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8mil RO4003C PCB Double Layer Immersion Silver Circuits

China Bicheng Electronics Technology Co., Ltd certification
China Bicheng Electronics Technology Co., Ltd certification
Kevin, Received and tested the boards - thanks very much. These are perfect, exactly what we needed. rgds Rich

—— Rich Rickett

Ruth, I got the PCB today, and they are just perfect. Please stay a little patience, my next order is coming soon. Kind regards from Hamburg Olaf

—— Olaf Kühnhold

Hi Natalie. It was perfect, I attach some pictures for your reference. And I send you next 2 projects to budget. Thanks a lot again

—— Sebastian Toplisek

Kevin, Thanks, they were perfectly made, and work well. As promised, here are the links for my latest project, using the PCBs you manufactured for me: Regards, Daniel

—— Daniel Ford

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8mil RO4003C PCB Double Layer Immersion Silver Circuits

8mil RO4003C PCB Double Layer Immersion Silver Circuits
8mil RO4003C PCB Double Layer Immersion Silver Circuits

Large Image :  8mil RO4003C PCB Double Layer Immersion Silver Circuits

Product Details:
Place of Origin: CHINA
Brand Name: Bicheng
Certification: UL, ISO9001, IATF16949
Payment & Shipping Terms:
Minimum Order Quantity: 1PCS
Price: USD9.99-99.99/PCS
Packaging Details: Vacuum bags+Cartons
Delivery Time: 8-9 working days
Payment Terms: T/T
Supply Ability: 5000PCS per month
Detailed Product Description
Material: Rogers RO4003C Layer Count: 2-layer
PCB Size: 117.04mm X 67.11 Mm=1PCS, +/- 0.15mm PCB Thickness: 0.3 Mm
Copper Weight: 1oz (1.4 Mils) Outer Layers Surface Finish: Immersion Silver
Highlight:

8mil RO4003C PCB

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8mil Immersion Silver Circuits PCB

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Double-layer Immersion Silver Circuits PCB

The Rogers RO4003C PCB is an innovative solution that combines the superior electrical performance of PTFE/woven glass with the manufacturability of epoxy/glass. This versatile laminate is designed for applications requiring exceptional reliability, making it a game-changer in the RF and microwave sectors.

 

Key Features of Rogers RO4003C

Superior Electrical Performance

One of the standout features of the Rogers RO4003C is its dielectric constant (Dk), which is measured at 3.38 ± 0.05 at 10 GHz. This tight control over the dielectric constant is crucial for maintaining signal integrity in high-frequency applications. Alongside this, the PCB boasts a dissipation factor of 0.0027 at 10 GHz, ensuring minimal signal loss and optimal performance.

 

Thermal Stability

The RO4003C excels in thermal performance, with a thermal decomposition temperature (Tg) exceeding 280°C (536°F). This stability allows the material to maintain its properties over a wide range of processing temperatures, making it ideal for demanding environments. The thermal coefficient of the dielectric constant of +40 ppm/°C indicates that the material can maintain its electrical performance even under thermal stress.

 

Coefficient of Thermal Expansion (CTE)

One of the critical advantages of the Rogers RO4003C is its CTE, which is closely aligned with that of copper. This similarity allows for excellent dimensional stability, particularly important in multilayer boards that incorporate mixed dielectric materials. The low Z-axis CTE of 46 ppm/°C ensures reliable plated through-hole quality, even under severe thermal conditions.

 

Moisture Resistance

With a low moisture absorption rate of 0.06%, the Rogers RO4003C is designed to perform well in various environmental conditions. This feature is particularly beneficial for applications in humid or variable temperature settings, providing engineers with peace of mind regarding the durability and reliability of their designs.

 

