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Bicheng Electronics Technology Co., Ltd Company Profile
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China Bicheng Electronics Technology Co., Ltd company profile 0

 

PCB Test

  • ·Automatic Optical Inspection
  • ·Differential Impedance / Single End Impedance
  • ·Flying Probe Net List Test
  • ·High Voltage Test
  • ·IPC Class 2 / IPC Class 3
  • ·Reliability Test
  • ·Solder-ability Test
  • ·Thermal Stress Test
  • ·TDR Testing

 

Available Base Materials

  • ·RO4350B, RO4003C, RO4730G3, RO4360G2, RO3003, RO3006, RO3010, RO3035, RO3203, RO3210;
  • ·RT/Duriod 5880; RT/Duriod 5870, RT/Duriod 6002, RT/Duroid 6010, RT/duroid 6035HTC;
  • ·TMM4, TMM10, Kappa 438;
  • ·TLF-35; RF-35TC, RF-60A, RF-60TC, RF-35A2; TLX-0, TLX-6, TLX-7, TLX-8; TLX-9, TLY-3, TLY-5;
  • ·PTFE F4B (DK2.2 DK2.65 DK2.85 DK2.94, DK3.0, DK3.2, DK3.38, DK3.5, DK4.0, DK4.4, DK6.15, DK10.2);
  • ·AD450, AD600, TC350;
  • ·Nelco N4000, N9350, N9240;
  •  FR-4 ( High Tg S1000-2M, TU-872 SLK, TU-768, IT-180A etc.), FR-4 High CTI>600V;
  •  Polyimide, PET;
  •  Aluminum base, Copper base
  • ·Hybrid PCB

 

Plating

  • ·Conductive Via Fill
  • ·Hard Gold Edge connector
  • ·HASL Standard
  • ·HASL Lead Free (RoHS)
  • ·Immersion Gold
  • ·Immersion Silver
  • ·Immersion Tin
  • ·Non-Conductive Via Fill
  • ·OSP
  • ·Plated Edges
  • ·Plated Radii (Castellation)
  • ·Plated Milling Cutouts
  • ·Non-Conductive Via Fill
History

BichengPCB is the brand of Shenzhen Bicheng Electronics Technology Co., Ltd. Its origins date back to 2003, when it was known as Bicheng Enterprise Company, specializing in blank printed circuit boards for single-sided and double-sided PCBs.

 

To meet growing market demand, the company began offering multilayer PCBs in 2008, with layer counts reaching up to 32 layers. In 2010, Bicheng introduced high-frequency materials for applications involving antennas, amplifiers, and radio products.

 

As the company evolved, metal-core PCBs and hybrid PCBs were successfully trialed and received high praise. In 2014, the company underwent restructuring and reform, with Bicheng taking on a new role within the organization—focusing on global market sales and after-sales services.

 

By 2020, Bicheng had completed a full range of integrated PCB products, including high-frequency/microwave PCBs, multi-layer/hybrid PCBs, metal-core PCBs, and flexible circuits.

 

Today, Bicheng’s products can be found in over 100 countries and regions around the world.

 

China Bicheng Electronics Technology Co., Ltd company profile 0

office building

 

 

Our Team

China Bicheng Electronics Technology Co., Ltd company profile 0

Every day, we strive to improve, keep progressing, and never stand still. We believe that teamwork is the key to success, and our commitment to the creative process only makes us stronger.

 

Guided by modern scientific management and real-time information sharing through network technology, we have created a highly efficient working environment. Our skilled manufacturing expertise helps equipment achieve its best performance. With our high-quality PCBs and flexible cooperation, you will experience professional, value-added service.

 

At Bicheng, your specific needs are met, while our success is driven by innovative products and a competitive edge.

