We Are Your RF PCB Solution Provider!

Rogers PCB, Taconic PCB, Arlon PCB, F4B PCB

ISO9001, ISO14001, IATF 16949 certified

Home ProductsRogers PCB Board

RT/Duroid 6002 60mil 1.524mm DK2.94 Rogers PCB Board For Airline Collision Avoidance

Certification
China Bicheng Electronics Technology Co., Ltd certification
China Bicheng Electronics Technology Co., Ltd certification
Kevin, Received and tested the boards - thanks very much. These are perfect, exactly what we needed. rgds Rich

—— Rich Rickett

Ruth, I got the PCB today, and they are just perfect. Please stay a little patience, my next order is coming soon. Kind regards from Hamburg Olaf

—— Olaf Kühnhold

Hi Natalie. It was perfect, I attach some pictures for your reference. And I send you next 2 projects to budget. Thanks a lot again

—— Sebastian Toplisek

Kevin, Thanks, they were perfectly made, and work well. As promised, here are the links for my latest project, using the PCBs you manufactured for me: Regards, Daniel

—— Daniel Ford

I'm Online Chat Now

RT/Duroid 6002 60mil 1.524mm DK2.94 Rogers PCB Board For Airline Collision Avoidance

RT/Duroid 6002 60mil 1.524mm DK2.94 Rogers PCB Board For Airline Collision Avoidance
RT/Duroid 6002 60mil 1.524mm DK2.94 Rogers PCB Board For Airline Collision Avoidance RT/Duroid 6002 60mil 1.524mm DK2.94 Rogers PCB Board For Airline Collision Avoidance RT/Duroid 6002 60mil 1.524mm DK2.94 Rogers PCB Board For Airline Collision Avoidance

Large Image :  RT/Duroid 6002 60mil 1.524mm DK2.94 Rogers PCB Board For Airline Collision Avoidance

Product Details:
Place of Origin: CHINA
Brand Name: Bicheng
Certification: UL, ISO9001, IATF16949
Model Number: BIC-054.V1.0
Payment & Shipping Terms:
Minimum Order Quantity: 1PCS
Price: USD9.99-99.99
Packaging Details: Vacuum bags+Cartons
Delivery Time: 8-9 working days
Payment Terms: T/T
Supply Ability: 5000PCS per month
Detailed Product Description
Base Material: RT/Duroid 6002 Layer Count: 2 Layers
PCB Thickness: 1.6mm PCB Size: 99 X 99 Mm=1PCS
Copper Weight: 0.5oz Surface Finish: Immersion Gold
High Light:

60mil Rogers PCB Board

,

Airline Collision Avoidance Rogers PCB Board

,

Rogers Immersion Gold PCB Board

 

Rogers HF PCB Built on RT/Duroid 6002 60mil 1.524mm DK2.94 with Immersion Gold for Commercial Airline Collision Avoidance

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)

 

Rogers RT/duroid 6002 microwave material was the first low loss and low dielectric constant laminate to offer superior electrical and mechanical properties essential in designing complex microwave structures which are mechanically reliable and electrically stable.

 

The thermal coefficient of dielectric constant is extremely low from -55℃ to +150℃ which provides the designers of filters, oscillators and delay lines the electrical stability needed in today's demanding applications.

 

A low Z axis coefficient of thermal expansion(CTE) ensures excellent reliability of plated through holes. RT/duroid 6002 materials have been successfully temperature cycled (-55℃ TO 125℃) for over 5000 cycles without a single via failure.

 

Excellent dimensional stability (0.2 to 0.5 mils/inch) is achieved by matching the X and Y coefficient of expansion to copper. This often eliminates double etching to achieve tight positional tolerances.


RT/Duroid 6002 60mil 1.524mm DK2.94 Rogers PCB Board For Airline Collision Avoidance 0

 

The low tensile modulus (X,Y) greatly reduces the stress applied to solder joints and allows the expansion of the laminate to be constrained by a minimum amount of low CTE metal (6 ppm/℃) further increasing surface mount reliability.

 

Applications particularly suited to the unique properties of RT/duroid 6002 material include flat and non-planar structures such antennas, complex mutli-layer circuits with inter-layer connections, and microwave circuits for aerospace designs in hostile environments.

