| MOQ: | 1PCS |
| Price: | USD9.99-99.99 |
| Standard Packaging: | Vacuum bags+Cartons |
| Delivery Period: | 8-9 working days |
| Payment Method: | T/T |
| Supply Capacity: | 5000PCS per month |
RO4725JXR antenna-grade laminates offer a reliable, high-performance alternative to conventional PTFE-based materials, combining excellent electrical characteristics with enhanced processability.
Engineered specifically for antenna applications, RO4725JXR laminates deliver the precise electrical and mechanical properties designers require. With a dielectric constant (Dk) of 2.55 and a low loss tangent (Df) of just 0.0022 at 2.5 GHz (using LoPro® reverse-treated ED copper foil), these materials enable substantial antenna gain while minimizing signal loss. Additionally, they demonstrate exceptional low PIM performance, consistently achieving values below -160 dBc (tested with a 43dBm, 1900 MHz signal).
Unlike traditional PTFE-based laminates, RO4725JXR requires no special plated through-hole preparation and is fully compatible with conventional epoxy processing and high-temperature lead-free soldering. Lamination is readily achieved using RO4400™ bondply series at 175°C. The specially formulated thermoset resin system in RO4700JXR materials is designed to meet the demanding needs of modern antenna designs, featuring a glass transition temperature exceeding 280°C (536°F). This high Tg ensures low Z-axis CTE, excellent plated through-hole reliability, and seamless lead-free solder processability.
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Features and Benefits
RO4700 Series Laminates – Low Loss Dielectric with Low Profile Foil
- Reduced PIM for superior signal integrity
- Low insertion loss for enhanced efficiency
- RO4725JXR: Stable Dk of 2.55
Unique Filler / Closed Microspheres
- Low density for reduced weight
- 30% lighter than PTFE/glass materials
Low Z-axis CTE (<30 ppm/°C) & High Tg (>280°C)
- Design flexibility for complex architectures
- Compatible with automated assembly processes
Low TCDk (<40 ppm/°C)
- Consistent circuit performance across temperature variations
Specially Formulated Thermoset Resin System
- Low TCDk for stable electrical performance
- Precise 2.55 Dk control
- Ease of fabrication with standard processes
- Robust PTH process capability
Environmentally Friendly
- Lead-free process compatible
- RoHS compliant
Typical Applications
- Cellular base station antennas
| Property | RO4725JXR | Direction | Units | Condition | Test Method |
| Dielectric Constant, εr Process | 2.55 ± 0.05 | Z | 10 GHz/23°C | IPC-TM-650, 2.5.5.5 | |
| Dielectric Constant, εr Design | 2.64 | Z | 1.7 GHz - 5 GHz |
Differential Phase Length Method | |
| Dissipation Factor | 0.0026 | Z | 10 GHz/23°C | IPC-TM-650, 2.5.5.5 | |
| 0.0022 | 2.5GHz | ||||
| Thermal Coefficient of εr | +34 | Z | ppm/°C | -50°C to 150°C | IPC-TM-650, 2.5.5.5 |
| Volume Resistivity (0.030") | 2.16 X 10^8 | MΩ•cm | COND A | IPC-TM-650, 2.5.17.1 | |
| Surface Resistivity (0.030") | 4.8 X 10^7 | MΩ | COND A | IPC-TM-650, 2.5.17.1 | |
| PIM | -166 | dBc | 50 ohm 0.060” |
43dBm 1900MHz |
|
| Electrical Strength (0.030”) | 630 | Z | V/mil | IPC-TM-650, 2.5.6.2 | |
| Flexural Strength MD | 121 (17.5) | MPa (kpsi) |
RT | ASTM D790 | |
| CMD | 92 (13.3) | ||||
| Dimensional Stability | <0.4 | X,Y | mm/m | after etch +E2/150°C |
IPC-TM-650, 2.4.39A |
| Coefficient of Thermal Expansion |
13.9 | X | ppm/°C | -55 TO 288°C | IPC-TM-650, 2.1.24 |
| 19.0 | Y | ||||
| 25.6 | Z | ||||
| Thermal Conductivity | 0.38 | Z | W/mK° | 50°C | ASTM D5470 |
| Moisture Absorption | 0.24% | % | 48/50 | IPC-TM-650 2.6.2.1 ASTM D570 | |
| Tg | >280 | °C | IPC-TM-650 2.4.24 | ||
| Td | 439 | °C | ASTM D3850 | ||
| Density | 1.27 | gm/cm3 | ASTM D792 | ||
| Copper Peel Strength | 8.5 | pli | 1 oz LoPro EDC | IPC-TM-650 2.4.8 | |
| Flammability | N/A | UL94 | |||
| Lead-Free Process Compatible | YES |
| MOQ: | 1PCS |
| Price: | USD9.99-99.99 |
| Standard Packaging: | Vacuum bags+Cartons |
| Delivery Period: | 8-9 working days |
| Payment Method: | T/T |
| Supply Capacity: | 5000PCS per month |
RO4725JXR antenna-grade laminates offer a reliable, high-performance alternative to conventional PTFE-based materials, combining excellent electrical characteristics with enhanced processability.