 

 

PCB Capability

China Bicheng Electronics Technology Co., Ltd company profile 0


Factory Process Capability (2026)
Substrate Types Standard FR-4, High Tg FR-4, High Frequency Materials, Rigid Polyimide, AL2O3 Ceramic, AlN Ceramic etc.
Substrate Brands Shengyi, ITEQ, KB, Isola, Taiwan Union, Rogers Corp. Taconic, Wangling, etc
Board Types Rigid PCB, Hybrid PCB, HDI PCB, Heavy Copper, High Speed, High frequency etc.
Copper Clad Laminates(CCL) High Tg FR-4: S1000-2M, TU-872 SLK, TU-768, TU-883, IT-180A, FR408HR, 370HR, High CTI FR-4: S1600L, ST115 High speed: M6 (R5775G Core / R-5670 Prepreg)
Rogers Corp: RO4350B, RO4003C, RO4725JXR, RO4730G3, RO4360G2, RO4533, RO4534, RO4535, RO4830, RO4835, RO3003, RO3006, RO3010, RO3035, RO3203, RO3210; RT/Duriod 5880; RT/Duriod 5870, RT/Duriod 6002, RT/duroid 6006, RT/Duroid 6010.2LM, RT/duroid 6035HTC; RT/duroid 5880LZ, RT/duroid 6202; TMM3, TMM4, TMM6, TMM10, TMM10i, TMM13i, Kappa 438; AD250C, AD255C, AD300D, AD350A, AD450, AD600, AD1000, TC350; TC600; DiClad 880, DiClad 870, DiClad 527; IsoClad 917, IsoClad 933; CLTE-XT, CLTE-AT, CLTE-MW; CuClad 217, CuClad 233, CuClad 250.
Taconic: TLF-35; RF-35TC, RF-60A, RF-60TC, RF-35A2,RF-30, RF-35, RF-45, RF-10, TRF-45; TLX-0, TLX-6, TLX-7, TLX-8; TLX-9, TLY-3, TLY-5, TLY-5Z; CER-10; TSM-DS3
Wangling: F4BM217, F4BM220, F4BM233, F4BM245, F4BM255, F4BM265, F4BM275, F4BM294, F4BM300;
F4BME217, F4BME220, F4BME233, F4BME245, F4BME255, F4BME265, F4BME275, F4BME294, F4BME300;
F4BTM298, F4BTM300, F4BTM320, F4BTM350;
F4BTME298, F4BTME300, F4BTME320, F4BTME350;
TP300, TP440, TP600, TP615, TP960, TP1020, TP1100, TP1600, TP2000, TP2200, TP2500;
TF300, TF440, TF600, TF960, TF1020, TF1600;
F4BTMS220, F4BTMS233, F4BTMS255, F4BTMS265, F4BTMS294, F4BTMS300, F4BTMS350, F4BTMS430, F4BTMS450, F4BTMS615, F4BTMS1000;
TFA294, TFA300, TFA615, TFA1020;
WL-CT300, WL-CT330, WL-CT330Z, WL-CT338, WL-CT350, WL-CT440, WL-CT615.
Maximum Delivery Size 1200mm x 572 mm
Minimum Finished Board Thickness L≤2L: 0.15mm; 4L: 0.4mm
Maximum Finished Board Thickness 10.0 mm
Blind Buried Holes (Non-crossing) 0.1mm
Maximum Hole Aspect Ratio 15:01
Minimum Mechanical Drill Hole Diameter 0.1 mm
Through-hole Tolerance +/- 0.0762 mm
Press-fit Hole Tolerance +/- 0.05mm
Non-plated Copper Hole Tolerance +/- 0.05mm
Maximum Number of Layers 32
Internal and External Layer Maximum Copper Thickness 12Oz
Minimum Drill Hole Tolerance +/- 2mil
Minimum Layer-to-Layer Tolerance +/- 3mil
Minimum Line Width/Spacing 3mil/3mil
Minimum BGA Diameter 8mil
Impedance Tolerance < 50Ω ±5Ω; ≥50Ω±10%
Special Technology High density interconnection (HDI), Hybrid design/ mixed PCB, Blind/Buried vias, Resin filled / copper filled and capped, Copper coin embedded, Staircase PCB, Edge plated PCB, Heavy copper PCB, Half holes/castled Edge holes, Thick PCB etc
Surface Treatment Processes Leaded/Lead-free HASL, Immersion Gold, Immersion Silver, Immersion Tin, OSP, ENIG, ENEPIG, Pure gold, Carbon Ink, Peelable Mask, Gold Finger, etc.
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