 

 Typical applications:

1. Beam forming networks

2. Global positioning systems antennas

3. Phased array antennas

4. Power backplanes

  

PCB Specifications

PCB SIZE 99 x 99 mm=1PCS
BOARD TYPE Double sided PCB
Number of Layers 2 layers
Surface Mount Components YES
Through Hole Components NO
LAYER STACKUP copper ------- 18um(0.5 oz)+plate TOP layer
RT/duroid 1.524mm
copper ------- 18um(0.5 oz)+plate BOT layer
TECHNOLOGY  
Minimum Trace and Space: 4 mil / 4 mil
Minimum / Maximum Holes: 0.3 mm / 2.0mm
Number of Different Holes: 1
Number of Drill Holes: 3
Number of Milled Slots: 0
Number of Internal Cutouts: 0
Impedance Control: no
Number of Gold finger: 0
BOARD MATERIAL  
Glass Epoxy: RT/duroid 1.524mm
Final foil external: 1 oz
Final foil internal: 1 oz
Final height of PCB: 1.6 mm ±0.16
PLATING AND COATING  
Surface Finish Immersion gold (51.3% ) 0.05µm over 3µm nickel
Solder Mask Apply To: NO
Solder Mask Color: NO
Solder Mask Type: NO
CONTOUR/CUTTING Routing
MARKING  
Side of Component Legend NO
Colour of Component Legend NO
Manufacturer Name or Logo: NO
VIA Plated through hole(PTH), minimum size 0.3mm.
FLAMIBILITY RATING UL 94-V0 Approval MIN.
DIMENSION TOLERANCE  
Outline dimension: 0.0059"
Board plating: 0.0029"
Drill tolerance: 0.002"
TEST 100% Electrical Test prior shipment
TYPE OF ARTWORK TO BE SUPPLIED email file, Gerber RS-274-X, PCBDOC etc
SERVICE AREA Worldwide, Globally.

 

Data Sheet of Rogers 6002 (RT/duroid 6002)

RT/duroid 6002 Typical Value
Property RT/duroid 6002 Direction Units Condition Test Method
Dielectric Constant,εProcess 2.94±0.04 Z   10 GHz/23 IPC-TM-650 2.5.5.5
Dielectric Constant,εDesign 2.94     8GHz to 40 GHz Differential Phase Length Method
Dissipation Factor,tanδ 0.0012 Z   10 GHz/23 IPC-TM-650 2.5.5.5
Thermal Coefficient of ε +12 Z ppm/ 10 GHz 0-100 IPC-TM-650 2.5.5.5
Volume Resistivity 106 Z Mohm.cm A ASTM D 257
Surface Resistivity 107 Z Mohm A ASTM D 257
Tensile Modulus 828(120) X,Y MPa(kpsi) 23 ASTM D 638
Ultimate Stress 6.9(1.0) X,Y MPa(kpsi)
Ultimate Strain 7.3 X,Y %
Compressive Modulus 2482(360) Z MPa(kpsi)   ASTM D 638
Moisture Absorption 0.02   % D48/50 IPC-TM-650 2.6.2.1
ASTM D 570
Thermal Conductivity 0.6   W/m/k 80 ASTM C518
Coefficient of Thermal Expansion
(-55 to 288
)
16
16
24
X
Y
Z
ppm/ 23/50% RH IPC-TM-650 2.4.41
Td 500   TGA   ASTM D 3850
Density 2.1   gm/cm3   ASTM D 792
Specific Heat 0.93(0.22)   j/g/k
(BTU/ib/
OF)
  Calculated
Copper Peel 8.9(1.6)   Ibs/in.(N/mm)   IPC-TM-650 2.4.8
Flammability V-0       UL 94
Lead-free Process Compatible Yes        

 

RT/Duroid 6002 60mil 1.524mm DK2.94 Rogers PCB Board For Airline Collision Avoidance 1

 

Contact Details
Bicheng Electronics Technology Co., Ltd

Contact Person: i.deng

Tel: +8613481420915

Send your inquiry directly to us (0 / 3000)