|
Product Details:
Payment & Shipping Terms:
|
| Material: | TC600 | Layer Count: | 2-layer |
|---|---|---|---|
| PCB Size: | 61.99mm X 39.99 Mm=2Types = 2PCS, +/- 0.15mm | PCB Thickness: | 0.8 Mm |
| Copper Weight: | 1oz (1.4 Mils) Outer Layers | Surface Finish: | Immersion Gold |
In the competitive landscape of electronics, revolutionizing efficiency in high-frequency applications is crucial for modern design. The TC600 PCB stands out as a premier solution, engineered to maximize performance through superior thermal management and low loss characteristics. This article delves into the unique features, benefits, and applications of the TC600 PCB, showcasing why it is a vital component for engineers and designers striving for excellence.
Introduction to TC600 Laminates
The TC600 laminate is a woven fiberglass reinforced, ceramic-filled, PTFE-based composite specifically designed for high-performance printed circuit board applications. With a dielectric constant (Dk) of 6.15 at both 1.8 MHz and 10 GHz, this laminate facilitates efficient signal propagation, essential for high-frequency operations. Its low dissipation factor of 0.0017 at 1.8 GHz and 0.0020 at 10 GHz minimizes signal loss, ensuring that high-frequency signals maintain their integrity over greater distances.
The Importance of Thermal Management in PCB Design
Effective heat management is a critical concern in modern electronics. The TC600 PCB excels in this area, boasting a thermal conductivity of 1.1 W/mK in the Z-axis and 1.4 W/mK in the X and Y axes. This superior thermal conductivity enables efficient heat dissipation, reducing junction temperatures and enhancing the reliability of active components. By reducing hot spots, the TC600 PCB significantly improves device longevity, making it ideal for applications where high power handling is essential.
Mechanical Robustness: A Step Forward in PCB Technology
Unlike brittle laminates, the TC600 PCB is designed with mechanical robustness in mind. It can withstand processing impacts and high G-forces, ensuring reliability in demanding environments. This durability is critical for applications in avionics and automotive electronics, where performance under stress is paramount. The high peel strength of the TC600 laminate also ensures reliable processing of narrow lines, enhancing manufacturing efficiency.
| Property | Unit | Value | Test Method |
| 1. Electrical Properties | |||
| Dielectric Constant (may vary by thickness) | |||
| @1.8 MHz | - | 6.15 | Resonant Cavity |
| @10 GHz | - | 6.15 | IPC TM-650 2.5.5.5 |
| Dissipation Factor | |||
| @1.8 GHz | - | 0.0017 | Resonant Cavity |
| @10 GHz | - | 0.002 | IPC TM-650 2.5.5.5 |
| Temperature Coefficient of Dielectric | - | ||
| TCεr @ 10 GHz (-40-150°C) | ppm/ºC | -75 | IPC TM-650 2.5.5.5 |
| Volume Resistivity | |||
| C96/35/90 | MΩ-cm | 1.6x109 | IPC TM-650 2.5.17.1 |
| E24/125 | MΩ-cm | 2.4x108 | IPC TM-650 2.5.17.1 |
| Surface Resistivity | |||
| C96/35/90 | MΩ | 3.1x109 | IPC TM-650 2.5.17.1 |
| E24/125 | MΩ | 9.0x108 | IPC TM-650 2.5.17.1 |
| Electrical Strength | Volts/mil (kV/mm) | 850 (34) | IPC TM-650 2.5.6.2 |
| Dielectric Breakdown | kV | 62 | IPC TM-650 2.5.6 |
| Arc Resistance | sec | >240 | IPC TM-650 2.5.1 |
| 2. Thermal Properties | |||
| Decomposition Temperature (Td) | |||
| Initial | °C | 512 | IPC TM-650 2.4.24.6 |
| 5% | °C | 572 | IPC TM-650 2.4.24.6 |
| T260 | min | >60 | IPC TM-650 2.4.24.1 |
| T288 | min | >60 | IPC TM-650 2.4.24.1 |
| T300 | min | >60 | IPC TM-650 2.4.24.1 |
| Thermal Expansion, CTE (x,y) 50-150ºC | ppm/ºC | 9, 9 | IPC TM-650 2.4.41 |
| Thermal Expansion, CTE (z) 50-150ºC | ppm/ºC | 35 | IPC TM-650 2.4.24 |
