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Product Details:
Payment & Shipping Terms:
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| Base Material: | RO3003 | Layer Count: | 2 Layers |
|---|---|---|---|
| PCB Size: | 100 X 100mm=1PCS | PCB Thickness: | 0.3mm |
| Copper Weight: | 1oz | ||
| High Light: | 1 Oz Copper Radar PCB,0.3mm Radar PCB,1 Oz Copper PCB |
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Rogers RO3003 High Frequency PCB 2-Layer Rogers 3003 10mil Circuit Board DK3.0 DF 0.001 Microwave PCB
(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)
Rogers RO3003 high-frequency circuit materials are ceramic-filled PTFE composites specifically designed for commercial microwave and RF applications. These materials offer exceptional electrical and mechanical stability while maintaining competitive prices. The consistent mechanical properties of RO3003 allow designers to develop multi-layer board designs without encountering warpage or reliability issues.
RO3003 materials exhibit a coefficient of thermal expansion (CTE) of 17 ppm/℃ in the X and Y axes. This CTE is matched to that of copper, ensuring excellent dimensional stability. After etching and baking processes, RO3003 materials typically experience minimal etch shrinkage of less than 0.5 mils per inch, further enhancing their dimensional stability.
Furthermore, RO3003 laminates have a Z-axis CTE of 24 ppm/℃. This characteristic contributes to exceptional plated through-hole reliability, even in harsh environments, ensuring robust and reliable performance.
Rogers RO3003 high-frequency circuit materials provide exceptional electrical and mechanical stability, making them ideal for applications such as datalink on cable systems, patch antennas for wireless communications, power backplanes, and remote meter readers.
PCB Specifications
| PCB SIZE | 100 x 100mm=1PCS |
| BOARD TYPE | Double sided PCB |
| Number of Layers | 2 layers |
| Surface Mount Components | NO |
| Through Hole Components | NO |
| LAYER STACKUP | copper ------- 35 um(1 oz) |
| RO3003 0.254mm | |
| copper ------- 35 um(1 oz) | |
| TECHNOLOGY | |
| Minimum Trace and Space: | 5mil / 5mil |
| Minimum / Maximum Holes: | 0.3mm / 0.8mm |
| Number of Different Holes: | N/A |
| Number of Drill Holes: | N/A |
| Number of Milled Slots: | N/A |
| Number of Internal Cutouts: | N/A |
| Impedance Control: | N/A |
| Number of Gold finger: | N/A |
| BOARD MATERIAL | |
| Glass Epoxy: | RO3003 0.254mm |
| Final foil external: | 1oz |
| Final foil internal: | N/A |
| Final height of PCB: | 0.3 mm ±0.1 |
| PLATING AND COATING | |
| Surface Finish | N/A |
| Solder Mask Apply To: | N/A |
| Solder Mask Color: | N/A |
| Solder Mask Type: | N/A |
| CONTOUR/CUTTING | Routing |
| MARKING | |
| Side of Component Legend | N/A |
| Colour of Component Legend | N/A |
| Manufacturer Name or Logo: | N/A |
| VIA | N/A |
| FLAMIBILITY RATING | UL 94-V0 Approval MIN. |
| DIMENSION TOLERANCE | |
| Outline dimension: | 0.0059" |
| Board plating: | 0.0029" |
| Drill tolerance: | 0.002" |
| TEST | N/A |
| TYPE OF ARTWORK TO BE SUPPLIED | email file, Gerber RS-274-X, PCBDOC etc |
| SERVICE AREA | Worldwide, Globally. |
Data Sheet of Rogers 3003 (RO3003)
| RO3003 Typical Value | |||||
| Property | RO3003 | Direction | Units | Condition | Test Method |
| Dielectric Constant,εProcess | 3.0±0.04 | Z | 10 GHz/23℃ | IPC-TM-650 2.5.5.5 Clamped Stripline | |
| Dielectric Constant,εDesign | 3 | Z | 8GHz to 40 GHz | Differential Phase Length Method | |
| Dissipation Factor,tanδ | 0.001 | Z | 10 GHz/23℃ | IPC-TM-650 2.5.5.5 | |
| Thermal Coefficient of ε | -3 | Z | ppm/℃ | 10 GHz -50℃to 150℃ | IPC-TM-650 2.5.5.5 |
| Dimensional Stability | 0.06 0.07 |
X Y |
mm/m | COND A | IPC-TM-650 2.2.4 |
| Volume Resistivity | 107 | MΩ.cm | COND A | IPC 2.5.17.1 | |
| Surface Resistivity | 107 | MΩ | COND A | IPC 2.5.17.1 | |
| Tensile Modulus | 930 823 |
X Y |
MPa | 23℃ | ASTM D 638 |
| Moisture Absorption | 0.04 | % | D48/50 | IPC-TM-650 2.6.2.1 | |
| Specific Heat | 0.9 | j/g/k | Calculated | ||
| Thermal Conductivity | 0.5 | W/M/K | 50℃ | ASTM D 5470 | |
| Coefficient of Thermal Expansion (-55 to 288℃) |
17 16 25 |
X Y Z |
ppm/℃ | 23℃/50% RH | IPC-TM-650 2.4.4.1 |
| Td | 500 | ℃ TGA | ASTM D 3850 | ||
| Density | 2.1 | gm/cm3 | 23℃ | ASTM D 792 | |
| Copper Peel Stength | 12.7 | Ib/in. | 1oz,EDC After Solder Float | IPC-TM 2.4.8 | |
| Flammability | V-0 | UL 94 | |||
| Lead-free Process Compatible | Yes | ||||
Contact Person: Ms. Ivy Deng
Tel: 86-755-27374946
Fax: 86-755-27374848
