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Material: | Rogers TMM3 Core | Layer Count: | 2-layer |
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PCB Size: | 42.91mm X 108.31 Mm=1PCS, +/- 0.15mm | PCB Thickness: | 0.7 Mm |
Copper Weight: | 1oz (1.4 Mils) Outer Layers | Surface Finish: | Immersion Silver |
Introducing the Rogers TMM10 PCB, a premier solution designed for high-frequency applications requiring exceptional reliability and performance. Constructed from a ceramic thermoset polymer composite, the TMM10 is engineered specifically for strip-line and micro-strip configurations, offering the advantages of both PTFE and ceramic substrates without the limitations of mechanical properties and production techniques.
Key Features
- Dielectric Constant (Dk): 9.20 ± 0.23 at 10 GHz, ensuring optimal signal integrity for high-frequency applications.
- Dissipation Factor: 0.0022 at 10 GHz, minimizing energy loss and enhancing circuit efficiency.
- Thermal Coefficient of Dk: -38 ppm/°K, providing stability across varying temperatures.
- Thermal Expansion: Coefficient of thermal expansion is matched to copper, with values of 21 ppm/K (X and Y axes) and 20 ppm/K (Z-axis), reducing stress during thermal cycling.
- Decomposition Temperature (Td): 425 °C TGA, suitable for high-temperature environments.
- Thermal Conductivity: 0.76 W/m·K, facilitating effective heat management.
- Thickness Range: Available in thicknesses from 0.0015 to 0.500 inches ± 0.0015”.
TMM10 Typical Value | ||||||
Property | TMM10 | Direction | Units | Condition | Test Method | |
Dielectric Constant,εProcess | 9.20±0.23 | Z | 10 GHz | IPC-TM-650 2.5.5.5 | ||
Dielectric Constant,εDesign | 9.8 | - | - | 8GHz to 40 GHz | Differential Phase Length Method | |
Dissipation Factor (process) | 0.0022 | Z | - | 10 GHz | IPC-TM-650 2.5.5.5 | |
Thermal Coefficient of dielectric constant | -38 | - | ppm/°K | -55℃-125℃ | IPC-TM-650 2.5.5.5 | |
Insulation Resistance | >2000 | - | Gohm | C/96/60/95 | ASTM D257 | |
Volume Resistivity | 2 x 108 | - | Mohm.cm | - | ASTM D257 | |
Surface Resistivity | 4 x 107 | - | Mohm | - | ASTM D257 | |
Electrical Strength(dielectric strength) | 285 | Z | V/mil | - | IPC-TM-650 method 2.5.6.2 | |
Thermal Properties | ||||||
Decompositioin Temperature(Td) | 425 | 425 | ℃TGA | - | ASTM D3850 | |
Coefficient of Thermal Expansion - x | 21 | X | ppm/K | 0 to 140 ℃ | ASTM E 831 IPC-TM-650, 2.4.41 | |
Coefficient of Thermal Expansion - Y | 21 | Y | ppm/K | 0 to 140 ℃ | ASTM E 831 IPC-TM-650, 2.4.41 | |
Coefficient of Thermal Expansion - Z | 20 | Z | ppm/K | 0 to 140 ℃ | ASTM E 831 IPC-TM-650, 2.4.41 | |
Thermal Conductivity | 0.76 | Z | W/m/K | 80 ℃ | ASTM C518 | |
Mechanical Properties | ||||||
Copper Peel Strength after Thermal Stress | 5.0 (0.9) | X,Y | lb/inch (N/mm) | after solder float 1 oz. EDC | IPC-TM-650 Method 2.4.8 | |
Flexural Strength (MD/CMD) | 13.62 | X,Y | kpsi | A | ASTM D790 | |
Flexural Modulus (MD/CMD) | 1.79 | X,Y | Mpsi | A | ASTM D790 | |
Physical Properties | ||||||
Moisture Absorption (2X2) | 1.27mm (0.050") | 0.09 | - | % | D/24/23 | ASTM D570 |
3.18mm (0.125") | 0.2 | |||||
Specific Gravity | 2.77 | - | - | A | ASTM D792 | |
Specific Heat Capacity | 0.74 | - | J/g/K | A | Calculated | |
Lead-Free Process Compatible | YES | - | - | - | - |
Benefits
- Mechanical Resilience: The TMM10's mechanical properties effectively resist creep and cold flow, ensuring long-term reliability in demanding applications.
- Chemical Resistance: The material's resistance to process chemicals reduces the risk of damage during fabrication.
- Simplified Processing: No sodium naphthenate treatment is required before electroless plating, streamlining manufacturing processes.
- Reliable Wire-Bonding: Based on thermoset resin, the TMM10 ensures dependable wire-bonding without pad lifting or substrate deformation.
PCB Stackup
The TMM10 PCB features a robust 2-layer rigid stackup:
- Copper Layer 1: 35 μm
- Rogers TMM10 Core: 0.381 mm (15 mil)
- Copper Layer 2: 35 μm
Construction Details
- Board Dimensions: 91.2 mm x 53.5 mm (1 PCS, ± 0.15 mm)
- Minimum Trace/Space: 7/9 mils
- Minimum Hole Size: 0.30 mm
- Finished Board Thickness: 0.45 mm
- Finished Copper Weight: 1 oz (1.4 mils) on outer layers
- Via Plating Thickness: 20 μm
- Surface Finish: Immersion Gold
- Top Silkscreen: None
- Bottom Silkscreen: None
- Top Solder Mask: None
- Bottom Solder Mask: None
- Quality Assurance: 100% electrical testing is performed prior to shipment.
