logo
products
PRODUCTS DETAILS
Home > Products >
TMM10i PCB 15mil Double-Layer Immersion Gold and Edge Plated

TMM10i PCB 15mil Double-Layer Immersion Gold and Edge Plated

MOQ: 1PCS
Price: USD9.99-99.99/PCS
Standard Packaging: Vacuum bags+Cartons
Delivery Period: 8-9 working days
Payment Method: T/T
Supply Capacity: 5000PCS per month
Detail Information
Place of Origin
CHINA
Brand Name
Bicheng
Certification
UL, ISO9001, IATF16949
Material:
TMM10i
Layer Count:
2-layer
PCB Size:
70mm X 70 Mm=1PCS, +/- 0.15mm
PCB Thickness:
0.254 Mm
Copper Weight:
1oz (1.4 Mils) Outer Layers
Surface Finish:
Immersion Gold And Edge Plated.
Highlight:

10mil Double-Layer Immersion Gold PCB

,

TMM10i PCB

,

Edge Plated Immersion Gold PCB

Product Description

Introducing the Rogers TMM 10i PCB, a cutting-edge printed circuit board engineered for high-performance applications in RF and microwave circuitry. Utilizing Rogers TMM 10i isotropic thermoset microwave material, this PCB is designed for optimal reliability in plated thru-hole, strip-line, and micro-strip configurations. The TMM 10i material combines the advantageous properties of ceramic and PTFE substrates, offering an ideal solution for engineers seeking high-quality performance without the complexities of traditional substrate processing.

 

Key Features

The Rogers TMM 10i PCB features an isotropic dielectric constant (Dk) of 9.80 ± 0.245, making it suitable for various high-frequency applications. With a low dissipation factor of 0.0020 at 10 GHz, this PCB minimizes signal loss, ensuring that your circuits perform at their best. The thermal coefficient of Dk is measured at -43 ppm/°K, allowing for stable performance across a range of temperatures. This PCB also boasts a decomposition temperature (Td) of 425 °C (TGA) and a matched coefficient of thermal expansion to copper, ensuring compatibility and reducing mechanical stress during operation.

 

Furthermore, the TMM 10i PCB exhibits excellent thermal conductivity of 0.76 W/mk, enhancing heat dissipation in demanding applications. Available in a thickness range of 0.0015 to 0.500 inches (± 0.0015”), it provides flexibility for various design requirements.

 

Property TMM10i Direction Units Condition Test Method
Dielectric Constant,εProcess 9.80±0.245 Z   10 GHz IPC-TM-650 2.5.5.5
Dielectric Constant,εDesign 9.9 - - 8GHz to 40 GHz Differential Phase Length Method
Dissipation Factor (process) 0.002 Z - 10 GHz IPC-TM-650 2.5.5.5
Thermal Coefficient of dielectric constant -43 - ppm/°K -55℃-125℃ IPC-TM-650 2.5.5.5
Insulation Resistance >2000 - Gohm C/96/60/95 ASTM D257
Volume Resistivity 2 x 108 - Mohm.cm - ASTM D257
Surface Resistivity 4 x 107 - Mohm - ASTM D257
Electrical Strength(dielectric strength) 267 Z V/mil - IPC-TM-650 method 2.5.6.2
Thermal Properties
Decompositioin Temperature(Td) 425 425 ℃TGA - ASTM D3850
Coefficient of Thermal Expansion - x 19 X ppm/K 0 to 140 ℃ ASTM E 831 IPC-TM-650, 2.4.41
Coefficient of Thermal Expansion - Y 19 Y ppm/K 0 to 140 ℃ ASTM E 831 IPC-TM-650, 2.4.41
Coefficient of Thermal Expansion - Z 20 Z ppm/K 0 to 140 ℃ ASTM E 831 IPC-TM-650, 2.4.41
Thermal Conductivity 0.76 Z W/m/K 80 ℃ ASTM C518
Mechanical Properties
Copper Peel Strength after Thermal Stress 5.0 (0.9) X,Y lb/inch (N/mm) after solder float 1 oz. EDC IPC-TM-650 Method 2.4.8
Flexural Strength (MD/CMD) - X,Y kpsi A ASTM D790
Flexural Modulus (MD/CMD) 1.8 X,Y Mpsi A ASTM D790
Physical Properties
Moisture Absorption (2X2) 1.27mm (0.050") 0.16 - % D/24/23 ASTM D570
3.18mm (0.125") 0.13
Specific Gravity 2.77 - - A ASTM D792
Specific Heat Capacity 0.72 - J/g/K A Calculated
Lead-Free Process Compatible YES - - - -

