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RT duroid 6202 PCB Material High Frequency Laminates Copper Clad Sheet
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RT duroid 6202 PCB Material High Frequency Laminates Copper Clad Sheet
  • name

RT duroid 6202 PCB Material High Frequency Laminates Copper Clad Sheet

MOQ: 1PCS
Price: USD9.99-99.99
Standard Packaging: Vacuum bags+Cartons
Delivery Period: 8-9 working days
Payment Method: T/T
Supply Capacity: 5000PCS per month
Details Information
Product Description
Detail Information
Place of Origin
CHINA
Brand Name
Bicheng
Certification
UL, ISO9001, IATF16949
Model Number
BIC-332.V1.0
Part Number:
RT Duroid 6202
Laminate Thickness:
0.005” (0.127mm) +/- 0.0005” 0.020” (0.508mm) +/- 0.0010” 0.030” (0.762mm) +/- 0.0010”
Laminate Size:
12”X 18”(305mm X 457mm) 24”X 18”(610mm X 457mm)
Copper Weight:
Electrodeposited Copper Foil ½ Oz. (18µm) HH/HH 1 Oz. (35µm) H1/H1 Rolled Copper Foil ½ Oz. (18µm) 5R/5R 1 Oz. (35µm) 1R/1R
Highlight:

RT duroid 6202 PCB material

,

high frequency copper clad laminate

,

duroid 6202 copper clad sheet

Product Description

RT/duroid 6202 is a high-frequency circuit material formulated as a low-loss, low-dielectric-constant laminate. It delivers superior electrical and mechanical properties essential for designing complex microwave structures that require both mechanical reliability and electrical stability.

 

The inclusion of limited woven glass reinforcement provides excellent dimensional stability (0.05 to 0.07 mils/inch), which often eliminates the need for double etching to achieve tight positional tolerances.

 

Cladding Options and Dielectric Thicknesses

Both electrodeposited and rolled copper foil cladding, ranging from ½ oz. to 2 oz./ft.², are available on dielectric thicknesses spanning 0.005" to 0.060" (0.127 to 1.524 mm).

 

RT duroid 6202 PCB Material High Frequency Laminates Copper Clad Sheet 0

 

Features and Benefits

  • Low Loss: Ensures excellent high-frequency performance
  • Tight εr and Thickness Control: Provides consistent electrical characteristics
  • Excellent Electrical and Mechanical Properties: Enables reliable circuit construction
  • Extremely Low Thermal Coefficient of Dielectric Constant: Maintains electrical stability across temperature variations
  • In-Plane Expansion Coefficient Matched to Copper: Enhances reliability for surface-mounted assemblies and plated through-holes
  • Very Low Etch Shrinkage: Improves precision in circuit fabrication

 

Typical Applications

  • Phased Array Antennas
  • Ground-Based and Airborne Radar Systems
  • Global Positioning System (GPS) Antennas
  • Power Backplanes
  • High-Reliability Complex Multilayer Circuits
  • Commercial Airline Collision Avoidance Systems
  • Beam Forming Networks

 

Property

Dielectric Constant ε

r

Typical Value

2.94 ± 0.04 [3]

Direction

Z

Units

 

-

Conditions

10GHz/23°C

Test Method

IPC-TM-650, 2.5.5.5
Dissipation Factor, TAN δ 0.0015 Z - 10 GHz/23°C IPC-TM-650, 2.5.5.5
Thermal Coefficient of εr +5 Z ppm/°C

10 GHz

-50 to +150°C

 IPC-TM-650, 2.5.5.5
Volume Resistivity 106 Z Mohm cm A ASTM D257
Surface Resistivity 109 Z Mohm A ASTM D257
Tensile Modulus 1007 (146) X, Y MPa (kpsi)

 

23°C

 

ASTM D638
Ultimate Stress 30 (4.3) X, Y MPs (kpsi)
Ultimate Strain 4.9 X, Y %
Compressive Modulus 1035 (150) Z MPa (kpsi)   ASTM D638
Moisture Absorption 0.04 - %

D23/24

D48/50

IPC-TM-650, 2.6.2.1

ASTM D570
Thermal Conductivity 0.68 - W/m/K 80°C ASTM C518

Coefficient of Thermal

Expansion (-55 to 288 °C)

15

15

30

X

Y

Z

 

ppm/°C

 

23°C/50% RH

 IPC-TM-650 2.4.41
Dimensional Stability 0.07 X, Y mm/m (mil/inch) after etch +E/150 IPC-TM-650, 2.4.3.9
Td 500   °CTGA   ASTM D3850
Density 2.1   gm/cm3   ASTM D792
Specific Heat 0.93 (0.22) - J/g/K (BTU/lb/°F) - Calculated
Copper Peel 9.1 (1.6)   lbs/in (N/mm)   IPC-TM-650 2.4.8
Flammability V-O       UL 94
Lead-Free Process Com- patible YES        

 

RT duroid 6202 PCB Material High Frequency Laminates Copper Clad Sheet 1

Tags: 

0.1mm Copper Clad Laminate,  

BME217 Copper Clad Laminate,  

12mm Copper Clad Laminate

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Products
PRODUCTS DETAILS
Products

