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25mil RF-10 PCB Double-Sided 1OZ Copper Immersion Tin Finished

25mil RF-10 PCB Double-Sided 1OZ Copper Immersion Tin Finished

MOQ: 1PCS
Price: USD9.99-99.99/PCS
Standard Packaging: Vacuum bags+Cartons
Delivery Period: 8-9 working days
Payment Method: T/T
Supply Capacity: 5000PCS per month
Detail Information
Place of Origin
CHINA
Brand Name
Bicheng
Certification
UL, ISO9001, IATF16949
Material:
RF-10
Layer Count:
2-layer
PCB Size:
163.9mm X 104.9mm=2Types =2PCS, +/- 0.15mm
PCB Thickness:
25mil
Copper Weight:
1oz (1.4 Mils) Outer Layers
Surface Finish:
Immersion Tin
Highlight:

Immersion Tin Finished PCB

,

25mil PCB

,

Double-Sided RF PCB

Product Description

RF-10 PCBs are advanced composites of ceramic-filled PTFE and woven fiberglass, designed for high-performance RF applications. Offering a high dielectric constant and low dissipation factor, RF-10 provides exceptional dimensional stability and ease of handling for multilayer circuits.

 

Key Features:

Dielectric Constant: 10.2 ± 0.3 at 10GHz
Dissipation Factor: 0.0025 at 10GHz
High Thermal Conductivity: 0.85 W/mk (Unclad)
CTE: x 16 ppm/°C, y 20 ppm/°C, z 25 ppm/°C
Low Moisture Absorption: 0.08%
Flammability Rating: V-0

 

Benefits:

High DK for RF circuit size reduction
Excellent dimensional stability
Tight DK tolerance
High thermal conductivity for enhanced thermal management
Strong adhesion to smooth coppers
Low X, Y, Z expansion
Excellent price/performance ratio

 

RF-10 Typical Values
Property Test Method Unit Value Unit Value
Dk @ 10 GHz IPC-650 2.5.5.5.1 Mod.   10.2 ± 0.3   10.2 ± 0.3
Df @ 10 GHz IPC-650 2.5.5.5.1 Mod.   0.0025   0.0025
TcK† (-55 to 150 °C) IPC-650 2.5.5.6 ppm/°C -370 ppm/°C -370
Moisture Absorption IPC-650 2.6.2.1 % 0.08 % 0.08
Peel Strength (1 oz. RT copper) IPC-650 2.4.8 (solder) lbs/in 10 N/mm 1.7
Volume Resistivity IPC-650 2.5.17.1 Mohm/cm 6.0 x 107 Mohm/cm 6.0 x 107
Surface Resistivity IPC-650 2.5.17.1 Mohm 1.0 x 108 Mohm 1.0 x 108
Flexural Strength (MD) IPC - 650 - 2.4.4 psi 14,000 N/mm2 96.53
Flexural Strength (CD) IPC - 650 - 2.4.4 psi 10,000 N/mm2 68.95
Tensile Strength (MD) IPC - 650 - 2.4.19 psi 8,900 N/mm2 62.57
Tensile Strength (CD) IPC - 650 - 2.4.19 psi 5,300 N/mm2 37.26
Dimensional Stability IPC-650 2.4.39 (After Etch) % (25 mil-MD) -0.0032 % (25 mil-CD) -0.0239
Dimensional Stability IPC-650 2.4.39 (After Bake) % (25 mil-MD) -0.0215 % (25 mil-CD) -0.0529
Dimensional Stability IPC-650 2.4.39 (After Stress) % (25 mil-MD) -0.0301 % (25 mil-CD) -0.0653
Dimensional Stability IPC-650 2.4.39 (After Etch) % (60 mil-MD) -0.0027 % (60 mil-CD) -0.0142
Dimensional Stability IPC-650 2.4.39 (After Bake) % (60 mil-MD) -0.1500 % (60 mil-CD) -0.0326
Dimensional Stability IPC-650 2.4.39 (After Stress) % (60 mil-MD) -0.0167 % (60 mil-CD) -0.0377
Density (Specific Gravity) IPC-650-2.3.5 g/cm3 2.77 g/cm3 2.77
Specific Heat IPC-650-2.4.50 J/g°C 0.9 J/g°C 0.9
Thermal Conductivity (Unclad) IPC-650-2.4.50 W/M*K 0.85 W/M*K 0.85
CTE (X -Y axis) (50 to 150 °C) IPC-650 2.4.41 ppm/°C 16-20 ppm/°C 16-20
CTE (Z axis) (50 to 150 °C) IPC-650 2.4.41 ppm/°C 25 ppm/°C 25
Flammability Rating Internal   V-0   V-0


This PCB features a precise stackup configuration comprising Copper_layer_1 and Copper_layer_2 each measuring 35μm (1oz) in thickness, sandwiching the RF-10 Core layer at 25 mil (0.635mm). With a board size of 163.9mm x 104.9mm ± 0.15mm, the PCB maintains a minimum trace/space of 4/4 mils for optimal signal integrity and component spacing.

