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RT Duroid 6006 PCB 10mil 0.254mm 2-Layer Immesion Gold

RT Duroid 6006 PCB 10mil 0.254mm 2-Layer Immesion Gold

MOQ: 1PCS
Price: USD9.99-99.99/PCS
Standard Packaging: Vacuum bags+Cartons
Delivery Period: 8-9 working days
Payment Method: T/T
Supply Capacity: 5000PCS per month
Detail Information
Place of Origin
CHINA
Brand Name
Bicheng
Certification
UL, ISO9001, IATF16949
Material:
RT Duroid 6006
Layer Count:
2-layer
PCB Size:
161.42mm X 63.57 Mm=4 Types=4PCS, +/- 0.15mm
PCB Thickness:
10 Mil
Copper Weight:
1oz (1.4 Mils) Outer Layers
Surface Finish:
Immersion Gold
Highlight:

Immesion Gold RT duroid 6006 PCB

,

10mil RT duroid 6006 PCB

Product Description

Introducing a newly shipped PCB based on RT/Duroid 6006 substrate. It is designed for high-performance electronic and microwave applications. Utilizing Rogers RT/Duroid 6006 laminates, this PCB offers exceptional dielectric properties, making it ideal for compact circuit designs without compromising on performance. Its robust construction and reliable features are tailored for applications operating at X-band or below.

 

Key Features

- Material Composition: Made from Rogers RT/Duroid 6006 ceramic-PTFE composites.
- Dielectric Constant (Dk): 6.15 ± 0.15 at 10 GHz/23°C for superior circuit performance.
- Dissipation Factor: Low loss with a dissipation factor of 0.0027 at 10 GHz/23°C, ensuring efficiency.
- Thermal Stability: Thermal degradation temperature exceeding 500 °C (TGA).
- Moisture Resistance: Extremely low moisture absorption at 0.05%, enhancing reliability.
- Coefficient of Thermal Expansion (CTE): X-axis: 47 ppm/°C, Y-axis: 34 ppm/°C, Z-axis: 117 ppm/°C for dimensional stability.
- Copper Foil: Clad with standard and reverse treated electrodeposited copper foil.

 

Property RT/duroid 6006 Direction Units Condition Test Method
Dielectric Constant,εProcess 6.15±0.15 Z   10 GHz/23℃ IPC-TM-650 2.5.5.5 Clamped stripline
Dielectric Constant,εDesign 6.45 Z   8GHz to 40 GHz Differential Phase Length Method
Dissipation Factor,tanδ 0.0027 Z   10 GHz/A IPC-TM-650 2.5.5.5
Thermal Coefficient of ε -410 Z ppm/℃ -50℃-170℃ IPC-TM-650 2.5.5.5
Volume Resistivity 7 x 107   Mohm.cm A IPC 2.5.17.1
Surface Resistivity 2 x 107   Mohm A IPC 2.5.17.1
Tensile Properties ASTM D638 (0.1/min. strain rate)
Young's Modulus 627(91) 517(75) X Y MPa(kpsi) A
Ultimate Stress 20(2.8) 17(2.5) X Y MPa(kpsi) A
Ultimate Strain 12 to 13 4 to 6 X Y % A
Compressive Properties   ASTM D695 (0.05/min. strain rate)
Young's Modulus 1069 (115) Z MPa(kpsi) A
Ultimate Stress 54(7.9) Z MPa(kpsi) A
Ultimate Strain 33 Z %  
Flexural Modulus 2634 (382) 1951 (283) X MPa(kpsi) A ASTM D790
Ultimate Stress 38 (5.5) X Y MPa(kpsi) A
Deformation under load 0.33 2.1 Z Z % 24hr/50℃/7MPa 24hr/150℃/7MPa ASTM D261
Moisture Absorption 0.05   % D48/50℃ 0.050"(1.27mm) thick IPC-TM-650 2.6.2.1
Thermal Conductivity 0.49   W/m/k 80℃ ASTM C518
Coefficient of Thermal Expansion 47
34
117
X
Y
Z
ppm/℃ 23℃/50% RH IPC-TM-650 2.4.41
Td 500   ℃ TGA   ASTM D3850
Density 2.7   g/cm3   ASTM D792
Specific Heat 0.97(0.231)   j/g/k
(BTU/ib/OF)
  Calculated
Copper Peel 14.3 (2.5)   pli (N/mm) after solder float IPC-TM-650 2.4.8
Flammability V-0       UL 94
Lead-free Process Compatible Yes        

 

Benefits

- Circuit Size Reduction: High dielectric constant enables smaller circuit designs.
- Low Loss Performance: Optimized for X-band applications, minimizing signal loss.
- Repeatable Performance: Tight control of εr and thickness ensures consistency across productions.
- Reliability: Features reliable plated through-holes for multi-layer board designs.