Artwork and Standards
- Type of Artwork Supplied: Gerber RS-274-X
- Quality Standard: IPC-Class-2
- Availability: Available worldwide.
Typical Applications
The Rogers TMM10 PCB is ideal for a diverse range of applications, including:
- RF and microwave circuitry
- Power amplifiers and combiners
- Filters and couplers
- Satellite communication systems
- Global Positioning Systems (GPS) antennas
- Patch antennas
- Dielectric polarizers and lenses
- Chip testers
Conclusion
The Rogers TMM10 PCB offers a robust and reliable solution for high-frequency applications, combining advanced material properties with exceptional performance. Whether for telecommunications, aerospace, or other high-tech applications, the TMM10 PCB is engineered to meet your demanding requirements. For more information or to place an order, please contact us today!
PCB Material: | Ceramic, Hydrocarbon, Thermoset Polymer Composites |
Designation: | TMM10 |
Dielectric constant: | 9.20 ±0.23 |
Layer count: | Double Layer, Multilayer, Hybrid PCB |
Copper weight: | 0.5oz (17 µm), 1oz (35µm), 2oz (70µm) |
PCB thickness: | 15mil (0.381mm), 20mil (0.508mm), 25mil (0.635mm), 30mil(0.762mm), 50mil (1.27mm), 60mil (1.524mm), 75mil(1.905mm), 100mil (2.54mm), 125mil (3.175mm), 150mil (3.81mm), 200mil (5.08mm), 250mil (6.35mm), 275mil (6.985mm), 300mil (7.62mm), 500mil (12.70mm) |
PCB size: | ≤400mm X 500mm |
Solder mask: | Green, Black, Blue, Yellow, Red etc. |
Surface finish: | Bare copper, HASL, ENIG, OSP etc.. |
Unlocking the Potential of Rogers TMM10 PCB: A Breakthrough in High-Frequency Reliability
In the fast-paced world of electronics, the demand for high-performance printed circuit boards (PCBs) is ever-increasing, particularly in high-frequency applications like telecommunications and aerospace. The Rogers TMM10 PCB stands out as a revolutionary solution, designed to meet the rigorous demands of modern electronic designs. This article explores the key features, benefits, and applications of the TMM10 PCB, demonstrating why it is a game changer in the industry.
Key Features of the Rogers TMM10 PCB
Exceptional Dielectric Properties
The Rogers TMM10 PCB boasts a remarkable dielectric constant (Dk) of 9.20 ± 0.23 at 10 GHz, ensuring minimal signal distortion for high-frequency applications. The design dielectric constant reaches 9.8, remaining stable across a frequency range of 8 GHz to 40 GHz. Additionally, the dissipation factor is a low 0.0022, which minimizes energy loss and enhances the overall efficiency of electronic circuits.
Thermal Stability and Mechanical Resilience
One of the standout characteristics of the TMM10 is its impressive thermal stability. With a decomposition temperature (Td) of 425 °C, this PCB can withstand significant heat, making it suitable for demanding environments. The thermal coefficient of the dielectric constant is -38 ppm/°K, ensuring stability across a wide temperature range from -55°C to 125°C. Coupled with a thermal conductivity of 0.76 W/m·K, the TMM10 efficiently manages heat, preventing performance degradation.
The mechanical properties of the TMM10 PCB are designed to resist creep and cold flow, which can compromise the integrity of traditional PCBs over time. The flexural strength of 13.62 kpsi and the flexural modulus of 1.79 Mpsi ensure long-term reliability, making the TMM10 an ideal choice for applications that require consistent performance.
Simplified Manufacturing Process
The Rogers TMM10 PCB is engineered for ease of production. Notably, it does not require sodium naphthenate treatment prior to electroless plating, simplifying the manufacturing process and reducing costs. This streamlined approach allows manufacturers to scale production without sacrificing quality.
Diverse Applications of Rogers TMM10 PCB
The versatility of the TMM10 PCB makes it suitable for a wide array of applications, including:
- RF and Microwave Circuitry: Ideal for applications requiring high precision and performance.
- Power Amplifiers and Combiners: Facilitates efficient signal transmission with minimal loss.
- Satellite Communication Systems: Provides reliable performance in demanding environments.
- Global Positioning Systems (GPS) Antennas: Ensures accurate signal reception and transmission.
Quality Assurance and Testing Standards
To ensure reliability, each PCB undergoes rigorous testing, including 100% electrical testing prior to shipment. This commitment to quality guarantees that every product meets the high standards expected in high-frequency applications.
Conclusion: The Future of High-Frequency Circuitry
The Rogers TMM10 PCB represents a significant advancement in PCB technology for high-frequency applications. With its exceptional dielectric properties, thermal stability, and mechanical resilience, the TMM10 is engineered to meet the demanding requirements of modern electronics.
Experience the future of high-frequency circuitry today! Unlock unparalleled performance with Rogers TMM10 technology and transform your designs into reliable, high-performance solutions. For more information or to place an order, please contact us today. Your journey toward cutting-edge electronic solutions starts here!
Contact Person: Ms. Ivy Deng
Tel: 86-755-27374946
Fax: 86-755-27374848