MOQ: | 1PCS |
Price: | USD9.99-99.99/PCS |
Standard Packaging: | Vacuum bags+Cartons |
Delivery Period: | 8-9 working days |
Payment Method: | T/T |
Supply Capacity: | 5000PCS per month |
In the ever-evolving landscape of electronic manufacturing, the demand for high-performance printed circuit boards (PCBs) has never been greater. Engineers and designers require materials that not only meet stringent performance criteria but also offer reliability and versatility for various applications.The F4BM300 PCB from Wangling—an innovative laminate that sets a new standard in the industry.Let's delve into the specific features, benefits, and applications of the F4BM300 PCB, showcasing why it is an essential choice for modern electronic designs.
Advanced Material Composition
The F4BM300 laminate is meticulously crafted from a scientifically formulated combination of fiberglass cloth, polytetrafluoroethylene (PTFE) resin, and PTFE film. This unique formulation enhances the electrical performance compared to its predecessor, the F4B300. The key advantages include lower dielectric loss, increased insulation resistance, and improved thermal stability. By replacing similar foreign products, the F4BM300 offers a competitive edge in both quality and cost-effectiveness.
Comparison with F4BME300
While the F4BM300 shares the same dielectric layer as the F4BME300, the two differ in their copper foil combinations. The F4BM300 utilizes Electrodeposited (ED) copper foil, making it suitable for applications that do not require Passive Intermodulation (PIM) performance. In contrast, the F4BME300 is paired with reverse-treated foil (RTF) copper foil, which provides excellent PIM performance, more precise line control, and reduced conductor loss. This flexibility allows engineers to choose the best laminate based on their specific application needs.
Electrical Performance
The F4BM300 boasts impressive electrical characteristics:
- Dielectric Constant (Dk): 3.0 at 10 GHz, ensuring efficient signal transmission.
- Dissipation Factor: 0.0017 at 10 GHz, minimizing energy loss.
- Thermal Coefficient of Dk: -80 ppm/°C, providing stability across temperature fluctuations.
- Moisture Absorption: ≤0.08%, ensuring reliability in humid environments.
- Flammability Rating: UL-94 V0, meeting stringent safety standards.
Construction and Dimensions
This PCB features a 2-layer rigid design, composed of:
- Copper Layer 1: 35 μm
- F4BM300 Core: 1.524 mm
- Copper Layer 2: 35 μm
The finished board has a thickness of 1.6 mm and adheres to precise dimensional tolerances. The board dimensions are 700 mm x 40 mm, with a tolerance of +/- 0.15 mm, making it suitable for intricate designs. The minimum trace/space is 5/5 mils, and the minimum hole size is 0.4 mm, allowing for complex routing.
Quality Assurance
Quality is paramount in PCB manufacturing, and the F4BM300 is no exception. Each board undergoes a rigorous 100% electrical test before shipment, ensuring that it meets the high standards expected by our customers. This PCB complies with IPC-Class-2 standards, guaranteeing its reliability in a wide range of applications.
Versatile Applications
The F4BM300 PCB is designed for a variety of demanding applications, including:
- Microwave, RF, and Radar Systems: Its low loss and high stability make it ideal for high-frequency applications.
- Phase Shifters and Power Dividers: The laminate's precise dielectric control is crucial for effective signal management.
- Feed Networks and Antenna Systems: Ideal for phase-sensitive and phased array antennas, ensuring optimal performance.
- Satellite Communications: Reliability in extreme conditions makes it suitable for aerospace applications.
- Base Station Antennas: Its robust design supports the growing demand for telecommunications infrastructure.
Conclusion
The F4BM300 PCB represents a significant advancement in laminate technology, combining superior electrical properties with exceptional dimensional stability. Its versatility and reliability make it an excellent choice for engineers and designers seeking high-performance solutions in various applications. As the electronic landscape continues to evolve, the F4BM300 positions itself as a reliable partner for innovation and success.
For more information on the F4BM300 PCB and any inquiry for this PCB, please contact our sales team. We are committed to providing you with the highest quality products and support for your electronic project needs.
