RO4003 LoPro PCB 32.7mil 2-Layer Immersion Silver

The RO4003C Low Profile PCB leverages Rogers’ proprietary technology, which combines reverse treated foil with standard RO4003C dielectric. This unique construction results in a laminate that not only reduces conductor loss but also enhances signal integrity, making it ideal for high-frequency applications.

The integration of hydrocarbon ceramic materials allows for superior performance at high frequencies while maintaining cost-effectiveness in manufacturing. This PCB can be fabricated using standard epoxy/glass (FR-4) processes, eliminating the need for specialized via preparation techniques, thus reducing overall production costs.

Key Features
The RO4003C Low Profile PCB boasts several impressive specifications that cater to the needs of modern electronic designs:

Dielectric Constant: With a dielectric constant of 3.38 ± 0.05 at 10 GHz, this PCB ensures stable signal transmission and minimal signal degradation.

Dissipation Factor: A low dissipation factor of 0.0027 at 10 GHz indicates reduced energy loss, enhancing overall efficiency.

Thermal Stability: The PCB has a thermal decomposition temperature (Td) greater than 425°C and a high glass transition temperature (Tg) exceeding 280°C, ensuring reliability under high-temperature conditions.

Thermal Conductivity: With a thermal conductivity of 0.64 W/mK, it effectively dissipates heat, which is crucial for maintaining performance in high-power applications.

Low Coefficient of Thermal Expansion (CTE): The Z-axis CTE is 46 ppm/°C, closely matched to copper, which minimizes stress and potential failures during thermal cycling.

Benefits of the RO4003C Low Profile PCB
The RO4003C Low Profile PCB is designed to provide numerous advantages for high-frequency electronic applications:

Lower Insertion Loss: The combination of low conductor loss and optimized dielectric properties allows designs to operate at frequencies greater than 40 GHz, making it suitable for cutting-edge applications in telecommunications and data transfer.

Reduced Passive Inter-Modulation (PIM): This feature is particularly beneficial for base station antennas, where minimizing intermodulation distortion is critical for signal clarity and performance.

Enhanced Thermal Performance: The PCB's design facilitates improved heat dissipation, reducing the likelihood of thermal-related failures and ensuring long-term reliability.

Multilayer PCB Capability: The design flexibility offered by the RO4003C allows for the creation of complex multilayer PCBs, accommodating a variety of electronic components and configurations.

Environmental Compliance: This PCB meets modern environmental standards and is CAF resistant, addressing the industry's increasing focus on sustainability and reliability.

Construction and Specifications

This PCB is constructed as a 2-layer rigid PCB with the following specifications:

Board Dimensions: 77.4 mm x 39.3 mm, allowing for compact designs while integrating multiple components.
 

Minimum Trace/Space: 4/5 mils, enabling high-density circuit layouts.
 

Minimum Hole Size: 0.3 mm, accommodating various component types.
 

Finished Board Thickness: 0.91 mm, providing robust structural integrity.
 

Copper Weight: 1 oz (1.4 mils) for outer layers, ensuring reliable electrical connections.
 

Surface Finish: Immersion silver, which enhances solderability and protects against oxidation.
 

Electrical Testing: 100% electrical testing is conducted prior to shipment, ensuring quality and reliability.

Typical Applications
The RO4003C Low Profile PCB is suitable for:

Digital applications (servers, routers, high-speed backplanes)
Cellular base station antennas and power amplifiers
LNBs for direct broadcast satellites
RF identification tags