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|Base Material:||RO4730G3 30mil||Layer Count:||2 Layers|
|PCB Thickness:||1.1mm||PCB Size:||110mm X 100mm = 1 Type = 1 Piece|
|Copper Weight:||Outer Layer 35 μm||Surface Finish:||Immersion Gold|
Rogers RO4730 High Frequency PCB,
30mil High Frequency PCB,
Immersion Gold High Frequency PCB
Rogers High Frequency PCB Built on RO4730G3 30mil 0.762mm DK3.0 With Immersion Gold for Wireless Telecommunications Antennas
(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)
Rogers RO4730G3 antenna grade laminates are reliable, low-cost alternative to the conventional PTFE-based laminates. It has the mechanical and electrical properties that antenna designers need. The materials have a dielectric constant of 3.0 and a loss tangent of 0.0022 measured at 2.5 GHz when using LoPro Reverse Treated EDC foil. These values allow antenna designers to realize substantial gain values while minimizing signal loss. Materials are available with demonstrated low PIM performance, with values better than -160dBc.
RO4730G3 materials are compatible with conventional epoxy and high temperature lead-free solder processing. It does not require the special treatment needed on traditional PTFE-based laminates for plated through holes preparation. Multi-layer can be achieved using RO4450F bondply at 175 ℃. The resin systems of RO4730G3 are designed to provide the properties sought after by antenna designers. The glass transition temperature exceeds 280oC, leading to a low Z-axis CTE, excellent plated through holes reliability, and lead free solder processability.
Typical application is cellular base station antennas.
This is a type of double sided RF PCB built on 0.762mm (30mil) RO4730G3 for the application of Wireless telecommunications antennas.
Base material: RO4730G3 30mil (0.762mm)
Dielectric constant: 3.0+/-0.5
Layer count: 2 layers
Type: Through holes
Format: 110mm x 100mm = 1 type = 1 piece
Surface finish: Immersion gold
Copper weight: Outer layer 35 μm
Solder mask | Legend: Green | White
Final PCB height: 1.1 mm
Standard: IPC 6012 Class 2
Packing: 20 pieces are packed for shipment.
Lead time: 7 working days
Shelf life: 6 months
Data Sheet of Rogers 4730 (RO4730G3)
|RO4730G3 Typical Value|
|Dielectric Constant,εProcess||3.0±0.5||Z||10 GHz 23℃||IPC-TM-650 18.104.22.168|
|Dielectric Constant,εDesign||2.98||Z||1.7 GHz to 5 GHz||Differential Phase Length Method|
|Dissipation Factor,tanδ||0.0028||Z||10 GHz 23℃||IPC-TM-650 22.214.171.124|
|Thermal Coefficient of ε||+34||Z||ppm/℃||-50 ℃to 150℃||IPC-TM-650 126.96.36.199|
|Dimensional Stability||<0.4||X, Y||mm/m||after etech +E2/150 ℃||IPC-TM-650 2.4.39A|
|Volume Resistivity (0.030")||9 X 107||MΩ.cm||COND A||IPC-TM-650 188.8.131.52|
|Surface Resistivity (0.030")||7.2 X 105||MΩ||COND A||IPC-TM-650 184.108.40.206|
|PIM||-165||dBc||50 ohm 0.060"||43 dBm 1900 MHz|
|Electrical Strength (0.030")||730||Z||V/mil||IPC-TM-650 220.127.116.11|
|Flexural Strength MD||181 (26.3)||Mpa (kpsi)||RT||ASTM D790|
|Moisure Absorption||0.093||-||%||48/50||IPC-TM-650 18.104.22.168 ASTM D570|
|Thermal Conductivity||0.45||Z||W/mK||50℃||ASTM D5470|
|Coefficient of Thermal Expansion||15.9
|ppm/℃||-50 ℃to 288℃||IPC-TM-650 22.214.171.124|
|Copper Peel Stength||4.1||pli||1oz,LoPro EDC||IPC-TM-650 2.4.8|
|Lead-free Process Compatible||Yes|