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20mil RO4835 PCB 2 Layer Circuit With Immersion Gold

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20mil RO4835 PCB 2 Layer Circuit With Immersion Gold

MOQ:	1PCS
Price:	USD9.99-99.99/PCS
Standard Packaging:	Vacuum bags+Cartons
Delivery Period:	8-9 working days
Payment Method:	T/T
Supply Capacity:	5000PCS per month

Details Information

Product Description

Detail Information

Place of Origin

CHINA

Brand Name

Bicheng

Certification

UL, ISO9001, IATF16949

Material:

RO4835 Dielectric 20 Mil （0.508mm)

Layer Count:

2-layer

PCB Size:

77.55mm X 167.5mm=1 PCS, +/- 0.15mm

PCB Thickness:

0.6mm

Copper Weight:

1oz (1.4 Mils) Outer Layers

Surface Finish:

Immersion Gold

Highlight:

Immersion Gold RO4835 PCB

20mil RO4835 PCB

20mil PCB 2 Layer Circuit

Product Description

Introducing the Rogers RO4835 PCB, engineered for high frequency performance and exceptional reliability. This advanced laminate is crafted from Rogers' RO4835 material, which offers enhanced thermal stability and superior oxidation resistance compared to traditional hydrocarbon materials. With properties similar to RO4350B laminates, the RO4835 is perfect for cost-effective circuit fabrication while maintaining high performance standards.

Key Features

-RoHS Compliant: Meets environmental standards for applications requiring UL 94 V-0.

-IPC-4103 Compliant: Adheres to industry standards for quality and reliability.

-Dielectric Constant: 3.48 ± 0.05, ensuring controlled impedance for critical applications.

-Dissipation Factor: Low at 0.0037 at 10 GHz, promoting efficient signal transmission.

-Glass Transition Temperature: Exceeds 280 °C, supporting high-temperature applications.

-Coefficient of Thermal Expansion: Low values ensure dimensional stability across axes.

Property	RO4835	Direction	Units	Condition	Test Method
Dielectric Constant,εProcess	3.48±0.05	Z	-	10 GHz/23℃	IPC-TM-650 2.5.5.5 Clamped Stripline
Dielectric Constant,εDesign	3.66	Z	-	8 to 40 GHz	Differential Phase Length Method
Dissipation Factortan,δ	0.0037	Z	-	10 GHz/23℃	IPC-TM-650 2.5.5.5
Thermal Coefficient of ε	+50	Z	ppm/℃	-100℃to 150℃	IPC-TM-650 2.5.5.5
Volume Resistivity	5 x 10⁸		MΩ.cm	COND A	IPC-TM-650 2.5.17.1
Surface Resistivity	7 x10⁸		MΩ	COND A	IPC-TM-650 2.5.17.1
Electrical Strength	30.2(755)	Z	Kv/mm(v/mil)		IPC-TM-650 2.5.6.2
Tensile Modulus	7780(1128)	Y	MPa(ksi)	RT	ASTM D 638
Tensile Strength	136(19.7)	Y	MPa(ksi)	RT	ASTM D 638
Flexural Strength	186 (27)		Mpa (kpsi)		IPC-TM-650 2.4.4
Dimensional Stability	<0.5	X,Y	mm/m (mils/inch)	after etch+E2/150℃	IPC-TM-650 2.4.39A
Coefficient of Thermal Expansion	10 12 31	X Y Z	ppm/℃	-55℃to288℃	IPC-TM-650 2.4.41
Tg	>280		℃ TMA	A	IPC-TM-650 2.4.24.3
Td	390		℃ TGA		ASTM D 3850
Thermal Conductivity	0.66		W/m/oK	80℃	ASTM C518
Moisture Absorption	0.05		%	48hrs immersion 0.060" sample Temperature 50℃	ASTM D 570
Density	1.92		gm/cm³	23℃	ASTM D 792
Copper Peel Stength	0.88 (5.0)		N/mm (pli)	after solder float 1 oz. EDC Foil	IPC-TM-650 2.4.8
Flammability	V-0				UL 94
Lead-free Process Compatible	Yes

Benefits
-Oxidation Resistance: Delivers significantly improved durability over typical thermoset microwave materials.

-Low Loss Performance: Ideal for high-frequency applications, including automotive systems.

-Tight Tolerances: Controlled dielectric constant for precision in transmission lines.