 

Benefits

The Rogers TMM 10i PCB is engineered to deliver exceptional mechanical properties, resisting creep and cold flow, which enhances durability over time. Its chemical resistance protects against damage during fabrication processes, increasing overall reliability. Notably, this material does not require sodium naphthenate treatment prior to electroless plating, simplifying the manufacturing process.

 

Additionally, being based on a thermoset resin allows for reliable wire-bonding, making the TMM 10i PCB an ideal choice for applications requiring robust electrical connections. This reliability is critical in high-frequency systems where performance and integrity are paramount.

 

PCB Specifications

This 2-layer rigid PCB stackup consists of:

 

- Copper Layer 1: 35 μm
- Rogers TMM 10i Core: 0.381 mm (15 mil)
- Copper Layer 2: 35 μm

 

The board dimensions are 70 mm x 70 mm (± 0.15 mm), providing a compact solution for various applications. It features a minimum trace/space of 7/6 mils and a minimum hole size of 0.4 mm, allowing for intricate design layouts. The finished board thickness is 0.5 mm, with a finished copper weight of 1 oz (1.4 mils) on the outer layers.

 

PCB Material: Ceramic, Hydrocarbon, Thermoset Polymer Composites
Designation: TMM10i
Dielectric constant: 9.80 ±0.245
Layer count: Double Layer, Multilayer, Hybrid PCB
Copper weight: 0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
Laminate thickness: 15mil (0.381mm), 20mil (0.508mm), 25mil (0.635mm), 30mil(0.762mm), 50mil (1.27mm), 60mil (1.524mm), 75mil(1.905mm), 100mil (2.54mm), 125mil (3.175mm), 150mil (3.81mm), 200mil (5.08mm), 250mil (6.35mm), 275mil (6.985mm), 300mil (7.62mm), 500mil (12.70mm)
PCB size: ≤400mm X 500mm
Solder mask: Green, Black, Blue, Yellow, Red etc.
Surface finish: Bare copper, HASL, ENIG, Immersion tin, OSP, Pure Gold Plated (No Nickle under gold) etc..

 

TMM10i PCB 15mil Double-Layer Immersion Gold and Edge Plated 0

 

Quality Assurance

Each PCB undergoes a rigorous 100% electrical test prior to shipment, ensuring that every unit meets the highest quality standards. The surface finish includes immersion gold and edge plating, enhancing solderability and durability.

 

Applications

The Rogers TMM 10i PCB is versatile and suitable for a wide range of applications, including:

 

- RF and microwave circuitry
- Power amplifiers and combiners
- Filters and couplers
- Satellite communication systems
- Global Positioning Systems (GPS) antennas
- Patch antennas
- Dielectric polarizers and lenses
- Chip testers

 

Conclusion

The Rogers TMM 10i PCB is a superior solution for engineers and designers seeking high-performance, reliable circuit boards for RF and microwave applications. With its advanced features, durability, and versatility, this PCB is poised to meet the challenges of modern electronic designs. Whether you are working on satellite communication systems or advanced RF circuitry, the TMM 10i PCB delivers the quality and performance you need to succeed in today’s competitive market. Experience the difference with Rogers TMM 10i and elevate your projects to new heights.