 

Mechanically, this PCB offers a minimum hole size of 0.5mm and a finished board thickness of 0.75mm, ensuring structural stability and flexibility during installation. The copper weight of 1oz (1.4 mils) on the outer layers, along with a 20 μm via plating thickness, supports efficient signal transmission and secure interconnections between layers.

 

It is finished with Immersion Tin for enhanced solderability and protection against oxidation. A white top silkscreen aids in component identification, while a green top solder mask provides environmental protection. Rigorous 100% electrical testing before shipment guarantees quality and adherence to design specifications, ensuring reliable performance in diverse applications.

 

25mil RF-10 PCB Double-Sided 1OZ Copper Immersion Tin Finished 0

 

The artwork format for this PCB follows the industry-standard Gerber RS-274-X format, ensuring compatibility with common design tools and manufacturing processes. Adhering to the IPC-Class-2 quality standard, the PCB meets stringent criteria for manufacturing and assembly, guaranteeing reliable performance in various applications.

 

With availability worldwide, the RF-10 PCB offers global accessibility for projects and industries requiring high-performance RF solutions.

 

Applications:

Microstrip Patch Antennas
GPS Antennas
Passive Components (filters, couplers, power dividers)
Aircraft Collision Avoidance Systems
Satellite Components

 

PCB Material: Composites of Ceramic Filled PTFE and Woven Fiberglass
Designation: RF-10
Dielectric constant: 10.2
Dissipation Factor 0.0025 10GHz
Layer count: Double Sided PCB, Multilayer PCB, Hybrid PCB
Copper weight: 0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
PCB thickness: 10mil (0.254mm), 20mil (0.508mm), 25mil (0.635mm), 60mil (1.524mm ), 125mil ( 3.175mm )
PCB size: ≤400mm X 500mm
Solder mask: Green, Black, Blue, Yellow, Red etc.
Surface finish: Bare copper, HASL, ENIG, Immersion silver, Immersion tin, OSP etc..
products
PRODUCTS DETAILS
25mil RF-10 PCB Double-Sided 1OZ Copper Immersion Tin Finished
MOQ: 1PCS
Price: USD9.99-99.99/PCS
Standard Packaging: Vacuum bags+Cartons
Delivery Period: 8-9 working days
Payment Method: T/T
Supply Capacity: 5000PCS per month
Detail Information
Place of Origin
CHINA
Brand Name
Bicheng
Certification
UL, ISO9001, IATF16949
Material:
RF-10
Layer Count:
2-layer
PCB Size:
163.9mm X 104.9mm=2Types =2PCS, +/- 0.15mm
PCB Thickness:
25mil
Copper Weight:
1oz (1.4 Mils) Outer Layers
Surface Finish:
Immersion Tin
Minimum Order Quantity:
1PCS
Price:
USD9.99-99.99/PCS
Packaging Details:
Vacuum bags+Cartons
Delivery Time:
8-9 working days
Payment Terms:
T/T
Supply Ability:
5000PCS per month
Highlight

Immersion Tin Finished PCB

,

25mil PCB

,

Double-Sided RF PCB

Product Description

RF-10 PCBs are advanced composites of ceramic-filled PTFE and woven fiberglass, designed for high-performance RF applications. Offering a high dielectric constant and low dissipation factor, RF-10 provides exceptional dimensional stability and ease of handling for multilayer circuits.

 

Key Features:

Dielectric Constant: 10.2 ± 0.3 at 10GHz
Dissipation Factor: 0.0025 at 10GHz
High Thermal Conductivity: 0.85 W/mk (Unclad)
CTE: x 16 ppm/°C, y 20 ppm/°C, z 25 ppm/°C
Low Moisture Absorption: 0.08%
Flammability Rating: V-0

 

Benefits:

High DK for RF circuit size reduction
Excellent dimensional stability
Tight DK tolerance
High thermal conductivity for enhanced thermal management
Strong adhesion to smooth coppers
Low X, Y, Z expansion
Excellent price/performance ratio

 

