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Product Details:
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| Material: | Rogers 4003C Core | Layer Count: | 2-layer |
|---|---|---|---|
| PCB Size: | 90.63mm X 170.35mm=1PCS, +/- 0.15mm | PCB Thickness: | 0.5mm |
| Copper Weight: | 1oz (1.4 Mils) Outer Layers | Surface Finish: | Immersion Silver |
| Highlight: | 2-Layer PCB Board,16mil PCB Board,Immersion Silver PCB Board |
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The Rogers RO4003C PCB is an innovative solution that combines the benefits of woven glass reinforced hydrocarbon/ceramics with the manufacturing advantages of epoxy/glass. Engineered for high-performance applications, this laminate offers electrical properties comparable to PTFE/woven glass while remaining cost-effective. With a variety of configurations available, RO4003C ensures tight control over dielectric constant and low loss, making it an excellent choice for multi-layer board (MLB) constructions.
Features
- Dielectric Constant: 3.38 ± 0.05 at 10 GHz, providing reliable signal integrity.
- Dissipation Factor: 0.0027 at 10 GHz, minimizing signal loss.
- Thermal Conductivity: 0.71 W/m/°K for effective heat management.
- Thermal Stability: Coefficient of dielectric constant at +40 ppm/°C, with operational range from -50°C to 150°C.
- Coefficient of Thermal Expansion (CTE): Matched to copper with X axis at 11 ppm/°C and Y axis at 14 ppm/°C; low Z-axis CTE of 46 ppm/°C.
- Glass Transition Temperature (Tg): Greater than 280 °C, providing robust thermal performance.
- Moisture Absorption: Low at 0.06%, enhancing reliability.
| RO4003C Typical Value | |||||
| Property | RO4003C | Direction | Units | Condition | Test Method |
| Dielectric Constant,εProcess | 3.38±0.05 | Z | 10 GHz/23℃ | IPC-TM-650 2.5.5.5 Clamped Stripline | |
| Dielectric Constant,εDesign | 3.55 | Z | 8 to 40 GHz | Differential Phase Length Method | |
| Dissipation Factortan,δ | 0.0027 0.0021 |
Z | 10 GHz/23℃ 2.5 GHz/23℃ |
IPC-TM-650 2.5.5.5 | |
| Thermal Coefficient of ε | +40 | Z | ppm/℃ | -50℃to 150℃ | IPC-TM-650 2.5.5.5 |
| Volume Resistivity | 1.7 x 1010 | MΩ.cm | COND A | IPC-TM-650 2.5.17.1 | |
| Surface Resistivity | 4.2 x 109 | MΩ | COND A | IPC-TM-650 2.5.17.1 | |
| Electrical Strength | 31.2(780) | Z | Kv/mm(v/mil) | 0.51mm(0.020") | IPC-TM-650 2.5.6.2 |
| Tensile Modulus | 19,650(2,850) 19,450(2,821) |
X Y |
MPa(ksi) | RT | ASTM D 638 |
| Tensile Strength | 139(20.2) 100(14.5) |
X Y |
MPa(ksi) | RT | ASTM D 638 |
| Flexural Strength | 276 (40) |
MPa (kpsi) |
IPC-TM-650 2.4.4 | ||
| Dimensional Stability | <0.3 | X,Y | mm/m (mil/inch) |
after etch+E2/150℃ | IPC-TM-650 2.4.39A |
| Coefficient of Thermal Expansion | 11 14 46 |
X Y Z |
ppm/℃ | -55℃to288℃ | IPC-TM-650 2.4.41 |
| Tg | >280 | ℃ TMA | A | IPC-TM-650 2.4.24.3 | |
| Td | 425 | ℃ TGA | ASTM D 3850 | ||
| Thermal Conductivity | 0.71 | W/M/oK | 80℃ | ASTM C518 | |
| Moisture Absorption | 0.06 | % | 48hrs immersion 0.060" sample Temperature 50℃ |
ASTM D 570 | |
| Density | 1.79 | gm/cm3 | 23℃ | ASTM D 792 | |
| Copper Peel Stength | 1.05 (6.0) |
N/mm (pli) |
after solder float 1 oz. EDC Foil |
IPC-TM-650 2.4.8 | |
| Flammability | N/A | UL 94 | |||
| Lead-free Process Compatible | Yes | ||||
Benefits
The Rogers RO4003C PCB is ideal for performance-sensitive, high-volume applications. It is processed similarly to standard FR-4 materials, allowing for lower fabrication costs without compromising quality. The design does not require special handling procedures, making it accessible for various manufacturing environments.
PCB Specifications
This PCB is constructed as a 2-layer rigid board with dimensions of 90.63 mm x 170.35 mm, with a tolerance of ±0.15 mm. The stackup includes a 0.406 mm (16 mil) Rogers 4003C core sandwiched between two 35 μm copper layers. The finished board thickness is 0.5 mm, with a copper weight of 1 oz (1.4 mils) on the outer layers. The board features a green solder mask on the top and a white silkscreen, ensuring clarity in design.
Artwork and Standards
This PCB is supplied with artwork in the Gerber RS-274-X format, adhering to IPC-Class-2 quality standards. This compliance guarantees that the PCB meets stringent requirements for performance and reliability.
Availability
This RO4003C PCB is available for worldwide shipping, making it easy for engineers and designers to access cutting-edge technology for their projects, regardless of location.
Typical Applications
This PCB is particularly suitable for:
-Cellular base station antennas and power amplifiers
-RF identification tags
-Automotive radar and sensor systems
-LNBs for direct broadcast satellites
-Elevate your electronic designs with the Rogers RO4003C PCB—an exceptional choice for high-performance applications that require reliability, efficiency, and cost-effectiveness.
Contact Person: Ms. Ivy Deng
Tel: 86-755-27374946
Fax: 86-755-27374848