-Lead-Free Compatibility: Ensures no issues with blistering or delamination during processing.

-Stable Dimensions: Low expansion coefficients maintain reliability in plated through holes.

PCB Material:	Hydrocarbon Ceramic Laminates
Designation:	RO4835
Dielectric constant:	3.48 (10 GHz)
Dissipation Factor	0.0037 (10 GHz)
Layer count:	Double Sided PCB, Multilayer PCB, Hybrid PCB
Copper weight:	0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
Dielectric thickness (ED copper)	6.6mil (0.168mm), 10mil (0.254mm), 20mil (0.508mm), 30mil (0.762mm), 60mil (1.524mm)
Dielectric thickness (LoPro copper)	4mil (0.102mm), 7.3mil (0.186mm), 10.7mil (0.272mm), 20.7mil (0.526mm), 30.7mil (0.780mm), 60.7mil (1.542mm)
PCB size:	≤400mm X 500mm
Solder mask:	Green, Black, Blue, Yellow, Red etc.
Surface finish:	Bare copper, HASL, ENIG, Immersion silver, Immersion tin, OSP, Pure gold plated etc..

20mil RO4835 PCB 2 Layer Circuit With Immersion Gold 0

This PCB is constructed as a 2-layer rigid board, providing a robust platform for high-frequency applications. Each side is finished with 35 μm of copper, ensuring effective conductivity and signal integrity throughout the circuit.

The dielectric layer comprises 20 mils (0.508 mm) of RO4835 material, contributing to the PCB's low loss performance. Overall, the board has a total thickness of 0.6 mm, suitable for a wide range of electronic components.

For precision manufacturing, the PCB allows for a minimum trace and space of 6/8 mils, along with a minimum hole size of 0.3 mm, enabling complex designs. The surface finish is achieved through immersion gold, enhancing solderability and durability, while the top layer features white silkscreen for clear labeling, leaving the bottom layer free of silkscreen for a streamlined appearance.

Artwork and Compliance

Artwork Type:Gerber RS-274-X
Accepted Standard: IPC-Class-2

Service Area: Worldwide

Typical Applications

The Rogers RO4835 PCB is ideal for:

-Automotive Radar and Sensors

-Point-to-Point Microwave Communication

-Power Amplifiers

-Phased-Array Radar Systems

-RF Components

20mil RO4835 PCB 2 Layer Circuit With Immersion Gold 1

Tags:

Products

MOQ:	1PCS
Price:	USD9.99-99.99/PCS
Standard Packaging:	Vacuum bags+Cartons
Delivery Period:	8-9 working days
Payment Method:	T/T
Supply Capacity:	5000PCS per month

Detail Information

Product Description

Detail Information

Place of Origin

CHINA

Brand Name

Bicheng

Certification

UL, ISO9001, IATF16949

Material:

RO4835 Dielectric 20 Mil （0.508mm)

Layer Count:

2-layer

PCB Size:

77.55mm X 167.5mm=1 PCS, +/- 0.15mm

PCB Thickness:

0.6mm

Copper Weight:

1oz (1.4 Mils) Outer Layers

Surface Finish:

Immersion Gold

Minimum Order Quantity:

1PCS

Price:

USD9.99-99.99/PCS

Packaging Details:

Vacuum bags+Cartons

Delivery Time:

8-9 working days

Payment Terms:

T/T

Supply Ability:

5000PCS per month

Highlight

Immersion Gold RO4835 PCB

20mil RO4835 PCB

20mil PCB 2 Layer Circuit

Product Description

Key Features

-RoHS Compliant: Meets environmental standards for applications requiring UL 94 V-0.

-IPC-4103 Compliant: Adheres to industry standards for quality and reliability.

-Dielectric Constant: 3.48 ± 0.05, ensuring controlled impedance for critical applications.

-Dissipation Factor: Low at 0.0037 at 10 GHz, promoting efficient signal transmission.

-Glass Transition Temperature: Exceeds 280 °C, supporting high-temperature applications.

-Coefficient of Thermal Expansion: Low values ensure dimensional stability across axes.