RF PCB Board

Rogers PCB Board

PTFE PCB Board

High TG PCB

Multi Layer PCB

Taconic PCB

HDI PCB Board

High Speed PCB

Impedance Controlled PCB

Flexible PCB Board

FR4 PCB Board

PCB Stencil

Metal Core PCB

Copper Clad Laminates
RT duroid 6202 PCB Material High Frequency Laminates Copper Clad Sheet
  • name
RT duroid 6202 PCB Material High Frequency Laminates Copper Clad Sheet
MOQ: 1PCS
Price: USD9.99-99.99
Standard Packaging: Vacuum bags+Cartons
Delivery Period: 8-9 working days
Payment Method: T/T
Supply Capacity: 5000PCS per month
Detail Information
Product Description
Detail Information
Place of Origin
CHINA
Brand Name
Bicheng
Certification
UL, ISO9001, IATF16949
Model Number
BIC-332.V1.0
Part Number:
RT Duroid 6202
Laminate Thickness:
0.005” (0.127mm) +/- 0.0005” 0.020” (0.508mm) +/- 0.0010” 0.030” (0.762mm) +/- 0.0010”
Laminate Size:
12”X 18”(305mm X 457mm) 24”X 18”(610mm X 457mm)
Copper Weight:
Electrodeposited Copper Foil ½ Oz. (18µm) HH/HH 1 Oz. (35µm) H1/H1 Rolled Copper Foil ½ Oz. (18µm) 5R/5R 1 Oz. (35µm) 1R/1R
Minimum Order Quantity:
1PCS
Price:
USD9.99-99.99
Packaging Details:
Vacuum bags+Cartons
Delivery Time:
8-9 working days
Payment Terms:
T/T
Supply Ability:
5000PCS per month
Highlight

RT duroid 6202 PCB material

,

high frequency copper clad laminate

,

duroid 6202 copper clad sheet

Product Description

RT/duroid 6202 is a high-frequency circuit material formulated as a low-loss, low-dielectric-constant laminate. It delivers superior electrical and mechanical properties essential for designing complex microwave structures that require both mechanical reliability and electrical stability.

 

The inclusion of limited woven glass reinforcement provides excellent dimensional stability (0.05 to 0.07 mils/inch), which often eliminates the need for double etching to achieve tight positional tolerances.

 

Cladding Options and Dielectric Thicknesses

Both electrodeposited and rolled copper foil cladding, ranging from ½ oz. to 2 oz./ft.², are available on dielectric thicknesses spanning 0.005" to 0.060" (0.127 to 1.524 mm).

 

RT duroid 6202 PCB Material High Frequency Laminates Copper Clad Sheet 0

 

Features and Benefits

  • Low Loss: Ensures excellent high-frequency performance
  • Tight εr and Thickness Control: Provides consistent electrical characteristics
  • Excellent Electrical and Mechanical Properties: Enables reliable circuit construction
  • Extremely Low Thermal Coefficient of Dielectric Constant: Maintains electrical stability across temperature variations
  • In-Plane Expansion Coefficient Matched to Copper: Enhances reliability for surface-mounted assemblies and plated through-holes
  • Very Low Etch Shrinkage: Improves precision in circuit fabrication

 

Typical Applications

  • Phased Array Antennas
  • Ground-Based and Airborne Radar Systems
  • Global Positioning System (GPS) Antennas
  • Power Backplanes
  • High-Reliability Complex Multilayer Circuits
  • Commercial Airline Collision Avoidance Systems
  • Beam Forming Networks

 

Property

Dielectric Constant ε

r

Typical Value

2.94 ± 0.04 [3]

Direction

Z

Units

 

-

Conditions

10GHz/23°C

Test Method

IPC-TM-650, 2.5.5.5
Dissipation Factor, TAN δ 0.0015 Z - 10 GHz/23°C IPC-TM-650, 2.5.5.5
Thermal Coefficient of εr +5 Z ppm/°C

10 GHz

-50 to +150°C

 IPC-TM-650, 2.5.5.5
Volume Resistivity 106 Z Mohm cm A ASTM D257
Surface Resistivity 109 Z Mohm A ASTM D257
Tensile Modulus 1007 (146) X, Y MPa (kpsi)

 

23°C

 

ASTM D638
Ultimate Stress 30 (4.3) X, Y MPs (kpsi)
Ultimate Strain 4.9 X, Y %
Compressive Modulus 1035 (150) Z MPa (kpsi)   ASTM D638
Moisture Absorption 0.04 - %

D23/24

D48/50

IPC-TM-650, 2.6.2.1

ASTM D570
Thermal Conductivity 0.68 - W/m/K 80°C ASTM C518

Coefficient of Thermal

Expansion (-55 to 288 °C)

15

15

30

X

Y

Z

 

ppm/°C

 

23°C/50% RH

 IPC-TM-650 2.4.41
Dimensional Stability 0.07 X, Y mm/m (mil/inch) after etch +E/150 IPC-TM-650, 2.4.3.9
Td 500   °CTGA   ASTM D3850
Density 2.1   gm/cm3   ASTM D792
Specific Heat 0.93 (0.22) - J/g/K (BTU/lb/°F) - Calculated
Copper Peel 9.1 (1.6)   lbs/in (N/mm)   IPC-TM-650 2.4.8
Flammability V-O       UL 94
Lead-Free Process Com- patible YES        

 

RT duroid 6202 PCB Material High Frequency Laminates Copper Clad Sheet 1

Tags: 

0.1mm Copper Clad Laminate,

BME217 Copper Clad Laminate,

12mm Copper Clad Laminate

Bicheng Electronics Technology Co., Ltd
6-11C Shidai Jingyuan,Fuyong, Baoan, Shenzhen, Guangdong, China 518103
Tel: 86-755-27374946
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