 

TMM10i PCB 15mil Double-Layer Immersion Gold and Edge Plated 1

products
PRODUCTS DETAILS
TMM10i PCB 15mil Double-Layer Immersion Gold and Edge Plated
MOQ: 1PCS
Price: USD9.99-99.99/PCS
Standard Packaging: Vacuum bags+Cartons
Delivery Period: 8-9 working days
Payment Method: T/T
Supply Capacity: 5000PCS per month
Detail Information
Place of Origin
CHINA
Brand Name
Bicheng
Certification
UL, ISO9001, IATF16949
Material:
TMM10i
Layer Count:
2-layer
PCB Size:
70mm X 70 Mm=1PCS, +/- 0.15mm
PCB Thickness:
0.254 Mm
Copper Weight:
1oz (1.4 Mils) Outer Layers
Surface Finish:
Immersion Gold And Edge Plated.
Minimum Order Quantity:
1PCS
Price:
USD9.99-99.99/PCS
Packaging Details:
Vacuum bags+Cartons
Delivery Time:
8-9 working days
Payment Terms:
T/T
Supply Ability:
5000PCS per month
Highlight

10mil Double-Layer Immersion Gold PCB

,

TMM10i PCB

,

Edge Plated Immersion Gold PCB

Product Description

Introducing the Rogers TMM 10i PCB, a cutting-edge printed circuit board engineered for high-performance applications in RF and microwave circuitry. Utilizing Rogers TMM 10i isotropic thermoset microwave material, this PCB is designed for optimal reliability in plated thru-hole, strip-line, and micro-strip configurations. The TMM 10i material combines the advantageous properties of ceramic and PTFE substrates, offering an ideal solution for engineers seeking high-quality performance without the complexities of traditional substrate processing.

 

Key Features

The Rogers TMM 10i PCB features an isotropic dielectric constant (Dk) of 9.80 ± 0.245, making it suitable for various high-frequency applications. With a low dissipation factor of 0.0020 at 10 GHz, this PCB minimizes signal loss, ensuring that your circuits perform at their best. The thermal coefficient of Dk is measured at -43 ppm/°K, allowing for stable performance across a range of temperatures. This PCB also boasts a decomposition temperature (Td) of 425 °C (TGA) and a matched coefficient of thermal expansion to copper, ensuring compatibility and reducing mechanical stress during operation.

 

Furthermore, the TMM 10i PCB exhibits excellent thermal conductivity of 0.76 W/mk, enhancing heat dissipation in demanding applications. Available in a thickness range of 0.0015 to 0.500 inches (± 0.0015”), it provides flexibility for various design requirements.

 

Property TMM10i Direction Units Condition Test Method
Dielectric Constant,εProcess 9.80±0.245 Z   10 GHz IPC-TM-650 2.5.5.5
Dielectric Constant,εDesign 9.9 - - 8GHz to 40 GHz Differential Phase Length Method
Dissipation Factor (process) 0.002 Z - 10 GHz IPC-TM-650 2.5.5.5
Thermal Coefficient of dielectric constant -43 - ppm/°K -55℃-125℃ IPC-TM-650 2.5.5.5
Insulation Resistance >2000 - Gohm C/96/60/95 ASTM D257
Volume Resistivity 2 x 108 - Mohm.cm - ASTM D257
Surface Resistivity 4 x 107 - Mohm - ASTM D257
Electrical Strength(dielectric strength) 267 Z V/mil - IPC-TM-650 method 2.5.6.2
Thermal Properties
Decompositioin Temperature(Td) 425 425 ℃TGA - ASTM D3850
Coefficient of Thermal Expansion - x 19 X ppm/K 0 to 140 ℃ ASTM E 831 IPC-TM-650, 2.4.41
Coefficient of Thermal Expansion - Y 19 Y ppm/K 0 to 140 ℃ ASTM E 831 IPC-TM-650, 2.4.41
Coefficient of Thermal Expansion - Z 20 Z ppm/K 0 to 140 ℃ ASTM E 831 IPC-TM-650, 2.4.41
Thermal Conductivity 0.76 Z W/m/K 80 ℃ ASTM C518
Mechanical Properties
Copper Peel Strength after Thermal Stress 5.0 (0.9) X,Y lb/inch (N/mm) after solder float 1 oz. EDC IPC-TM-650 Method 2.4.8
Flexural Strength (MD/CMD) - X,Y kpsi A ASTM D790
Flexural Modulus (MD/CMD) 1.8 X,Y Mpsi A ASTM D790
Physical Properties
Moisture Absorption (2X2) 1.27mm (0.050") 0.16 - % D/24/23 ASTM D570
3.18mm (0.125") 0.13
Specific Gravity 2.77 - - A ASTM D792
Specific Heat Capacity 0.72 - J/g/K A Calculated
Lead-Free Process Compatible YES - - - -

