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Rogers RO4725JXR Substrate High Frequency Laminates Copper Clad Sheet

Rogers RO4725JXR Substrate High Frequency Laminates Copper Clad Sheet

MOQ: 1PCS
Price: USD9.99-99.99
Standard Packaging: Vacuum bags+Cartons
Delivery Period: 8-9 working days
Payment Method: T/T
Supply Capacity: 5000PCS per month
Detail Information
Place of Origin
CHINA
Brand Name
Bicheng
Certification
UL, ISO9001, IATF16949
Model Number
BIC-332.V1.0
Part Number:
RO4725JXR
Laminate Thickness:
0.78mm; 1.542mm
Laminate Size:
24”X 18”(610 X 457 Mm);24”X 21”(610 X 533 Mm);24”X 36”(610 X 915 Mm);48”X 36”(1219 X 915 Mm)
Copper Weight:
Electrodeposited Copper Foil½ Oz (18μm) HH/HH; 1 Oz (35μm) H1/H1; LoPro Reverse Treated Electrodeposited Copper Foil ½ Oz (18μm) TH/TH 1 Oz (35μm) T1/T1
Highlight:

Rogers RO4725JXR high frequency laminate

,

copper clad laminate substrate

,

high frequency copper clad sheet

Product Description

RO4725JXR antenna-grade laminates offer a reliable, high-performance alternative to conventional PTFE-based materials, combining excellent electrical characteristics with enhanced processability.

 

Engineered specifically for antenna applications, RO4725JXR laminates deliver the precise electrical and mechanical properties designers require. With a dielectric constant (Dk) of 2.55 and a low loss tangent (Df) of just 0.0022 at 2.5 GHz (using LoPro® reverse-treated ED copper foil), these materials enable substantial antenna gain while minimizing signal loss. Additionally, they demonstrate exceptional low PIM performance, consistently achieving values below -160 dBc (tested with a 43dBm, 1900 MHz signal).

 

Unlike traditional PTFE-based laminates, RO4725JXR requires no special plated through-hole preparation and is fully compatible with conventional epoxy processing and high-temperature lead-free soldering. Lamination is readily achieved using RO4400™ bondply series at 175°C. The specially formulated thermoset resin system in RO4700JXR materials is designed to meet the demanding needs of modern antenna designs, featuring a glass transition temperature exceeding 280°C (536°F). This high Tg ensures low Z-axis CTE, excellent plated through-hole reliability, and seamless lead-free solder processability.

 

Rogers RO4725JXR Substrate High Frequency Laminates Copper Clad Sheet 0

 

Features and Benefits

RO4700 Series Laminates – Low Loss Dielectric with Low Profile Foil
- Reduced PIM for superior signal integrity
- Low insertion loss for enhanced efficiency
- RO4725JXR: Stable Dk of 2.55

 

Unique Filler / Closed Microspheres
- Low density for reduced weight
- 30% lighter than PTFE/glass materials

 

Low Z-axis CTE (<30 ppm/°C) & High Tg (>280°C)
- Design flexibility for complex architectures
- Compatible with automated assembly processes

 

Low TCDk (<40 ppm/°C)
- Consistent circuit performance across temperature variations

 

Specially Formulated Thermoset Resin System
- Low TCDk for stable electrical performance
- Precise 2.55 Dk control
- Ease of fabrication with standard processes
- Robust PTH process capability

 

Environmentally Friendly
- Lead-free process compatible
- RoHS compliant

 

Typical Applications
- Cellular base station antennas

 

Property RO4725JXR Direction Units Condition Test Method
Dielectric Constant, εr Process 2.55 ± 0.05 Z   10 GHz/23°C IPC-TM-650, 2.5.5.5
Dielectric Constant, εr Design 2.64 Z   1.7 GHz - 5
GHz
Differential Phase Length Method
Dissipation Factor 0.0026 Z   10 GHz/23°C IPC-TM-650, 2.5.5.5
0.0022   2.5GHz
Thermal Coefficient of εr +34 Z ppm/°C -50°C to 150°C IPC-TM-650, 2.5.5.5
Volume Resistivity (0.030") 2.16 X 10^8   MΩ•cm COND A IPC-TM-650, 2.5.17.1
Surface Resistivity (0.030") 4.8 X 10^7   MΩ COND A IPC-TM-650, 2.5.17.1
PIM -166   dBc 50 ohm
0.060”
43dBm
1900MHz
Electrical Strength (0.030”) 630 Z V/mil   IPC-TM-650, 2.5.6.2
Flexural Strength MD 121 (17.5)   MPa
(kpsi)
RT ASTM D790
CMD 92 (13.3)  
Dimensional Stability <0.4 X,Y mm/m after etch
+E2/150°C
IPC-TM-650, 2.4.39A
Coefficient of Thermal
Expansion
13.9 X ppm/°C -55 TO 288°C IPC-TM-650, 2.1.24
19.0 Y
25.6 Z
Thermal Conductivity 0.38 Z W/mK° 50°C ASTM D5470
Moisture Absorption 0.24%   % 48/50 IPC-TM-650 2.6.2.1 ASTM D570
Tg >280   °C   IPC-TM-650 2.4.24
Td 439   °C   ASTM D3850
Density 1.27   gm/cm3   ASTM D792
Copper Peel Strength 8.5   pli 1 oz LoPro EDC IPC-TM-650 2.4.8
Flammability N/A       UL94
Lead-Free Process Compatible YES        
Products
PRODUCTS DETAILS
Rogers RO4725JXR Substrate High Frequency Laminates Copper Clad Sheet
MOQ: 1PCS
Price: USD9.99-99.99
Standard Packaging: Vacuum bags+Cartons
Delivery Period: 8-9 working days
Payment Method: T/T
Supply Capacity: 5000PCS per month
Detail Information
Place of Origin
CHINA
Brand Name
Bicheng
Certification
UL, ISO9001, IATF16949
Model Number
BIC-332.V1.0
Part Number:
RO4725JXR
Laminate Thickness:
0.78mm; 1.542mm
Laminate Size:
24”X 18”(610 X 457 Mm);24”X 21”(610 X 533 Mm);24”X 36”(610 X 915 Mm);48”X 36”(1219 X 915 Mm)
Copper Weight:
Electrodeposited Copper Foil½ Oz (18μm) HH/HH; 1 Oz (35μm) H1/H1; LoPro Reverse Treated Electrodeposited Copper Foil ½ Oz (18μm) TH/TH 1 Oz (35μm) T1/T1
Minimum Order Quantity:
1PCS
Price:
USD9.99-99.99
Packaging Details:
Vacuum bags+Cartons
Delivery Time:
8-9 working days
Payment Terms:
T/T
Supply Ability:
5000PCS per month
Highlight