 

PCB Specifications

Stackup: 2-layer rigid PCB

 

Copper Layer 1: 35 μm

RT/Duroid 6006: 0.254 mm (10 mil)

Copper Layer 2: 35 μm

 

The board dimensions measure 161.42 mm x 63.57 mm (± 0.15 mm), with a minimum trace/space of 4/6 mils and a minimum hole size of 0.4 mm. The finished board thickness is 0.4 mm, with a finished copper weight of 1 oz (1.4 mils) on the outer layers, ensuring durability and robustness in performance.

 

RT Duroid 6006 PCB 10mil 0.254mm 2-Layer Immesion Gold 0

 

Quality Assurance

Each RT/Duroid 6006 PCB undergoes rigorous 100% electrical testing prior to shipment, ensuring that every unit meets the highest quality standards. This commitment to quality gives customers peace of mind, knowing that they are receiving a product that has been thoroughly vetted for performance.

 

Applications
The RT/Duroid 6006 PCB is versatile and can be used in various applications, including:

 

Patch Antennas: Ideal for compact antenna designs that require high performance.


Satellite Communication Systems: Perfect for the demanding environment of satellite technology.


Power Amplifiers: Supports high-frequency applications without significant signal loss.


Aircraft Collision Avoidance Systems: Provides the reliability needed in critical aerospace applications.


Ground Radar Warning Systems: Essential for systems that require high reliability and performance.

 

PCB Material: Ceramic-PTFE Composites
Designation: RT/duroid 6006
Dielectric constant: 6.15
Dissipation Factor 0.0027 10GHz
Layer count: Double Sided PCB, Multilayer PCB, Hybrid PCB
Copper weight: 0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
PCB thickness: 10mil(0.254mm), 25mil (0.635mm), 50mil (1.27mm), 75mil (1.905mm), 100mil(2.54mm)
PCB size: ≤400mm X 500mm
Solder mask: Green, Black, Blue, Yellow, Red etc.
Surface finish: Bare copper, HASL, ENIG, Immersion silver, Immersion tin, OSP, Pure gold plated etc..
products
PRODUCTS DETAILS
RT Duroid 6006 PCB 10mil 0.254mm 2-Layer Immesion Gold
MOQ: 1PCS
Price: USD9.99-99.99/PCS
Standard Packaging: Vacuum bags+Cartons
Delivery Period: 8-9 working days
Payment Method: T/T
Supply Capacity: 5000PCS per month
Detail Information
Place of Origin
CHINA
Brand Name
Bicheng
Certification
UL, ISO9001, IATF16949
Material:
RT Duroid 6006
Layer Count:
2-layer
PCB Size:
161.42mm X 63.57 Mm=4 Types=4PCS, +/- 0.15mm
PCB Thickness:
10 Mil
Copper Weight:
1oz (1.4 Mils) Outer Layers
Surface Finish:
Immersion Gold
Minimum Order Quantity:
1PCS
Price:
USD9.99-99.99/PCS
Packaging Details:
Vacuum bags+Cartons
Delivery Time:
8-9 working days
Payment Terms:
T/T
Supply Ability:
5000PCS per month
Highlight

Immesion Gold RT duroid 6006 PCB

,

10mil RT duroid 6006 PCB

Product Description

Introducing a newly shipped PCB based on RT/Duroid 6006 substrate. It is designed for high-performance electronic and microwave applications. Utilizing Rogers RT/Duroid 6006 laminates, this PCB offers exceptional dielectric properties, making it ideal for compact circuit designs without compromising on performance. Its robust construction and reliable features are tailored for applications operating at X-band or below.

 

Key Features

- Material Composition: Made from Rogers RT/Duroid 6006 ceramic-PTFE composites.
- Dielectric Constant (Dk): 6.15 ± 0.15 at 10 GHz/23°C for superior circuit performance.
- Dissipation Factor: Low loss with a dissipation factor of 0.0027 at 10 GHz/23°C, ensuring efficiency.
- Thermal Stability: Thermal degradation temperature exceeding 500 °C (TGA).
- Moisture Resistance: Extremely low moisture absorption at 0.05%, enhancing reliability.
- Coefficient of Thermal Expansion (CTE): X-axis: 47 ppm/°C, Y-axis: 34 ppm/°C, Z-axis: 117 ppm/°C for dimensional stability.
- Copper Foil: Clad with standard and reverse treated electrodeposited copper foil.

