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RO3010 RF PCB 4-Layer 2.7mm Thick for Microwave Applications

RO3010 RF PCB 4-Layer 2.7mm Thick for Microwave Applications

MOQ: 1PCS
Price: USD9.99-99.99/PCS
Standard Packaging: Vacuum bags+Cartons
Delivery Period: 8-9 working days
Payment Method: T/T
Supply Capacity: 5000PCS per month
Detail Information
Place of Origin
China
Brand Name
Bicheng
Certification
UL, ISO9001, IATF16949
PCB Material:
RO3010
Layer Count:
4 Layers
PCB Thickness:
2.7mm
PCB Size:
35mm X 42 Mm=1PCS
Copper Weight:
1oz (1.4 Mils) Outer Layers
Solder Mask:
No
Silkscreen:
No
Surface Finish:
Immersion Tin
Highlight:

4-layer RF PCB

,

microwave RF PCB

,

2.7mm thick RF PCB

Product Description

In the fast-paced world of electronics, the demand for high-performance printed circuit boards (PCBs) is paramount. Our 4-layer PCB, constructed from Rogers RO3010, is specifically designed to excel in RF and microwave applications.

 

Material Selection: Rogers RO3010

At the heart of this PCB is Rogers RO3010, a high-performance laminate known for its exceptional electrical and mechanical properties. This ceramic-filled PTFE composite is engineered for commercial microwave and RF applications, providing a stable dielectric constant (Dk) and superior performance across a wide range of frequencies.

 

Key Features of Rogers RO3010:

- Dielectric Constant (Dk): 10.2 ± 0.30 at 10 GHz, which ensures minimal signal loss and exceptional performance in high-frequency environments.

 

- Dissipation Factor: With a low dissipation factor of 0.0022 at 10 GHz, Rogers RO3010 minimizes energy loss, enhancing overall efficiency.

 

- Thermal Stability: The thermal decomposition temperature (Td) exceeds 500°C, ensuring robust performance even in demanding thermal conditions.

 

- Low Moisture Absorption: A moisture absorption rate of only 0.05% enhances reliability in various environmental conditions.

 

- Coefficient of Thermal Expansion (CTE): With X and Y axes at 13 ppm/°C and 11 ppm/°C, and Z axis at 16 ppm/°C, Rogers RO3010 offers excellent dimensional stability.

 

RO3010 RF PCB 4-Layer 2.7mm Thick for Microwave Applications 0

 

PCB Specifications

This 4-layer PCB is designed with precision, featuring compact dimensions of 35mm x 42mm. Its size makes it suitable for applications where space is limited, making it an ideal choice for miniaturized electronic devices.

 

Parameter Specification
Layer Count 4 Layers
Finished Board Thickness 2.7mm
Minimum Trace/Space 6/9 mils
Minimum Hole Size 0.4mm
Blind Vias L1-L2
Finished Copper Weight 1 oz (1.4 mils) for outer layers
Via Plating Thickness 20 μm
Surface Finish Immersion Tin
Silkscreen None on both sides
Solder Mask None on both sides
Electrical Testing 100% electrical test conducted prior to shipment

 

Stackup Configuration

The stackup of this PCB is designed to optimize performance:

 

- Copper Layer 1: 35 μm

- Rogers RO3010 Substrate: 50 mils (1.27mm)

- Copper Layer 2: 35 μm

- Prepreg 1060 Bonding Ply: 0.05mm

- Copper Layer 3: 35 μm

- Rogers RO3010 Substrate: 50 mils (1.27mm)

- Copper Layer 4: 35 μm

 

This configuration ensures effective electrical connections and stable thermal management, which are critical for high-frequency applications.

 

Quality Assurance

Every PCB undergoes a 100% electrical test prior to shipment, ensuring compliance with IPC-Class-2 standards. This rigorous testing process guarantees that each board performs reliably in demanding applications.

 

Typical Applications

The versatility of this PCB makes it suitable for various high-frequency applications, including:

 

- Automotive Radar Applications: Enhancing vehicle safety and navigation systems.

- Global Positioning Satellite (GPS) Antennas: Ensuring precise location tracking.

- Cellular Telecommunications Systems: Ideal for power amplifiers and antennas, supporting reliable communication.

- Patch Antennas for Wireless Communications: Supporting seamless connectivity for mobile devices.

- Direct Broadcast Satellites: Delivering high-quality satellite signals for entertainment and communications.

- Datalink on Cable Systems: Facilitating efficient data transmission for cable networks.

- Remote Meter Readers: Enhancing utility management with reliable data collection.

- Power Backplanes: Supporting high-performance power distribution in complex systems.

 

Conclusion

Choosing this advanced PCB solution guarantees that your products will not only meet but exceed the expectations of today’s technological landscape. Whether your focus is on telecommunications, aerospace, or consumer electronics, this PCB is designed to deliver the high performance you require.

 

For more information or to place an order, please reach out to us today—let’s work together to enhance your electronic solutions!