Rogers RO4725JXR high frequency laminate

,

copper clad laminate substrate

,

high frequency copper clad sheet

Product Description

RO4725JXR antenna-grade laminates offer a reliable, high-performance alternative to conventional PTFE-based materials, combining excellent electrical characteristics with enhanced processability.

 

Engineered specifically for antenna applications, RO4725JXR laminates deliver the precise electrical and mechanical properties designers require. With a dielectric constant (Dk) of 2.55 and a low loss tangent (Df) of just 0.0022 at 2.5 GHz (using LoPro® reverse-treated ED copper foil), these materials enable substantial antenna gain while minimizing signal loss. Additionally, they demonstrate exceptional low PIM performance, consistently achieving values below -160 dBc (tested with a 43dBm, 1900 MHz signal).

 

Unlike traditional PTFE-based laminates, RO4725JXR requires no special plated through-hole preparation and is fully compatible with conventional epoxy processing and high-temperature lead-free soldering. Lamination is readily achieved using RO4400™ bondply series at 175°C. The specially formulated thermoset resin system in RO4700JXR materials is designed to meet the demanding needs of modern antenna designs, featuring a glass transition temperature exceeding 280°C (536°F). This high Tg ensures low Z-axis CTE, excellent plated through-hole reliability, and seamless lead-free solder processability.

 

Rogers RO4725JXR Substrate High Frequency Laminates Copper Clad Sheet 0

 

Features and Benefits

RO4700 Series Laminates – Low Loss Dielectric with Low Profile Foil
- Reduced PIM for superior signal integrity
- Low insertion loss for enhanced efficiency
- RO4725JXR: Stable Dk of 2.55

 

Unique Filler / Closed Microspheres
- Low density for reduced weight
- 30% lighter than PTFE/glass materials

 

Low Z-axis CTE (<30 ppm/°C) & High Tg (>280°C)
- Design flexibility for complex architectures
- Compatible with automated assembly processes

 

Low TCDk (<40 ppm/°C)
- Consistent circuit performance across temperature variations

 

Specially Formulated Thermoset Resin System
- Low TCDk for stable electrical performance
- Precise 2.55 Dk control
- Ease of fabrication with standard processes
- Robust PTH process capability

 

Environmentally Friendly
- Lead-free process compatible
- RoHS compliant

 

Typical Applications
- Cellular base station antennas

 

Property RO4725JXR Direction Units Condition Test Method
Dielectric Constant, εr Process 2.55 ± 0.05 Z   10 GHz/23°C IPC-TM-650, 2.5.5.5
Dielectric Constant, εr Design 2.64 Z   1.7 GHz - 5
GHz
Differential Phase Length Method
Dissipation Factor 0.0026 Z   10 GHz/23°C IPC-TM-650, 2.5.5.5
0.0022   2.5GHz
Thermal Coefficient of εr +34 Z ppm/°C -50°C to 150°C IPC-TM-650, 2.5.5.5
Volume Resistivity (0.030") 2.16 X 10^8   MΩ•cm COND A IPC-TM-650, 2.5.17.1
Surface Resistivity (0.030") 4.8 X 10^7   MΩ COND A IPC-TM-650, 2.5.17.1
PIM -166   dBc 50 ohm
0.060”
43dBm
1900MHz
Electrical Strength (0.030”) 630 Z V/mil   IPC-TM-650, 2.5.6.2
Flexural Strength MD 121 (17.5)   MPa
(kpsi)
RT ASTM D790
CMD 92 (13.3)  
Dimensional Stability <0.4 X,Y mm/m after etch
+E2/150°C
IPC-TM-650, 2.4.39A
Coefficient of Thermal
Expansion
13.9 X ppm/°C -55 TO 288°C IPC-TM-650, 2.1.24
19.0 Y
25.6 Z
Thermal Conductivity 0.38 Z W/mK° 50°C ASTM D5470
Moisture Absorption 0.24%   % 48/50 IPC-TM-650 2.6.2.1 ASTM D570
Tg >280   °C   IPC-TM-650 2.4.24
Td 439   °C   ASTM D3850
Density 1.27   gm/cm3   ASTM D792
Copper Peel Strength 8.5   pli 1 oz LoPro EDC IPC-TM-650 2.4.8
Flammability N/A       UL94
Lead-Free Process Compatible YES        
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