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RO4003C PCB 16mil 2-Layer Circuit Board with Immersion Silver

RO4003C PCB 16mil 2-Layer Circuit Board with Immersion Silver

MOQ: 1PCS
Price: USD9.99-99.99/PCS
Standard Packaging: Vacuum bags+Cartons
Delivery Period: 8-9 working days
Payment Method: T/T
Supply Capacity: 5000PCS per month
Detail Information
Place of Origin
CHINA
Brand Name
Bicheng
Certification
UL, ISO9001, IATF16949
Material:
Rogers 4003C Core
Layer Count:
2-layer
PCB Size:
90.63mm X 170.35mm=1PCS, +/- 0.15mm
PCB Thickness:
0.5mm
Copper Weight:
1oz (1.4 Mils) Outer Layers
Surface Finish:
Immersion Silver
Highlight:

2-Layer PCB Board

,

16mil PCB Board

,

Immersion Silver PCB Board

Product Description

The Rogers RO4003C PCB is an innovative solution that combines the benefits of woven glass reinforced hydrocarbon/ceramics with the manufacturing advantages of epoxy/glass. Engineered for high-performance applications, this laminate offers electrical properties comparable to PTFE/woven glass while remaining cost-effective. With a variety of configurations available, RO4003C ensures tight control over dielectric constant and low loss, making it an excellent choice for multi-layer board (MLB) constructions.

 

Features
- Dielectric Constant: 3.38 ± 0.05 at 10 GHz, providing reliable signal integrity.

 

- Dissipation Factor: 0.0027 at 10 GHz, minimizing signal loss.
 

- Thermal Conductivity: 0.71 W/m/°K for effective heat management.
 

- Thermal Stability: Coefficient of dielectric constant at +40 ppm/°C, with operational range from -50°C to 150°C.
 

- Coefficient of Thermal Expansion (CTE): Matched to copper with X axis at 11 ppm/°C and Y axis at 14 ppm/°C; low Z-axis CTE of 46 ppm/°C.
 

- Glass Transition Temperature (Tg): Greater than 280 °C, providing robust thermal performance.
 

- Moisture Absorption: Low at 0.06%, enhancing reliability.

 

RO4003C Typical Value
Property RO4003C Direction Units Condition Test Method
Dielectric Constant,εProcess 3.38±0.05 Z   10 GHz/23 IPC-TM-650 2.5.5.5 Clamped Stripline
Dielectric Constant,εDesign 3.55 Z   8 to 40 GHz Differential Phase Length Method
Dissipation Factortan,δ 0.0027
0.0021
Z   10 GHz/23
2.5 GHz/23
IPC-TM-650 2.5.5.5
Thermal Coefficient of ε +40 Z ppm/ -50to 150 IPC-TM-650 2.5.5.5
Volume Resistivity 1.7 x 1010   MΩ.cm COND A IPC-TM-650 2.5.17.1
Surface Resistivity 4.2 x 109   COND A IPC-TM-650 2.5.17.1
Electrical Strength 31.2(780) Z Kv/mm(v/mil) 0.51mm(0.020") IPC-TM-650 2.5.6.2
Tensile Modulus 19,650(2,850)
19,450(2,821)
X
Y
MPa(ksi) RT ASTM D 638
Tensile Strength 139(20.2)
100(14.5)
X
Y
MPa(ksi) RT ASTM D 638
Flexural Strength 276
(40)
  MPa
(kpsi)
  IPC-TM-650 2.4.4
Dimensional Stability <0.3 X,Y mm/m
(mil/inch)
after etch+E2/150 IPC-TM-650 2.4.39A
Coefficient of Thermal Expansion 11
14
46
X
Y
Z
ppm/ -55to288 IPC-TM-650 2.4.41
Tg >280   TMA A IPC-TM-650 2.4.24.3
Td 425   TGA   ASTM D 3850
Thermal Conductivity 0.71   W/M/oK 80 ASTM C518
Moisture Absorption 0.06   % 48hrs immersion 0.060"
sample Temperature 50
ASTM D 570
Density 1.79   gm/cm3 23 ASTM D 792
Copper Peel Stength 1.05
(6.0)
  N/mm
(pli)
after solder float 1 oz.
EDC Foil
IPC-TM-650 2.4.8
Flammability N/A       UL 94
Lead-free Process Compatible Yes        

 

Benefits
The Rogers RO4003C PCB is ideal for performance-sensitive, high-volume applications. It is processed similarly to standard FR-4 materials, allowing for lower fabrication costs without compromising quality. The design does not require special handling procedures, making it accessible for various manufacturing environments.