Engineered specifically for antenna applications, RO4725JXR laminates deliver the precise electrical and mechanical properties designers require. With a dielectric constant (Dk) of 2.55 and a low loss tangent (Df) of just 0.0022 at 2.5 GHz (using LoPro® reverse-treated ED copper foil), these materials enable substantial antenna gain while minimizing signal loss. Additionally, they demonstrate exceptional low PIM performance, consistently achieving values below -160 dBc (tested with a 43dBm, 1900 MHz signal).
Unlike traditional PTFE-based laminates, RO4725JXR requires no special plated through-hole preparation and is fully compatible with conventional epoxy processing and high-temperature lead-free soldering. Lamination is readily achieved using RO4400™ bondply series at 175°C. The specially formulated thermoset resin system in RO4700JXR materials is designed to meet the demanding needs of modern antenna designs, featuring a glass transition temperature exceeding 280°C (536°F). This high Tg ensures low Z-axis CTE, excellent plated through-hole reliability, and seamless lead-free solder processability.
![]()
Features and Benefits
RO4700 Series Laminates – Low Loss Dielectric with Low Profile Foil
- Reduced PIM for superior signal integrity
- Low insertion loss for enhanced efficiency
- RO4725JXR: Stable Dk of 2.55
Unique Filler / Closed Microspheres
- Low density for reduced weight
- 30% lighter than PTFE/glass materials
Low Z-axis CTE (<30 ppm/°C) & High Tg (>280°C)
- Design flexibility for complex architectures
- Compatible with automated assembly processes
Low TCDk (<40 ppm/°C)
- Consistent circuit performance across temperature variations
Specially Formulated Thermoset Resin System
- Low TCDk for stable electrical performance
- Precise 2.55 Dk control
- Ease of fabrication with standard processes
- Robust PTH process capability
Environmentally Friendly
- Lead-free process compatible
- RoHS compliant
Typical Applications
- Cellular base station antennas
| Property | RO4725JXR | Direction | Units | Condition | Test Method |
| Dielectric Constant, εr Process | 2.55 ± 0.05 | Z | 10 GHz/23°C | IPC-TM-650, 2.5.5.5 | |
| Dielectric Constant, εr Design | 2.64 | Z | 1.7 GHz - 5 GHz |
Differential Phase Length Method | |
| Dissipation Factor | 0.0026 | Z | 10 GHz/23°C | IPC-TM-650, 2.5.5.5 | |
| 0.0022 | 2.5GHz | ||||
| Thermal Coefficient of εr | +34 | Z | ppm/°C | -50°C to 150°C | IPC-TM-650, 2.5.5.5 |
| Volume Resistivity (0.030") | 2.16 X 10^8 | MΩ•cm | COND A | IPC-TM-650, 2.5.17.1 | |
| Surface Resistivity (0.030") | 4.8 X 10^7 | MΩ | COND A | IPC-TM-650, 2.5.17.1 | |
| PIM | -166 | dBc | 50 ohm 0.060” |
43dBm 1900MHz |
|
| Electrical Strength (0.030”) | 630 | Z | V/mil | IPC-TM-650, 2.5.6.2 | |
| Flexural Strength MD | 121 (17.5) | MPa (kpsi) |
RT | ASTM D790 | |
| CMD | 92 (13.3) | ||||
| Dimensional Stability | <0.4 | X,Y | mm/m | after etch +E2/150°C |
IPC-TM-650, 2.4.39A |
| Coefficient of Thermal Expansion |
13.9 | X | ppm/°C | -55 TO 288°C | IPC-TM-650, 2.1.24 |
| 19.0 | Y | ||||
| 25.6 | Z | ||||
| Thermal Conductivity | 0.38 | Z | W/mK° | 50°C | ASTM D5470 |
| Moisture Absorption | 0.24% | % | 48/50 | IPC-TM-650 2.6.2.1 ASTM D570 | |
| Tg | >280 | °C | IPC-TM-650 2.4.24 | ||
| Td | 439 | °C | ASTM D3850 | ||
| Density | 1.27 | gm/cm3 | ASTM D792 | ||
| Copper Peel Strength | 8.5 | pli | 1 oz LoPro EDC | IPC-TM-650 2.4.8 | |
| Flammability | N/A | UL94 | |||
| Lead-Free Process Compatible | YES |