 

Benefits

The Rogers TMM 10i PCB is engineered to deliver exceptional mechanical properties, resisting creep and cold flow, which enhances durability over time. Its chemical resistance protects against damage during fabrication processes, increasing overall reliability. Notably, this material does not require sodium naphthenate treatment prior to electroless plating, simplifying the manufacturing process.

 

Additionally, being based on a thermoset resin allows for reliable wire-bonding, making the TMM 10i PCB an ideal choice for applications requiring robust electrical connections. This reliability is critical in high-frequency systems where performance and integrity are paramount.

 

PCB Specifications

This 2-layer rigid PCB stackup consists of:

 

- Copper Layer 1: 35 μm
- Rogers TMM 10i Core: 0.381 mm (15 mil)
- Copper Layer 2: 35 μm

 

The board dimensions are 70 mm x 70 mm (± 0.15 mm), providing a compact solution for various applications. It features a minimum trace/space of 7/6 mils and a minimum hole size of 0.4 mm, allowing for intricate design layouts. The finished board thickness is 0.5 mm, with a finished copper weight of 1 oz (1.4 mils) on the outer layers.

 

PCB Material: Ceramic, Hydrocarbon, Thermoset Polymer Composites
Designation: TMM10i
Dielectric constant: 9.80 ±0.245
Layer count: Double Layer, Multilayer, Hybrid PCB
Copper weight: 0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
Laminate thickness: 15mil (0.381mm), 20mil (0.508mm), 25mil (0.635mm), 30mil(0.762mm), 50mil (1.27mm), 60mil (1.524mm), 75mil(1.905mm), 100mil (2.54mm), 125mil (3.175mm), 150mil (3.81mm), 200mil (5.08mm), 250mil (6.35mm), 275mil (6.985mm), 300mil (7.62mm), 500mil (12.70mm)
PCB size: ≤400mm X 500mm
Solder mask: Green, Black, Blue, Yellow, Red etc.
Surface finish: Bare copper, HASL, ENIG, Immersion tin, OSP, Pure Gold Plated (No Nickle under gold) etc..

 

TMM10i PCB 15mil Double-Layer Immersion Gold and Edge Plated 0

 

Quality Assurance

Each PCB undergoes a rigorous 100% electrical test prior to shipment, ensuring that every unit meets the highest quality standards. The surface finish includes immersion gold and edge plating, enhancing solderability and durability.

 

Applications

The Rogers TMM 10i PCB is versatile and suitable for a wide range of applications, including:

 

- RF and microwave circuitry
- Power amplifiers and combiners
- Filters and couplers
- Satellite communication systems
- Global Positioning Systems (GPS) antennas
- Patch antennas
- Dielectric polarizers and lenses
- Chip testers

 

Conclusion

The Rogers TMM 10i PCB is a superior solution for engineers and designers seeking high-performance, reliable circuit boards for RF and microwave applications. With its advanced features, durability, and versatility, this PCB is poised to meet the challenges of modern electronic designs. Whether you are working on satellite communication systems or advanced RF circuitry, the TMM 10i PCB delivers the quality and performance you need to succeed in today’s competitive market. Experience the difference with Rogers TMM 10i and elevate your projects to new heights.

 

TMM10i PCB 15mil Double-Layer Immersion Gold and Edge Plated 1

Sitemap |  Privacy Policy | China Good Quality RF PCB Board Supplier. Copyright © 2020-2025 Bicheng Electronics Technology Co., Ltd . All Rights Reserved.