 

PCB Specifications

This PCB is constructed as a 2-layer rigid board with dimensions of 90.63 mm x 170.35 mm, with a tolerance of ±0.15 mm. The stackup includes a 0.406 mm (16 mil) Rogers 4003C core sandwiched between two 35 μm copper layers. The finished board thickness is 0.5 mm, with a copper weight of 1 oz (1.4 mils) on the outer layers. The board features a green solder mask on the top and a white silkscreen, ensuring clarity in design.

 

RO4003C PCB 16mil 2-Layer Circuit Board with Immersion Silver 0

 

Artwork and Standards

This PCB is supplied with artwork in the Gerber RS-274-X format, adhering to IPC-Class-2 quality standards. This compliance guarantees that the PCB meets stringent requirements for performance and reliability.

 

Availability

This RO4003C PCB is available for worldwide shipping, making it easy for engineers and designers to access cutting-edge technology for their projects, regardless of location.

 

Typical Applications

This PCB is particularly suitable for:

 

-Cellular base station antennas and power amplifiers

-RF identification tags

-Automotive radar and sensor systems

-LNBs for direct broadcast satellites

-Elevate your electronic designs with the Rogers RO4003C PCB—an exceptional choice for high-performance applications that require reliability, efficiency, and cost-effectiveness.

 

RO4003C PCB 16mil 2-Layer Circuit Board with Immersion Silver 1

products
PRODUCTS DETAILS
RO4003C PCB 16mil 2-Layer Circuit Board with Immersion Silver
MOQ: 1PCS
Price: USD9.99-99.99/PCS
Standard Packaging: Vacuum bags+Cartons
Delivery Period: 8-9 working days
Payment Method: T/T
Supply Capacity: 5000PCS per month
Detail Information
Place of Origin
CHINA
Brand Name
Bicheng
Certification
UL, ISO9001, IATF16949
Material:
Rogers 4003C Core
Layer Count:
2-layer
PCB Size:
90.63mm X 170.35mm=1PCS, +/- 0.15mm
PCB Thickness:
0.5mm
Copper Weight:
1oz (1.4 Mils) Outer Layers
Surface Finish:
Immersion Silver
Minimum Order Quantity:
1PCS
Price:
USD9.99-99.99/PCS
Packaging Details:
Vacuum bags+Cartons
Delivery Time:
8-9 working days
Payment Terms:
T/T
Supply Ability:
5000PCS per month
Highlight

2-Layer PCB Board

,

16mil PCB Board

,

Immersion Silver PCB Board

Product Description

The Rogers RO4003C PCB is an innovative solution that combines the benefits of woven glass reinforced hydrocarbon/ceramics with the manufacturing advantages of epoxy/glass. Engineered for high-performance applications, this laminate offers electrical properties comparable to PTFE/woven glass while remaining cost-effective. With a variety of configurations available, RO4003C ensures tight control over dielectric constant and low loss, making it an excellent choice for multi-layer board (MLB) constructions.

 

Features
- Dielectric Constant: 3.38 ± 0.05 at 10 GHz, providing reliable signal integrity.

 

- Dissipation Factor: 0.0027 at 10 GHz, minimizing signal loss.
 

- Thermal Conductivity: 0.71 W/m/°K for effective heat management.
 

- Thermal Stability: Coefficient of dielectric constant at +40 ppm/°C, with operational range from -50°C to 150°C.
 

- Coefficient of Thermal Expansion (CTE): Matched to copper with X axis at 11 ppm/°C and Y axis at 14 ppm/°C; low Z-axis CTE of 46 ppm/°C.
 