Property	RO4835	Direction	Units	Condition	Test Method
Dielectric Constant,εProcess	3.48±0.05	Z	-	10 GHz/23℃	IPC-TM-650 2.5.5.5 Clamped Stripline
Dielectric Constant,εDesign	3.66	Z	-	8 to 40 GHz	Differential Phase Length Method
Dissipation Factortan,δ	0.0037	Z	-	10 GHz/23℃	IPC-TM-650 2.5.5.5
Thermal Coefficient of ε	+50	Z	ppm/℃	-100℃to 150℃	IPC-TM-650 2.5.5.5
Volume Resistivity	5 x 10⁸		MΩ.cm	COND A	IPC-TM-650 2.5.17.1
Surface Resistivity	7 x10⁸		MΩ	COND A	IPC-TM-650 2.5.17.1
Electrical Strength	30.2(755)	Z	Kv/mm(v/mil)		IPC-TM-650 2.5.6.2
Tensile Modulus	7780(1128)	Y	MPa(ksi)	RT	ASTM D 638
Tensile Strength	136(19.7)	Y	MPa(ksi)	RT	ASTM D 638
Flexural Strength	186 (27)		Mpa (kpsi)		IPC-TM-650 2.4.4
Dimensional Stability	<0.5	X,Y	mm/m (mils/inch)	after etch+E2/150℃	IPC-TM-650 2.4.39A
Coefficient of Thermal Expansion	10 12 31	X Y Z	ppm/℃	-55℃to288℃	IPC-TM-650 2.4.41
Tg	>280		℃ TMA	A	IPC-TM-650 2.4.24.3
Td	390		℃ TGA		ASTM D 3850
Thermal Conductivity	0.66		W/m/oK	80℃	ASTM C518
Moisture Absorption	0.05		%	48hrs immersion 0.060" sample Temperature 50℃	ASTM D 570
Density	1.92		gm/cm³	23℃	ASTM D 792
Copper Peel Stength	0.88 (5.0)		N/mm (pli)	after solder float 1 oz. EDC Foil	IPC-TM-650 2.4.8
Flammability	V-0				UL 94
Lead-free Process Compatible	Yes

Benefits
-Oxidation Resistance: Delivers significantly improved durability over typical thermoset microwave materials.

-Low Loss Performance: Ideal for high-frequency applications, including automotive systems.

-Tight Tolerances: Controlled dielectric constant for precision in transmission lines.

-Lead-Free Compatibility: Ensures no issues with blistering or delamination during processing.

-Stable Dimensions: Low expansion coefficients maintain reliability in plated through holes.

PCB Material:	Hydrocarbon Ceramic Laminates
Designation:	RO4835
Dielectric constant:	3.48 (10 GHz)
Dissipation Factor	0.0037 (10 GHz)
Layer count:	Double Sided PCB, Multilayer PCB, Hybrid PCB
Copper weight:	0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
Dielectric thickness (ED copper)	6.6mil (0.168mm), 10mil (0.254mm), 20mil (0.508mm), 30mil (0.762mm), 60mil (1.524mm)
Dielectric thickness (LoPro copper)	4mil (0.102mm), 7.3mil (0.186mm), 10.7mil (0.272mm), 20.7mil (0.526mm), 30.7mil (0.780mm), 60.7mil (1.542mm)
PCB size:	≤400mm X 500mm
Solder mask:	Green, Black, Blue, Yellow, Red etc.
Surface finish:	Bare copper, HASL, ENIG, Immersion silver, Immersion tin, OSP, Pure gold plated etc..

20mil RO4835 PCB 2 Layer Circuit With Immersion Gold 0

Artwork and Compliance

Artwork Type:Gerber RS-274-X
Accepted Standard: IPC-Class-2

Service Area: Worldwide

Typical Applications

The Rogers RO4835 PCB is ideal for:

-Automotive Radar and Sensors

-Point-to-Point Microwave Communication

-Power Amplifiers

-Phased-Array Radar Systems

-RF Components

20mil RO4835 PCB 2 Layer Circuit With Immersion Gold 1

Tags:

RF PCB Board

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PTFE PCB Board

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20mil RO4835 PCB 2 Layer Circuit With Immersion Gold

Immersion Gold RO4835 PCB

20mil RO4835 PCB

20mil PCB 2 Layer Circuit

1oz RF PCB Board,

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RF PCB Board

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PTFE PCB Board

High TG PCB

Multi Layer PCB

Taconic PCB

HDI PCB Board

High Speed PCB

Impedance Controlled PCB

Flexible PCB Board

FR4 PCB Board

PCB Stencil

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