MOQ: | 1PCS |
Price: | USD9.99-99.99/PCS |
Standard Packaging: | Vacuum bags+Cartons |
Delivery Period: | 8-9 working days |
Payment Method: | T/T |
Supply Capacity: | 5000PCS per month |
In the ever-evolving landscape of electronic manufacturing, the demand for high-performance printed circuit boards (PCBs) has never been greater. Engineers and designers require materials that not only meet stringent performance criteria but also offer reliability and versatility for various applications.The F4BM300 PCB from Wangling—an innovative laminate that sets a new standard in the industry.Let's delve into the specific features, benefits, and applications of the F4BM300 PCB, showcasing why it is an essential choice for modern electronic designs.
Advanced Material Composition
The F4BM300 laminate is meticulously crafted from a scientifically formulated combination of fiberglass cloth, polytetrafluoroethylene (PTFE) resin, and PTFE film. This unique formulation enhances the electrical performance compared to its predecessor, the F4B300. The key advantages include lower dielectric loss, increased insulation resistance, and improved thermal stability. By replacing similar foreign products, the F4BM300 offers a competitive edge in both quality and cost-effectiveness.
Comparison with F4BME300
While the F4BM300 shares the same dielectric layer as the F4BME300, the two differ in their copper foil combinations. The F4BM300 utilizes Electrodeposited (ED) copper foil, making it suitable for applications that do not require Passive Intermodulation (PIM) performance. In contrast, the F4BME300 is paired with reverse-treated foil (RTF) copper foil, which provides excellent PIM performance, more precise line control, and reduced conductor loss. This flexibility allows engineers to choose the best laminate based on their specific application needs.
Electrical Performance
The F4BM300 boasts impressive electrical characteristics:
- Dielectric Constant (Dk): 3.0 at 10 GHz, ensuring efficient signal transmission.
- Dissipation Factor: 0.0017 at 10 GHz, minimizing energy loss.
- Thermal Coefficient of Dk: -80 ppm/°C, providing stability across temperature fluctuations.
- Moisture Absorption: ≤0.08%, ensuring reliability in humid environments.
- Flammability Rating: UL-94 V0, meeting stringent safety standards.
Construction and Dimensions
This PCB features a 2-layer rigid design, composed of:
- Copper Layer 1: 35 μm
- F4BM300 Core: 1.524 mm
- Copper Layer 2: 35 μm
The finished board has a thickness of 1.6 mm and adheres to precise dimensional tolerances. The board dimensions are 700 mm x 40 mm, with a tolerance of +/- 0.15 mm, making it suitable for intricate designs. The minimum trace/space is 5/5 mils, and the minimum hole size is 0.4 mm, allowing for complex routing.
Quality Assurance
Quality is paramount in PCB manufacturing, and the F4BM300 is no exception. Each board undergoes a rigorous 100% electrical test before shipment, ensuring that it meets the high standards expected by our customers. This PCB complies with IPC-Class-2 standards, guaranteeing its reliability in a wide range of applications.
Versatile Applications
The F4BM300 PCB is designed for a variety of demanding applications, including:
- Microwave, RF, and Radar Systems: Its low loss and high stability make it ideal for high-frequency applications.
- Phase Shifters and Power Dividers: The laminate's precise dielectric control is crucial for effective signal management.
- Feed Networks and Antenna Systems: Ideal for phase-sensitive and phased array antennas, ensuring optimal performance.
- Satellite Communications: Reliability in extreme conditions makes it suitable for aerospace applications.
- Base Station Antennas: Its robust design supports the growing demand for telecommunications infrastructure.
Conclusion
The F4BM300 PCB represents a significant advancement in laminate technology, combining superior electrical properties with exceptional dimensional stability. Its versatility and reliability make it an excellent choice for engineers and designers seeking high-performance solutions in various applications. As the electronic landscape continues to evolve, the F4BM300 positions itself as a reliable partner for innovation and success.
For more information on the F4BM300 PCB and any inquiry for this PCB, please contact our sales team. We are committed to providing you with the highest quality products and support for your electronic project needs.