 

RO3010 RF PCB 4-Layer 2.7mm Thick for Microwave Applications 1

products
PRODUCTS DETAILS
RO3010 RF PCB 4-Layer 2.7mm Thick for Microwave Applications
MOQ: 1PCS
Price: USD9.99-99.99/PCS
Standard Packaging: Vacuum bags+Cartons
Delivery Period: 8-9 working days
Payment Method: T/T
Supply Capacity: 5000PCS per month
Detail Information
Place of Origin
China
Brand Name
Bicheng
Certification
UL, ISO9001, IATF16949
PCB Material:
RO3010
Layer Count:
4 Layers
PCB Thickness:
2.7mm
PCB Size:
35mm X 42 Mm=1PCS
Copper Weight:
1oz (1.4 Mils) Outer Layers
Solder Mask:
No
Silkscreen:
No
Surface Finish:
Immersion Tin
Minimum Order Quantity:
1PCS
Price:
USD9.99-99.99/PCS
Packaging Details:
Vacuum bags+Cartons
Delivery Time:
8-9 working days
Payment Terms:
T/T
Supply Ability:
5000PCS per month
Highlight

4-layer RF PCB

,

microwave RF PCB

,

2.7mm thick RF PCB

Product Description

In the fast-paced world of electronics, the demand for high-performance printed circuit boards (PCBs) is paramount. Our 4-layer PCB, constructed from Rogers RO3010, is specifically designed to excel in RF and microwave applications.

 

Material Selection: Rogers RO3010

At the heart of this PCB is Rogers RO3010, a high-performance laminate known for its exceptional electrical and mechanical properties. This ceramic-filled PTFE composite is engineered for commercial microwave and RF applications, providing a stable dielectric constant (Dk) and superior performance across a wide range of frequencies.

 

Key Features of Rogers RO3010:

- Dielectric Constant (Dk): 10.2 ± 0.30 at 10 GHz, which ensures minimal signal loss and exceptional performance in high-frequency environments.

 

- Dissipation Factor: With a low dissipation factor of 0.0022 at 10 GHz, Rogers RO3010 minimizes energy loss, enhancing overall efficiency.

 

- Thermal Stability: The thermal decomposition temperature (Td) exceeds 500°C, ensuring robust performance even in demanding thermal conditions.

 

- Low Moisture Absorption: A moisture absorption rate of only 0.05% enhances reliability in various environmental conditions.

 

- Coefficient of Thermal Expansion (CTE): With X and Y axes at 13 ppm/°C and 11 ppm/°C, and Z axis at 16 ppm/°C, Rogers RO3010 offers excellent dimensional stability.

 

RO3010 RF PCB 4-Layer 2.7mm Thick for Microwave Applications 0

 

PCB Specifications

This 4-layer PCB is designed with precision, featuring compact dimensions of 35mm x 42mm. Its size makes it suitable for applications where space is limited, making it an ideal choice for miniaturized electronic devices.

 

Parameter Specification
Layer Count 4 Layers
Finished Board Thickness 2.7mm
Minimum Trace/Space 6/9 mils
Minimum Hole Size 0.4mm
Blind Vias L1-L2
Finished Copper Weight 1 oz (1.4 mils) for outer layers
Via Plating Thickness 20 μm
Surface Finish Immersion Tin
Silkscreen None on both sides
Solder Mask None on both sides
Electrical Testing 100% electrical test conducted prior to shipment

 

Stackup Configuration

The stackup of this PCB is designed to optimize performance:

 

- Copper Layer 1: 35 μm

- Rogers RO3010 Substrate: 50 mils (1.27mm)

- Copper Layer 2: 35 μm

- Prepreg 1060 Bonding Ply: 0.05mm

- Copper Layer 3: 35 μm

- Rogers RO3010 Substrate: 50 mils (1.27mm)

- Copper Layer 4: 35 μm

 

This configuration ensures effective electrical connections and stable thermal management, which are critical for high-frequency applications.

 

Quality Assurance

Every PCB undergoes a 100% electrical test prior to shipment, ensuring compliance with IPC-Class-2 standards. This rigorous testing process guarantees that each board performs reliably in demanding applications.

 

Typical Applications

The versatility of this PCB makes it suitable for various high-frequency applications, including:

 

- Automotive Radar Applications: Enhancing vehicle safety and navigation systems.

- Global Positioning Satellite (GPS) Antennas: Ensuring precise location tracking.

- Cellular Telecommunications Systems: Ideal for power amplifiers and antennas, supporting reliable communication.

- Patch Antennas for Wireless Communications: Supporting seamless connectivity for mobile devices.

- Direct Broadcast Satellites: Delivering high-quality satellite signals for entertainment and communications.

- Datalink on Cable Systems: Facilitating efficient data transmission for cable networks.

- Remote Meter Readers: Enhancing utility management with reliable data collection.

- Power Backplanes: Supporting high-performance power distribution in complex systems.

 

Conclusion

Choosing this advanced PCB solution guarantees that your products will not only meet but exceed the expectations of today’s technological landscape. Whether your focus is on telecommunications, aerospace, or consumer electronics, this PCB is designed to deliver the high performance you require.

 

For more information or to place an order, please reach out to us today—let’s work together to enhance your electronic solutions!

 

RO3010 RF PCB 4-Layer 2.7mm Thick for Microwave Applications 1

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