RT duroid 6002 PCB Material High Frequency Laminates Copper Clad Sheet

The RT/duroid 6002 microwave material is a low-loss, low-dielectric-constant laminate that delivers superior electrical and mechanical properties, making it essential for the design of complex microwave structures that require both mechanical reliability and electrical stability.

It features an extremely low thermal coefficient of dielectric constant from -55°C to +150°C (-67°F to 302°F), providing filter, oscillator, and delay line designers with the electrical stability required for today’s demanding applications.

A low Z-axis coefficient of thermal expansion (CTE) ensures excellent plated through-hole reliability. RT/duroid 6002 materials have successfully endured over 5,000 temperature cycles from -55°C to 125°C (-67°F to 257°F) without a single via failure.

Excellent dimensional stability (0.2 to 0.5 mils/inch) is achieved by matching the X and Y coefficients of expansion to that of copper, often eliminating the need for double etching to maintain tight positional tolerances.

The low tensile modulus in the X and Y directions significantly reduces stress on solder joints and allows the laminate expansion to be constrained by a minimal amount of low-CTE metal (6 ppm/°C), further enhancing surface mount reliability.

Copper cladding options include ½ oz. to 2 oz./ft² electrodeposited copper, ½ oz. to 1 oz. reverse-treated electrodeposited copper, or ½ oz. to 2 oz./ft² rolled copper. Dielectric thicknesses range from 0.005" to 0.125" (0.13 to 3.18 mm). The laminate is also available with aluminum, brass, or copper plate cladding, as well as resistive foil options.

Features and Benefits

- Low loss — excellent high-frequency performance

- Excellent mechanical and electrical properties — reliable multilayer board constructions

- Extremely low thermal coefficient of dielectric constant — ideal for temperature-sensitive applications

- In-plane expansion coefficient matched to copper — enables more reliable surface-mounted assemblies and excellent dimensional stability

- Low Z-axis expansion — reliable plated through-holes

- Low outgassing — suitable for space applications

Typical Applications

- Phased array antennas

- Ground-based and airborne radar systems

- Global Positioning System (GPS) antennas

- Power backplanes

- High-reliability complex multilayer circuits

- Commercial airline collision avoidance systems

- Beam forming networks