RF-10 Typical Values
Property Test Method Unit Value Unit Value
Dk @ 10 GHz IPC-650 2.5.5.5.1 Mod.   10.2 ± 0.3   10.2 ± 0.3
Df @ 10 GHz IPC-650 2.5.5.5.1 Mod.   0.0025   0.0025
TcK† (-55 to 150 °C) IPC-650 2.5.5.6 ppm/°C -370 ppm/°C -370
Moisture Absorption IPC-650 2.6.2.1 % 0.08 % 0.08
Peel Strength (1 oz. RT copper) IPC-650 2.4.8 (solder) lbs/in 10 N/mm 1.7
Volume Resistivity IPC-650 2.5.17.1 Mohm/cm 6.0 x 107 Mohm/cm 6.0 x 107
Surface Resistivity IPC-650 2.5.17.1 Mohm 1.0 x 108 Mohm 1.0 x 108
Flexural Strength (MD) IPC - 650 - 2.4.4 psi 14,000 N/mm2 96.53
Flexural Strength (CD) IPC - 650 - 2.4.4 psi 10,000 N/mm2 68.95
Tensile Strength (MD) IPC - 650 - 2.4.19 psi 8,900 N/mm2 62.57
Tensile Strength (CD) IPC - 650 - 2.4.19 psi 5,300 N/mm2 37.26
Dimensional Stability IPC-650 2.4.39 (After Etch) % (25 mil-MD) -0.0032 % (25 mil-CD) -0.0239
Dimensional Stability IPC-650 2.4.39 (After Bake) % (25 mil-MD) -0.0215 % (25 mil-CD) -0.0529
Dimensional Stability IPC-650 2.4.39 (After Stress) % (25 mil-MD) -0.0301 % (25 mil-CD) -0.0653
Dimensional Stability IPC-650 2.4.39 (After Etch) % (60 mil-MD) -0.0027 % (60 mil-CD) -0.0142
Dimensional Stability IPC-650 2.4.39 (After Bake) % (60 mil-MD) -0.1500 % (60 mil-CD) -0.0326
Dimensional Stability IPC-650 2.4.39 (After Stress) % (60 mil-MD) -0.0167 % (60 mil-CD) -0.0377
Density (Specific Gravity) IPC-650-2.3.5 g/cm3 2.77 g/cm3 2.77
Specific Heat IPC-650-2.4.50 J/g°C 0.9 J/g°C 0.9
Thermal Conductivity (Unclad) IPC-650-2.4.50 W/M*K 0.85 W/M*K 0.85
CTE (X -Y axis) (50 to 150 °C) IPC-650 2.4.41 ppm/°C 16-20 ppm/°C 16-20
CTE (Z axis) (50 to 150 °C) IPC-650 2.4.41 ppm/°C 25 ppm/°C 25
Flammability Rating Internal   V-0   V-0


This PCB features a precise stackup configuration comprising Copper_layer_1 and Copper_layer_2 each measuring 35μm (1oz) in thickness, sandwiching the RF-10 Core layer at 25 mil (0.635mm). With a board size of 163.9mm x 104.9mm ± 0.15mm, the PCB maintains a minimum trace/space of 4/4 mils for optimal signal integrity and component spacing.

 

Mechanically, this PCB offers a minimum hole size of 0.5mm and a finished board thickness of 0.75mm, ensuring structural stability and flexibility during installation. The copper weight of 1oz (1.4 mils) on the outer layers, along with a 20 μm via plating thickness, supports efficient signal transmission and secure interconnections between layers.

 

It is finished with Immersion Tin for enhanced solderability and protection against oxidation. A white top silkscreen aids in component identification, while a green top solder mask provides environmental protection. Rigorous 100% electrical testing before shipment guarantees quality and adherence to design specifications, ensuring reliable performance in diverse applications.

 

25mil RF-10 PCB Double-Sided 1OZ Copper Immersion Tin Finished 0

 

The artwork format for this PCB follows the industry-standard Gerber RS-274-X format, ensuring compatibility with common design tools and manufacturing processes. Adhering to the IPC-Class-2 quality standard, the PCB meets stringent criteria for manufacturing and assembly, guaranteeing reliable performance in various applications.

 

With availability worldwide, the RF-10 PCB offers global accessibility for projects and industries requiring high-performance RF solutions.

 

Applications:

Microstrip Patch Antennas
GPS Antennas
Passive Components (filters, couplers, power dividers)
Aircraft Collision Avoidance Systems
Satellite Components

 

PCB Material: Composites of Ceramic Filled PTFE and Woven Fiberglass
Designation: RF-10
Dielectric constant: 10.2
Dissipation Factor 0.0025 10GHz
Layer count: Double Sided PCB, Multilayer PCB, Hybrid PCB
Copper weight: 0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
PCB thickness: 10mil (0.254mm), 20mil (0.508mm), 25mil (0.635mm), 60mil (1.524mm ), 125mil ( 3.175mm )
PCB size: ≤400mm X 500mm
Solder mask: Green, Black, Blue, Yellow, Red etc.
Surface finish: Bare copper, HASL, ENIG, Immersion silver, Immersion tin, OSP etc..
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