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| Material: | TP440 | Layer Count: | 2-layer |
|---|---|---|---|
| PCB Size: | 33.12mm X 42.5 Mm=1PCS, +/- 0.15mm | PCB Thickness: | 0.8 Mm |
| Copper Weight: | 1oz (1.4 Mils) Outer Layers | Surface Finish: | Immersion Gold |
| Highlight: | Immersion Gold Circuit Board PCB,2-Layer Immersion Gold Circuit Board,0.8mm Immersion Gold Circuit Board |
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Introducing the Wangling TP PCB, a revolutionary high-frequency thermoplastic circuit board designed to meet the demanding needs of modern electronic applications. Utilizing a unique composite of ceramics and polyphenylene oxide resin (PPO), the TP material offers exceptional dielectric performance while eliminating the need for fiberglass reinforcement. This innovative design allows for precise adjustments to the dielectric constant, making it an ideal choice for a wide range of applications, including GPS antennas, missile-borne systems, fuzes, and miniaturized antennas.
Key Features
The Wangling TP PCB boasts a versatile dielectric constant that can be tailored from 3 to 25, depending on circuit requirements. This flexibility enables engineers to achieve stable performance across various applications, with common dielectric constants including 3.0, 4.4, 6.0, 6.15, 9.2, 9.6, 10.2, 11, 16, and 20. Notably, the dielectric loss remains low, with minimal variation even at frequencies up to 10 GHz, ensuring reliable signal integrity.
Designed for extreme environments, the TP material exhibits a long-term operating temperature range from -100°C to +150°C. While it excels in low-temperature resistance, care must be taken at temperatures exceeding 180°C, as deformation and copper foil peeling may occur, potentially affecting electrical performance.
Available in a minimum thickness of 0.5 mm, the Wangling TP PCB can be customized in various thicknesses to suit specific design needs. It is also resistant to radiation and features low outgassing properties, making it ideal for aerospace and defense applications. The adhesion between the copper foil and dielectric is more reliable than traditional ceramic substrates with vacuum coating, enhancing overall durability.
| Name | Test condition | Unit | Value |
| Density | Normal state | g/cm3 | 1.0~2.9 |
| Moisture Absorption | Dip in distilled water of 20±2℃ for 24 hours | % | ≤0.02 |
| Peel strength | In normal state | N/cm | ≥6 |
| In the environment of alternating humidity and temperature: | N/cm | ≥4 | |
| Operating Temperature | High-low temperature cabinet | ℃ | -100～+150(Processing temperature should not exceed 200℃) |
| Thermal Conductivity | -55~288℃ | W /m /k | 0.6 |
| CTE | Temperature rise of 96℃ per hour | < 6×10-5 | |
| Shrinkage Factor | 2 hours in boiling water | % | 0.0004 |
| Surface Resistivity | 500V DC Normal state | M.Ω | ≥1×107 |
| 500V DC Constant humidity and temperature | M.Ω | ≥1×105 | |
| Volume Resistivity | Normal state | MΩ.cm | ≥1×109 |
| Constant humidity and temperature | ≥1×106 | ||
| Surface dielectric strength | Normal state | Kv/mm | ≥1.5 |
| Constant humidity and temperature | ≥1.2 | ||
| Dielectric Constant | 10GHz | εr | 3, 6, 9.6, 10.2, 10.5, 11, 16, 20, 22(±2%)(DK can be customized) |
| Dissipation Factor | 10GHz | Tgδ(εr 3-11) | ≤1×10-3 |
| Tgδ(εr 12-22) | ≤1.5×10-3 |
PCB Specifications
The 2-layer rigid PCB stackup consists of:
- Copper Layer 1: 35 μm
- TP440 Core: 0.8 mm
- Copper Layer 2: 35 μm
With board dimensions of 33.12 mm x 42.5 mm (± 0.15 mm), the PCB is compact yet capable of handling complex designs. It features a minimum trace/space of 6/9 mils and a minimum hole size of 0.3 mm, facilitating intricate circuitry layouts. The finished board thickness is 0.9 mm, with a finished copper weight of 1 oz (1.4 mils) on the outer layers.
Quality Assurance
Each PCB undergoes rigorous 100% electrical testing prior to shipment, ensuring that every unit meets the highest quality standards. The surface finish is immersion gold, providing excellent solderability and corrosion resistance. Notably, there is no top or bottom silkscreen or solder mask, offering a clean and precise design.
Applications
The Wangling TP PCB is versatile and suitable for a variety of high-frequency applications, including:
- GPS Antennas: Ideal for precision location tracking.
- Missile-Borne Systems: Engineered for reliability in critical defense applications.
- Fuzes: Designed for dependable performance under extreme conditions.
- Miniaturized Antennas: Perfect for compact devices requiring high performance.
Conclusion
The Wangling TP PCB represents a significant advancement in high-frequency circuit board technology. Its unique material composition, customizable dielectric properties, and robust performance make it an excellent choice for engineers and designers looking to push the boundaries of electronic applications. Whether you are developing sophisticated GPS systems or cutting-edge military technologies, the Wangling TP PCB delivers the reliability and performance essential for success in today’s competitive landscape.
Contact Person: Ms. Ivy Deng
Tel: 86-755-27374946
Fax: 86-755-27374848