 

Property RT/duroid 6006 Direction Units Condition Test Method
Dielectric Constant,εProcess 6.15±0.15 Z   10 GHz/23℃ IPC-TM-650 2.5.5.5 Clamped stripline
Dielectric Constant,εDesign 6.45 Z   8GHz to 40 GHz Differential Phase Length Method
Dissipation Factor,tanδ 0.0027 Z   10 GHz/A IPC-TM-650 2.5.5.5
Thermal Coefficient of ε -410 Z ppm/℃ -50℃-170℃ IPC-TM-650 2.5.5.5
Volume Resistivity 7 x 107   Mohm.cm A IPC 2.5.17.1
Surface Resistivity 2 x 107   Mohm A IPC 2.5.17.1
Tensile Properties ASTM D638 (0.1/min. strain rate)
Young's Modulus 627(91) 517(75) X Y MPa(kpsi) A
Ultimate Stress 20(2.8) 17(2.5) X Y MPa(kpsi) A
Ultimate Strain 12 to 13 4 to 6 X Y % A
Compressive Properties   ASTM D695 (0.05/min. strain rate)
Young's Modulus 1069 (115) Z MPa(kpsi) A
Ultimate Stress 54(7.9) Z MPa(kpsi) A
Ultimate Strain 33 Z %  
Flexural Modulus 2634 (382) 1951 (283) X MPa(kpsi) A ASTM D790
Ultimate Stress 38 (5.5) X Y MPa(kpsi) A
Deformation under load 0.33 2.1 Z Z % 24hr/50℃/7MPa 24hr/150℃/7MPa ASTM D261
Moisture Absorption 0.05   % D48/50℃ 0.050"(1.27mm) thick IPC-TM-650 2.6.2.1
Thermal Conductivity 0.49   W/m/k 80℃ ASTM C518
Coefficient of Thermal Expansion 47
34
117
X
Y
Z
ppm/℃ 23℃/50% RH IPC-TM-650 2.4.41
Td 500   ℃ TGA   ASTM D3850
Density 2.7   g/cm3   ASTM D792
Specific Heat 0.97(0.231)   j/g/k
(BTU/ib/OF)
  Calculated
Copper Peel 14.3 (2.5)   pli (N/mm) after solder float IPC-TM-650 2.4.8
Flammability V-0       UL 94
Lead-free Process Compatible Yes        

 

Benefits

- Circuit Size Reduction: High dielectric constant enables smaller circuit designs.
- Low Loss Performance: Optimized for X-band applications, minimizing signal loss.
- Repeatable Performance: Tight control of εr and thickness ensures consistency across productions.
- Reliability: Features reliable plated through-holes for multi-layer board designs.

 

PCB Specifications

Stackup: 2-layer rigid PCB

 

Copper Layer 1: 35 μm

RT/Duroid 6006: 0.254 mm (10 mil)

Copper Layer 2: 35 μm

 

The board dimensions measure 161.42 mm x 63.57 mm (± 0.15 mm), with a minimum trace/space of 4/6 mils and a minimum hole size of 0.4 mm. The finished board thickness is 0.4 mm, with a finished copper weight of 1 oz (1.4 mils) on the outer layers, ensuring durability and robustness in performance.

 

RT Duroid 6006 PCB 10mil 0.254mm 2-Layer Immesion Gold 0

 

Quality Assurance

Each RT/Duroid 6006 PCB undergoes rigorous 100% electrical testing prior to shipment, ensuring that every unit meets the highest quality standards. This commitment to quality gives customers peace of mind, knowing that they are receiving a product that has been thoroughly vetted for performance.

 

Applications
The RT/Duroid 6006 PCB is versatile and can be used in various applications, including:

 

Patch Antennas: Ideal for compact antenna designs that require high performance.


Satellite Communication Systems: Perfect for the demanding environment of satellite technology.


Power Amplifiers: Supports high-frequency applications without significant signal loss.


Aircraft Collision Avoidance Systems: Provides the reliability needed in critical aerospace applications.


Ground Radar Warning Systems: Essential for systems that require high reliability and performance.

 

PCB Material: Ceramic-PTFE Composites
Designation: RT/duroid 6006
Dielectric constant: 6.15
Dissipation Factor 0.0027 10GHz
Layer count: Double Sided PCB, Multilayer PCB, Hybrid PCB
Copper weight: 0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
PCB thickness: 10mil(0.254mm), 25mil (0.635mm), 50mil (1.27mm), 75mil (1.905mm), 100mil(2.54mm)
PCB size: ≤400mm X 500mm
Solder mask: Green, Black, Blue, Yellow, Red etc.
Surface finish: Bare copper, HASL, ENIG, Immersion silver, Immersion tin, OSP, Pure gold plated etc..
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