- Glass Transition Temperature (Tg): Greater than 280 °C, providing robust thermal performance.
 

- Moisture Absorption: Low at 0.06%, enhancing reliability.

 

RO4003C Typical Value
Property RO4003C Direction Units Condition Test Method
Dielectric Constant,εProcess 3.38±0.05 Z   10 GHz/23 IPC-TM-650 2.5.5.5 Clamped Stripline
Dielectric Constant,εDesign 3.55 Z   8 to 40 GHz Differential Phase Length Method
Dissipation Factortan,δ 0.0027
0.0021
Z   10 GHz/23
2.5 GHz/23
IPC-TM-650 2.5.5.5
Thermal Coefficient of ε +40 Z ppm/ -50to 150 IPC-TM-650 2.5.5.5
Volume Resistivity 1.7 x 1010   MΩ.cm COND A IPC-TM-650 2.5.17.1
Surface Resistivity 4.2 x 109   COND A IPC-TM-650 2.5.17.1
Electrical Strength 31.2(780) Z Kv/mm(v/mil) 0.51mm(0.020") IPC-TM-650 2.5.6.2
Tensile Modulus 19,650(2,850)
19,450(2,821)
X
Y
MPa(ksi) RT ASTM D 638
Tensile Strength 139(20.2)
100(14.5)
X
Y
MPa(ksi) RT ASTM D 638
Flexural Strength 276
(40)
  MPa
(kpsi)
  IPC-TM-650 2.4.4
Dimensional Stability <0.3 X,Y mm/m
(mil/inch)
after etch+E2/150 IPC-TM-650 2.4.39A
Coefficient of Thermal Expansion 11
14
46
X
Y
Z
ppm/ -55to288 IPC-TM-650 2.4.41
Tg >280   TMA A IPC-TM-650 2.4.24.3
Td 425   TGA   ASTM D 3850
Thermal Conductivity 0.71   W/M/oK 80 ASTM C518
Moisture Absorption 0.06   % 48hrs immersion 0.060"
sample Temperature 50
ASTM D 570
Density 1.79   gm/cm3 23 ASTM D 792
Copper Peel Stength 1.05
(6.0)
  N/mm
(pli)
after solder float 1 oz.
EDC Foil
IPC-TM-650 2.4.8
Flammability N/A       UL 94
Lead-free Process Compatible Yes        

 

Benefits
The Rogers RO4003C PCB is ideal for performance-sensitive, high-volume applications. It is processed similarly to standard FR-4 materials, allowing for lower fabrication costs without compromising quality. The design does not require special handling procedures, making it accessible for various manufacturing environments.

 

PCB Specifications

This PCB is constructed as a 2-layer rigid board with dimensions of 90.63 mm x 170.35 mm, with a tolerance of ±0.15 mm. The stackup includes a 0.406 mm (16 mil) Rogers 4003C core sandwiched between two 35 μm copper layers. The finished board thickness is 0.5 mm, with a copper weight of 1 oz (1.4 mils) on the outer layers. The board features a green solder mask on the top and a white silkscreen, ensuring clarity in design.

 

RO4003C PCB 16mil 2-Layer Circuit Board with Immersion Silver 0

 

Artwork and Standards

This PCB is supplied with artwork in the Gerber RS-274-X format, adhering to IPC-Class-2 quality standards. This compliance guarantees that the PCB meets stringent requirements for performance and reliability.

 

Availability

This RO4003C PCB is available for worldwide shipping, making it easy for engineers and designers to access cutting-edge technology for their projects, regardless of location.

 

Typical Applications

This PCB is particularly suitable for:

 

-Cellular base station antennas and power amplifiers

-RF identification tags

-Automotive radar and sensor systems

-LNBs for direct broadcast satellites

-Elevate your electronic designs with the Rogers RO4003C PCB—an exceptional choice for high-performance applications that require reliability, efficiency, and cost-effectiveness.

 

RO4003C PCB 16mil 2-Layer Circuit Board with Immersion Silver 1

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