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50mil RO3210 PCB 2-Layer Green Soldermask Immersion Gold

China Bicheng Electronics Technology Co., Ltd certification
China Bicheng Electronics Technology Co., Ltd certification
Kevin, Received and tested the boards - thanks very much. These are perfect, exactly what we needed. rgds Rich

—— Rich Rickett

Ruth, I got the PCB today, and they are just perfect. Please stay a little patience, my next order is coming soon. Kind regards from Hamburg Olaf

—— Olaf Kühnhold

Hi Natalie. It was perfect, I attach some pictures for your reference. And I send you next 2 projects to budget. Thanks a lot again

—— Sebastian Toplisek

Kevin, Thanks, they were perfectly made, and work well. As promised, here are the links for my latest project, using the PCBs you manufactured for me: Regards, Daniel

—— Daniel Ford

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50mil RO3210 PCB 2-Layer Green Soldermask Immersion Gold

50mil RO3210 PCB 2-Layer Green Soldermask Immersion Gold
50mil RO3210 PCB 2-Layer Green Soldermask Immersion Gold 50mil RO3210 PCB 2-Layer Green Soldermask Immersion Gold 50mil RO3210 PCB 2-Layer Green Soldermask Immersion Gold

Large Image :  50mil RO3210 PCB 2-Layer Green Soldermask Immersion Gold

Product Details:
Place of Origin: CHINA
Brand Name: Bicheng
Certification: UL, ISO9001, IATF16949
Payment & Shipping Terms:
Minimum Order Quantity: 1PCS
Price: USD9.99-99.99/PCS
Packaging Details: Vacuum bags+Cartons
Delivery Time: 8-9 working days
Payment Terms: T/T
Supply Ability: 5000PCS per month
Detailed Product Description
Material: RO3210 Layer Count: 2-layer
PCB Size: 197.5mm X 77.3 Mm=1PCS, +/- 0.15mm PCB Thickness: 50 Mil
Copper Weight: 1oz (1.4 Mils) Outer Layers Surface Finish: Immersion Gold
Highlight:

Immersion Gold PCB

,

50mil PCB

The Rogers RO3210 PCB is a cutting-edge high-frequency circuit material specifically engineered for exceptional electrical performance and enhanced mechanical stability. This innovative product is made from ceramic-filled laminates reinforced with woven fiberglass, providing a unique combination of surface smoothness and rigidity. The RO3210 laminates blend the benefits of non-woven PTFE for finer line etching tolerances with the structural integrity of woven-glass PTFE, making them ideal for high-performance printed circuit boards.

 

Key Features
The RO3210 boasts a variety of impressive features:

 

- Dielectric Constant (Dk): 10.2 ± 0.5, optimized for high-frequency applications.
 

- Dissipation Factor: 0.0027 at 10 GHz, ensuring minimal energy loss.
 

- Coefficient of Thermal Expansion: Matched to copper, with values of 13 ppm/°C in the X and Y axes and 34 ppm/°C in the Z axis.
 

- Decomposition Temperature (Td): 500 °C, providing thermal stability under high-temperature conditions.
 

- Thermal Conductivity: 0.81 W/mK, facilitating effective heat dissipation.
 

- Flammability Rating: V0 according to UL 94 standard, ensuring safety in various applications.

 

Property RO3210 Direction Units Condition Test Method
Dielectric Constant,εProcess 10.2±0.5 Z   10 GHz 23 IPC-TM-650 2.5.5.5 Clamped Stripline
Dielectric Constant,εDesign 10.8 Z   8GHz to 40 GHz Differential Phase Length Method
Dissipation Factor,tanδ 0.0027 Z   10 GHz 23 IPC-TM-650 2.5.5.5
Thermal Coefficient of ε -459 Z ppm/ 10 GHz 0to 100 IPC-TM-650 2.5.5.5
Dimensional Stability 0.8 X, Y mm/m COND A ASTM D257
Volume Resistivity 103   MΩ.cm COND A IPC 2.5.17.1
Surface Resistivity 103   COND A IPC 2.5.17.1
Tensile Modulus 579
517
MD
CMD
kpsi 23 ASTM D 638
Water Absorption 0.1 - % D24/23 IPC-TM-650 2.6.2.1
Specific Heat 0.79   j/g/k   Calculated
Thermal Conductivity 0.81   W/M/K 80 ASTM C518
Coefficient of Thermal Expansion
(-55 to 288
)
13
34

 
X,Y
Z
ppm/ 23/50% RH IPC-TM-650 2.4.4.1
Td 500   TGA ASTM D3850
Density 3   gm/cm3    
Copper Peel Stength 11   pli 1oz,EDC After Solder Float IPC-TM 2.4.8
Flammability V-0       UL 94
Lead-free Process Compatible Yes        

 

Benefits
The Rogers RO3210 PCB offers numerous advantages:

 

- Improved Rigidity: The woven glass reinforcement enhances rigidity, making handling easier during assembly.
 

- Uniform Performance: Provides consistent electrical and mechanical properties, ideal for complex multi-layer high-frequency structures.
 

- Low Expansion Coefficient: The in-plane expansion coefficients are matched to copper, making it suitable for hybrid designs and reliable surface-mounted assemblies.
 

- Dimensional Stability: Excellent stability ensures high production yields, reducing waste and increasing efficiency.
 

- Surface Smoothness: Allows for finer line etching tolerances, enhancing design flexibility and precision.

 

50mil RO3210 PCB 2-Layer Green Soldermask Immersion Gold 0

 

Technical Specifications
 

The Rogers RO3210 PCB features a 2-layer rigid stackup:

 

- Copper Layer 1: 35 μm
- RO3210 Core: 1.27 mm (50 mil)
- Copper Layer 2: 35 μm

 

The board dimensions are 197.5 mm x 77.3 mm, with a total thickness of 1.4 mm. The PCB supports a minimum trace/space of 4/7 mils and a minimum hole size of 0.4 mm. Each board undergoes 100% electrical testing prior to shipment to guarantee quality and reliability.

 

The Rogers RO3210 PCB is suitable for a variety of applications, including automotive collision avoidance systems, GPS antennas, wireless telecommunications systems, microstrip patch antennas, direct broadcast satellites, data links in cable systems, remote meter readers, power backplanes, LMDS and wireless broadband, and base station infrastructure. Its versatility and high performance make it an invaluable asset in various industries.

 

In conclusion, the Rogers RO3210 PCB combines innovative material technology with cost-effective manufacturing solutions, making it an excellent choice for engineers and manufacturers seeking reliable, high-performance circuit boards. For more information or to place an order, please contact our sales team or visit our website. Experience the reliability and efficiency of the Rogers RO3210 PCB in your next project.

 

50mil RO3210 PCB 2-Layer Green Soldermask Immersion Gold 1

Contact Details
Bicheng Electronics Technology Co., Ltd

Contact Person: Ms. Ivy Deng

Tel: 86-755-27374946

Fax: 86-755-27374848

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