Introducing our high-performance 2-layer rigid PCB, expertly engineered using F4BTME320 material. This advanced PCB is designed for precision and reliability in the most demanding RF and microwave applications, making it the ideal choice for aerospace systems, radar technologies, and satellite communications.
The stack-up of this PCB consists of:
Copper Layer 1: 35 μm
F4BTME320 Core: 1.524 mm (60 mil)
Copper Layer 2: 35 μm
PCB details
| Parameter |
Details |
| Base Material |
F4BTME320 |
| Layer Count |
2 layers |
| Board Dimensions |
136mm x 98mm (1 piece), ±0.15mm tolerance |
| Minimum Hole Size |
0.4mm |
| Blind Vias |
No |
| Finished Board Thickness |
1.6mm |
| Finished Cu Weight (Outer Layers) |
1oz (1.4 mils) |
| Surface Finish |
Immersion Tin |
| Top Silkscreen |
No |
| Bottom Silkscreen |
No |
| Top Solder Mask |
Black |
| Bottom Solder Mask |
No |
| Electrical Test |
100% used prior to shipment |
Features and Benefits of F4BTME320 Material
Dielectric Properties
F4BTME320 laminate exhibits a stable dielectric constant of 3.2 with a tight tolerance of ±0.06 at 10 GHz. This exceptional stability is critical for high-frequency applications, ensuring consistent signal performance.
Ultra-Low Loss Characteristics
With a remarkably low dissipation factor of just 0.002 at 10 GHz (0.0026 at 20 GHz), F4BTME320 minimizes signal loss, making it perfect for sensitive RF applications like phased array antennas and military radar systems.
Moisture Resistance
Featuring a moisture absorption rate of only 0.05%, this PCB maintains excellent performance in humid environments while significantly reducing the risk of delamination.
Thermal Performance
The CTE values for F4BTME320 are engineered for thermal reliability:
- X-axis: 13 ppm/°C
- Y-axis: 15 ppm/°C
- Z-axis: 58 ppm/°C
These optimized values ensure dimensional stability across operating temperatures from -55°C to 288°C.
Exceptional PIM Performance
With PIM values consistently below -160 dBc, this material delivers outstanding performance for passive intermodulation-sensitive applications like base station antennas.
Typical Applications
The advanced properties of this PCB make it suitable for the most demanding high-frequency applications:
- Aerospace and defense systems: Radar and avionics requiring extreme reliability
- Phased array antennas: Precision phase-sensitive applications
- Satellite communications: High-frequency signal transmission
- Military radar systems: Mission-critical detection systems
- 5G infrastructure: Base station antennas and RF components
- Microwave and RF systems: Power dividers, couplers, and feed networks
Compliance and Standards
This PCB strictly adheres to IPC-Class-2 standards, guaranteeing it meets rigorous industry requirements for quality and reliability. All artwork is supplied in Gerber RS-274-X format for seamless manufacturing integration.
Global Availability
We offer worldwide shipping, ensuring timely delivery to engineers and manufacturers across all regions.
Conclusion
This 2-layer rigid PCB with F4BTME320 construction represents the pinnacle of high-frequency circuit board technology. Combining superior material properties with precision engineering and rigorous quality control, this solution delivers unmatched performance for the most challenging applications. By selecting this PCB, you're choosing a solution that will enhance signal integrity, improve system reliability, and withstand the most demanding operational environments. Partner with us for your advanced RF and microwave PCB requirements.
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