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| Material: | RT/duroid 5880 - 0.381 Mm (15mil) | Layer Count: | 2-layer |
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| PCB Size: | 65.9mm X 26.32 Mm=1PCS, +/- 0.15mm | PCB Thickness: | 0.5 Mm |
| Copper Weight: | 1oz (1.4 Mils) Outer Layers | Surface Finish: | ENEPIG |
| Highlight: | 15mil RT duroid 5880 PCB,15mil RT duroid 5880 PCB Board,PCB 2 Layer ENEPIG Circuit Board |
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Introducing the RT/Duroid 5880 PCB
The RT/Duroid 5880 is a premium high-frequency laminate designed for demanding stripline and microstrip circuit applications. Crafted from advanced PTFE composites reinforced with glass microfibers, this PCB guarantees exceptional dielectric constant uniformity, ensuring reliable performance across a wide frequency range.
Key Features:
Dielectric Constant: 2.2 with a tight tolerance of 0.02 at 10 GHz/23°C.
Dissipation Factor: An impressive 0.0009 at 10 GHz, minimizing signal loss.
Temperature Coefficient of Dielectric Constant (TCDk): -125 ppm/°C for stable performance under varying temperatures.
Low Moisture Absorption: Just 0.02%, making it ideal for high moisture environments.
Coefficient of Thermal Expansion (CTE): 31 ppm/°C (X-axis), 48 ppm/°C (Y-axis), and 237 ppm/°C (Z-axis), ensuring isotropic behavior.
| Property | RT/duroid 5880 | Direction | Units | Condition | Test Method | |
| Dielectric Constant,εProcess | 2.20 2.20±0.02 spec. |
Z | N/A | C24/23/50 C24/23/50 |
1 MHz IPC-TM-650 2.5.5.3 10 GHz IPC-TM 2.5.5.5 |
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| Dielectric Constant,εDesign | 2.2 | Z | N/A | 8GHz to 40 GHz | Differential Phase Length Method | |
| Dissipation Factor,tanδ | 0.0004 0.0009 |
Z | N/A | C24/23/50 C24/23/50 |
1 MHz IPC-TM-650 2.5.5.3 10 GHz IPC-TM 2.5.5.5 |
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| Thermal Coefficient of ε | -125 | Z | ppm/℃ | -50℃to 150℃ | IPC-TM-650 2.5.5.5 | |
| Volume Resistivity | 2 x 107 | Z | Mohm cm | C/96/35/90 | ASTM D 257 | |
| Surface Resistivity | 3 x 107 | Z | Mohm | C/96/35/90 | ASTM D 257 | |
| Specific Heat | 0.96(0.23) | N/A | j/g/k (cal/g/c) |
N/A | Calculated | |
| Tensile Modulus | Test at 23℃ | Test at 100℃ | N/A | MPa(kpsi) | A | ASTM D 638 |
| 1070(156) | 450(65) | X | ||||
| 860(125) | 380(55) | Y | ||||
| Ultimate Stress | 29(4.2) | 20(2.9) | X | |||
| 27(3.9) | 18(2.6) | Y | ||||
| Ultimate Strain | 6 | 7.2 | X | % | ||
| 4.9 | 5.8 | Y | ||||
| Compressive Modulus | 710(103) | 500(73) | X | MPa(kpsi) | A | ASTM D 695 |
| 710(103) | 500(73) | Y | ||||
| 940(136) | 670(97) | Z | ||||
| Ultimate Stress | 27(3.9) | 22(3.2) | X | |||
| 29(5.3) | 21(3.1) | Y | ||||
| 52(7.5) | 43(6.3) | Z | ||||
| Ultimate Strain | 8.5 | 8.4 | X | % | ||
| 7.7 | 7.8 | Y | ||||
| 12.5 | 17.6 | Z | ||||
| Moisture Absorption | 0.02 | N/A | % | 0.62"(1.6mm) D48/50 | ASTM D 570 | |
| Thermal Conductivity | 0.2 | Z | W/m/k | 80℃ | ASTM C 518 | |
| Coefficient of Thermal Expansion | 31 48 237 |
X Y Z |
ppm/℃ | 0-100℃ | IPC-TM-650 2.4.41 | |
| Td | 500 | N/A | ℃ TGA | N/A | ASTM D 3850 | |
| Density | 2.2 | N/A | gm/cm3 | N/A | ASTM D 792 | |
| Copper Peel | 31.2(5.5) | N/A | Pli(N/mm) | 1oz(35mm)EDC foil after solder float |
IPC-TM-650 2.4.8 | |
| Flammability | V-0 | N/A | N/A | N/A | UL 94 | |
| Lead-free Process Compatible | Yes | N/A | N/A | N/A | N/A | |
Benefits:
Uniform Electrical Properties: Maintains consistent performance over a broad frequency spectrum.
Ease of Machining: Easily cut, sheared, and shaped to meet specific design requirements.
Chemical Resistance: Resistant to solvents and reagents commonly used in PCB etching and plating processes.
Established Material: Proven track record in various high-performance applications.
Lowest Electrical Loss: Optimized for minimal signal degradation, particularly in reinforced PTFE materials.
Construction and Specifications
This PCB is designed with a robust 2-layer rigid construction:
Layer Composition:
Copper Layer 1: 35 μm
RT/Duroid 5880 Core: 0.381 mm (15 mil)
Copper Layer 2: 35 μm
Dimensions: Each board measures 65.9 mm x 26.32 mm, with a tolerance of +/- 0.15 mm, enabling precise integration into various electronic devices.
Trace/Space: 5/6 mils
Hole Size: 0.2 mm
Finished Thickness: 0.5 mm
Surface Treatments: The PCB features an ENEPIG surface finish, offering excellent solderability and corrosion resistance.
Rigorous Testing Standards
Quality assurance is paramount in electronic manufacturing. The RT/Duroid 5880 PCB undergoes a thorough 100% electrical test prior to shipment, ensuring that every unit meets stringent performance criteria. It adheres to IPC-Class-2 standards, making it reliable for commercial applications.
Applications in the Industry
The RT/Duroid 5880 PCB is versatile, catering to a multitude of high-frequency applications, including:
Commercial Airline Broadband Antennas: Enhancing communication systems for in-flight connectivity.
Microstrip and Stripline Circuits: Providing reliable performance in various RF applications.
Millimeter Wave Applications: Supporting next-generation wireless technologies.
Radar Systems: Offering precision and reliability in critical defense and commercial radar applications.
Guidance Systems: Ensuring accurate navigation and targeting in aerospace and military applications.
Point-to-Point Digital Radio Antennas: Facilitating high-speed data transmission over long distances.
Conclusion
The RT/Duroid 5880 PCB is a formidable solution for engineers and manufacturers seeking high-performance, reliable, and versatile printed circuit boards. With its advanced material properties, ease of fabrication, and proven track record in critical applications, this PCB is poised to become a cornerstone in the development of next-generation electronic systems. As industries continue to advance towards higher frequencies and greater efficiency, the RT/Duroid 5880 stands ready to meet and exceed those challenges, ensuring optimal performance in a rapidly changing technological landscape.
Contact Person: Ms. Ivy Deng
Tel: 86-755-27374946
Fax: 86-755-27374848