Property RO4003C Direction Units Condition Test Method
Dielectric Constant,εProcess 3.38±0.05 Z   10 GHz/23℃ IPC-TM-650 2.5.5.5 Clamped Stripline
Dielectric Constant,εDesign 3.55 Z   8 to 40 GHz Differential Phase Length Method
Dissipation Factortan,δ 0.0027
0.0021
Z   10 GHz/23℃
2.5 GHz/23℃
IPC-TM-650 2.5.5.5
Thermal Coefficient of ε +40 Z ppm/℃ -50℃to 150℃ IPC-TM-650 2.5.5.5
Volume Resistivity 1.7 x 1010   MΩ.cm COND A IPC-TM-650 2.5.17.1
Surface Resistivity 4.2 x 109   COND A IPC-TM-650 2.5.17.1
Electrical Strength 31.2(780) Z Kv/mm(v/mil) 0.51mm(0.020") IPC-TM-650 2.5.6.2
Tensile Modulus 19,650(2,850)
19,450(2,821)
X
Y
MPa(ksi) RT ASTM D 638
Tensile Strength 139(20.2)
100(14.5)
X
Y
MPa(ksi) RT ASTM D 638
Flexural Strength 276
(40)
  MPa
(kpsi)
  IPC-TM-650 2.4.4
Dimensional Stability <0.3 X,Y mm/m
(mil/inch)
after etch+E2/150℃ IPC-TM-650 2.4.39A
Coefficient of Thermal Expansion 11
14
46
X
Y
Z
ppm/℃ -55℃to288℃ IPC-TM-650 2.4.41
Tg >280   ℃ TMA A IPC-TM-650 2.4.24.3
Td 425   ℃ TGA   ASTM D 3850
Thermal Conductivity 0.71   W/M/oK 80℃ ASTM C518
Moisture Absorption 0.06   % 48hrs immersion 0.060"
sample Temperature 50℃
ASTM D 570
Density 1.79   gm/cm3 23℃ ASTM D 792
Copper Peel Stength 1.05
(6.0)
  N/mm
(pli)
after solder float 1 oz.
EDC Foil
IPC-TM-650 2.4.8
Flammability N/A       UL 94
Lead-free Process Compatible Yes        

 

Layer Stackup

This PCB is configured as a 2-layer rigid PCB, featuring:
 

- Copper Layer 1: 35 μm
- Rogers 4003C Core: 0.203 mm (8 mil)
- Copper Layer 2: 35 μm

 

Detailed Construction

The dimensions of this board are 117.04 mm x 67.11 mm (1 piece, ± 0.15 mm), with a minimum trace/space specification of 4/4 mils and a minimum hole size of 0.3 mm. The finished board thickness is 0.3 mm, and the copper weight on the outer layers is set at 1 oz (1.4 mils).

 

Additional Specifications

- Via Plating Thickness: 20 μm
- Surface Finish: Immersion silver
- Top Silkscreen: Black
- Bottom Silkscreen: None
- Top Solder Mask: None
- Bottom Solder Mask: None
- Electrical Testing: 100% electrical test performed prior to shipment

 

Advantages of Rogers RO4003C

Cost-Effective Processing

The Rogers RO4003C is designed to be processed like standard epoxy/glass materials, offering lower manufacturing costs compared to conventional microwave laminates. This cost-effectiveness makes it an attractive choice for high-volume applications without sacrificing quality or performance.

 

8mil RO4003C PCB Double Layer Immersion Silver Circuits 0

 

Ideal for Multi-Layer Board Constructions

The unique properties of the RO4003C make it particularly well-suited for multi-layer board (MLB) constructions. Its dimensional stability and low moisture absorption help ensure that the boards remain reliable and functional over time, even in challenging environments.

 

Typical Applications

The versatility of the Rogers RO4003C PCB allows it to be utilized in a wide array of applications, including:

 

- Cellular Base Station Antennas and Power Amplifiers: Enhancing connectivity and signal quality in telecommunications.
 

- RF Identification Tags: Supporting efficient tracking and identification in various settings.
 

- Automotive Radar and Sensors: Improving safety and navigation systems in vehicles, crucial for advanced driver-assistance systems (ADAS).
 

- LNBs for Direct Broadcast Satellites: Ensuring high-quality signal reception for satellite communications.

 

Conclusion

The Rogers RO4003C PCB represents a significant advancement in PCB technology, offering a perfect blend of performance, reliability, and cost-effectiveness. With its exceptional electrical properties, thermal stability, and moisture resistance, it is poised to meet the demands of modern electronics applications. Whether you're in telecommunications, automotive, or satellite communications, the Rogers RO4003C PCB is an indispensable component for engineers and designers looking to push the boundaries of innovation. Embrace the future of PCB design with Rogers RO4003C and elevate your projects to new heights.

Contact Details
Bicheng Electronics Technology Co., Ltd

Contact Person: Ms. Ivy Deng

Tel: 86-755-27374946

Fax: 86-755-27374848

Send your inquiry directly to us (0 / 3000)