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Product Details:
Payment & Shipping Terms:
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| Base Material: | RO3003 | Layer Count: | 2 Layers |
|---|---|---|---|
| PCB Size: | 100 X 100mm=1PCS | PCB Thickness: | 0.3mm |
| Copper Weight: | 1oz | ||
| High Light: | 1 Oz Copper Radar PCB,0.3mm Radar PCB,1 Oz Copper PCB |
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Rogers RO3003 High Frequency PCB 2-Layer Rogers 3003 10mil Circuit Board DK3.0 DF 0.001 Microwave PCB
(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)
Rogers RO3003 high frequency circuit materials are ceramic-filled PTFE composites intended for use in commercial microwave and RF applications. It was designed to offer exceptional electrical and mechanical stability at competitive prices. The mechanical properties are consistent. This allows the designer to develop multi-layer board designs without encountering warpages or reliability problems. RO3003 materials exhibit a coefficient of thermal expansion(CTE) in the X and Y axis of 17 ppm/℃. This expansion coefficient is matched to that of copper, which allows the material to exhibit excellent dimensional stability, with typical etch shrinkage, after etch and bake, of less than 0.5 mils per inch. The Z-axis CTE is 24 ppm/℃, which provides exceptional plated through-hole reliability, even in severe environments.
Typical applications:
1) Datalink on cable systems
2) Patch antenna for wireless communications
3) Power backplanes
4) Remote meter readers
PCB Specifications
| PCB SIZE | 100 x 100mm=1PCS |
| BOARD TYPE | Double sided PCB |
| Number of Layers | 2 layers |
| Surface Mount Components | NO |
| Through Hole Components | NO |
| LAYER STACKUP | copper ------- 35 um(1 oz) |
| RO3003 0.254mm | |
| copper ------- 35 um(1 oz) | |
| TECHNOLOGY | |
| Minimum Trace and Space: | 5mil / 5mil |
| Minimum / Maximum Holes: | 0.3mm / 0.8mm |
| Number of Different Holes: | N/A |
| Number of Drill Holes: | N/A |
| Number of Milled Slots: | N/A |
| Number of Internal Cutouts: | N/A |
| Impedance Control: | N/A |
| Number of Gold finger: | N/A |
| BOARD MATERIAL | |
| Glass Epoxy: | RO3003 0.254mm |
| Final foil external: | 1oz |
| Final foil internal: | N/A |
| Final height of PCB: | 0.3 mm ±0.1 |
| PLATING AND COATING | |
| Surface Finish | N/A |
| Solder Mask Apply To: | N/A |
| Solder Mask Color: | N/A |
| Solder Mask Type: | N/A |
| CONTOUR/CUTTING | Routing |
| MARKING | |
| Side of Component Legend | N/A |
| Colour of Component Legend | N/A |
| Manufacturer Name or Logo: | N/A |
| VIA | N/A |
| FLAMIBILITY RATING | UL 94-V0 Approval MIN. |
| DIMENSION TOLERANCE | |
| Outline dimension: | 0.0059" |
| Board plating: | 0.0029" |
| Drill tolerance: | 0.002" |
| TEST | N/A |
| TYPE OF ARTWORK TO BE SUPPLIED | email file, Gerber RS-274-X, PCBDOC etc |
| SERVICE AREA | Worldwide, Globally. |
Data Sheet of Rogers 3003 (RO3003)
| RO3003 Typical Value | |||||
| Property | RO3003 | Direction | Units | Condition | Test Method |
| Dielectric Constant,εProcess | 3.0±0.04 | Z | 10 GHz/23℃ | IPC-TM-650 2.5.5.5 Clamped Stripline | |
| Dielectric Constant,εDesign | 3 | Z | 8GHz to 40 GHz | Differential Phase Length Method | |
| Dissipation Factor,tanδ | 0.001 | Z | 10 GHz/23℃ | IPC-TM-650 2.5.5.5 | |
| Thermal Coefficient of ε | -3 | Z | ppm/℃ | 10 GHz -50℃to 150℃ | IPC-TM-650 2.5.5.5 |
| Dimensional Stability | 0.06 0.07 |
X Y |
mm/m | COND A | IPC-TM-650 2.2.4 |
| Volume Resistivity | 107 | MΩ.cm | COND A | IPC 2.5.17.1 | |
| Surface Resistivity | 107 | MΩ | COND A | IPC 2.5.17.1 | |
| Tensile Modulus | 930 823 |
X Y |
MPa | 23℃ | ASTM D 638 |
| Moisture Absorption | 0.04 | % | D48/50 | IPC-TM-650 2.6.2.1 | |
| Specific Heat | 0.9 | j/g/k | Calculated | ||
| Thermal Conductivity | 0.5 | W/M/K | 50℃ | ASTM D 5470 | |
| Coefficient of Thermal Expansion (-55 to 288℃) |
17 16 25 |
X Y Z |
ppm/℃ | 23℃/50% RH | IPC-TM-650 2.4.4.1 |
| Td | 500 | ℃ TGA | ASTM D 3850 | ||
| Density | 2.1 | gm/cm3 | 23℃ | ASTM D 792 | |
| Copper Peel Stength | 12.7 | Ib/in. | 1oz,EDC After Solder Float | IPC-TM 2.4.8 | |
| Flammability | V-0 | UL 94 | |||
| Lead-free Process Compatible | Yes | ||||
Contact Person: i.deng
Tel: +8613481420915