| % z-axis Expansion (50-260ºC) | % | 1.5 | IPC TM-650 2.4.24 |
| 3. Mechanical Properties | |||
| Peel Strength to Copper (1 oz/35 micron) | |||
| After Thermal Stress | lb/in (N/mm) | 10 (1.8) | IPC TM-650 2.4.8 |
| At Elevated Temperatures (150ºC) | lb/in (N/mm) | 10 (1.8) | IPC TM-650 2.4.8.2 |
| After Process Solutions | lb/in (N/mm) | 9 (1.6) | IPC TM-650 2.4.8 |
| Young’s Modulus | kpsi (MPa) | 280 (1930) | IPC TM-650 2.4.18.3 |
| Flexural Strength (Machine/Cross) | kpsi (MPa) | 9.60/9.30 (66/64) | IPC TM-650 2.4.4 |
| Tensile Strength (Machine/Cross) | kpsi (MPa) | 5.0/4.30 (34/30) | IPC TM-650 2.4.18.3 |
| Compressive Modulus | kpsi (MPa) | ASTM D-3410 | |
| Poisson’s Ratio | - | ASTM D-3039 | |
| 4. Physical Properties | |||
| Water Absorption | % | 0.02 | IPC TM-650 2.6.2.1 |
| Density, ambient 23ºC | g/cm3 | 2.9 | ASTM D792 Method A |
| Thermal Conductivity (z-axis) | W/mK | 1.1 | ASTM E1461 |
| Thermal Conductivity (x, y) | W/mK | 1.4 | ASTM E1461 |
| Specific Heat | J/gK | 0.94 | ASTM E1461 |
| Flammability | class | V0 | UL-94 |
| NASA Outgassing, 125ºC, ≤10-6 torr | |||
| Total Mass Loss | % | 0.02 | NASA SP-R-0022A |
| Collected Volatiles | % | 0 | NASA SP-R-0022A |
| Water Vapor Recovered | % | 0 | NASA SP-R-0022A |
Construction Details
This PCB features a 2-layer rigid stackup with each copper layer measuring 35 μm thick, providing excellent conductivity. The core material is 0.762 mm (30 mil) thick, optimizing both thermal and electrical performance. With board dimensions of 61.99 mm x 39.99 mm and a finished thickness of 0.8 mm, the TC600 PCB is designed for compact applications while maintaining high performance.
Quality Assurance Standards for TC600 Laminates
Manufactured to IPC-Class-2 standards, the TC600 PCB undergoes rigorous 100% electrical testing prior to shipment. This commitment to quality ensures that each unit not only meets but exceeds reliability and performance criteria, giving engineers confidence in their designs.
| PCB Material: | Ceramic Filled PTFE/Woven Fiberglass |
| Designation: | TC600 |
| Dielectric constant: | 6.15 (10 GHz) |
| Dissipation Factor | 0.002 (10 GHz) |
| Layer count: | Double Sided PCB, Multilayer PCB, Hybrid PCB |
| Copper weight: | 0.5oz (17 µm), 1oz (35µm), 2oz (70µm) |
| Dielectric thickness: | 10mil (0.254mm), 20mil (0.508mm), 30mil (0.762mm), 60mil (1.524mm) |
| PCB size: | ≤400mm X 500mm |
| Solder mask: | Green, Black, Blue, Yellow, Red etc. |
| Surface finish: | Bare copper, HASL, ENIG, Immersion silver, Immersion tin, OSP, Pure gold plated etc.. |
Typical Applications of TC600 PCB
The versatility of the TC600 PCB makes it suitable for a wide array of applications, including:
- Power Amplifiers: Enhancing efficiency and reliability in high-power applications.
- Microwave Combiner and Power Divider Boards: Ideal for avionics and communication systems.
- Small Footprint Antennas: Perfect for space-constrained designs in mobile devices.
- Digital Audio Broadcasting (DAB) Antennas: Supporting high-quality audio transmission.
- GPS & Hand-held RFID Reader Antennas: Ensuring reliable performance in navigation and tracking systems.
Conclusion: The Future of High-Performance PCBs
With its innovative design and advanced features, the TC600 PCB is set to elevate your designs with superior thermal management and performance. As engineers face increasing demands for efficiency and reliability, the TC600 PCB provides a solution that meets these challenges head-on. Embrace the future of high-performance electronics with the TC600 PCB—where cutting-edge technology meets exceptional performance!
Contact Person: Ms. Ivy Deng
Tel: 86-755-27374946
Fax: 86-755-27374848
