0
Number of Internal Cutouts: NO
Impedance Control: no
Number of Gold finger: 0
BOARD MATERIAL  
Glass Epoxy: RO4350B Tg280℃, er<3.48, Rogers Corp
Final foil external: 1 oz
Final foil internal: 1 oz
Final height of PCB: 1.88 mm ±10%
PLATING AND COATING  
Surface Finish Immersion gold
Solder Mask Apply To: N/A
Solder Mask Color: N/A
Solder Mask Type: N/A
CONTOUR/CUTTING Routing
MARKING  
Side of Component Legend N/A
Colour of Component Legend N/A
Manufacturer Name or Logo: N/A
VIA Plated through hole(PTH), minimum size 0.4mm.
FLAMIBILITY RATING UL 94-V0 Approval MIN.
DIMENSION TOLERANCE  
Outline dimension: 0.0059"
Board plating: 0.0029"
Drill tolerance: 0.002"
TEST 100% Electrical Test prior shipment
TYPE OF ARTWORK TO BE SUPPLIED email file, Gerber RS-274-X, PCBDOC etc
SERVICE AREA Worldwide, Globally.

 

Our Quality Policy

Bicheng has developed series of management procedures and approaches to assure that PCBs are in compliance with the customers' requirements, inclusive of selection of the vendors, work in progress (WIP) inspection, outgoing delivery inspection and customer service etc.

 

Evaluation and Audit of Suppliers

Suppliers have to be evaluated by Bicheng. In addition, Bicheng will appraise and rank suppliers every year to guarantee the materials supplied are meeting Bicheng’s requirements. Furthermore, Bicheng continuously develop suppliers and supervise them to improve their quality and environment management basing on the systems of ISO9001 & ISO14001.

 

Contract Evaluation

Bicheng shall review and verify customer's requirements to make sure that we have the capability to satisfy customers' requirements including specifications, delivery and other demands prior to accepting an order.

 

Making, audit and control of manufacturing data.

When customers' design data and specifications are provided to our market department, Bicheng has to verify all the requirements. Then, convert the design data into manufacturing data by CAM. Finally, a manufacturing instruction (MI) is generated according to the real manufacturing process and technologies for manufacturing department as the basis for actual fabrication. MI must be reviewed by independent engineers and QA engineers before issue.

 

Incoming Material Quality Control

All materials have to be inspected before warehousing. We established a series of strict inspection procedure and instruction to control the incoming materials. Furthermore, various precise inspecting instruments and apparatus guarantee the capability to judge the material good or not. We issue material with first in first out principle, and give out “alarm” for the material that will reach the shelf life to ensure the materials are used up before expiry.

 

Contact Details
Bicheng Electronics Technology Co., Ltd

Contact Person: Ms. Ivy Deng

Tel: 86-755-27374946

Fax: 86-755-27374848

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