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| Material: | IsoClad 917 | Layer Count: | 2-layer |
|---|---|---|---|
| PCB Size: | 91.17mm X 31.36 Mm=1PCS, +/- 0.15mm | PCB Thickness: | 0.9mm |
| Copper Weight: | 1oz (1.4 Mils) Outer Layers | Surface Finish: | Immersion Tin |
| Highlight: | 2-Layer PCB,Immesion Tin PCB,31mil PCB |
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The IsoClad 917 PCB is designed with Rogers' advanced non-woven fiberglass/PTFE composite materials, providing exceptional performance as a printed circuit board substrate. With a dielectric constant (Dk) of 2.17 or 2.20, IsoClad 917 laminates utilize a low ratio of non-woven fiberglass to achieve the lowest dielectric constant and dissipation factor available in its class. This unique formulation allows for flexibility in applications, making it suitable for conformal or wrap-around antennas. The longer random fibers and proprietary manufacturing process enhance the dimensional stability and dielectric constant uniformity, setting IsoClad 917 apart from its competitors.
Key Features
IsoClad 917 boasts impressive specifications, including a dielectric constant of 2.17 or 2.20 at 10 GHz and 23°C, along with a dissipation factor of 0.0013 under the same conditions. The temperature coefficient of dielectric constant (TcDK) is -157 ppm/°C, ensuring stability across a temperature range of -10°C to 140°C.
The laminate exhibits a strong peel strength of 10 lbs per inch and a low moisture absorption rate of just 0.04%. With a coefficient of thermal expansion (CTE) of 46 ppm/°C in the X-axis, 47 ppm/°C in the Y-axis, and 236 ppm/°C in the Z-axis, IsoClad 917 demonstrates excellent dimensional stability. Additionally, it meets UL-94 V0 flammability standards, ensuring safety in various applications.
| Property | IsoClad 917 | Condition | Test Method |
| Dielectric Constant @ 10 GHz | 2.17, 2.20 | C23/50 | IPC TM-650 2.5.5.5 |
| Dissipation Factor @ 10 GHz | 0.0013 | C23/50 | IPC TM-650 2.5.5.5 |
| Thermal Coefficient of Er (ppm/°C) | -157 | -10°C to +140°C | IPC TM-650 2.5.5.5 Adapted |
| Peel Strength (lbs.per inch) | 10 | After Thermal | IPC TM-650 2.4.8 |
| Volume Resistivity (MΩ-cm) | 1.5 x 1010 | C96/35/90 | IPC TM-650 2.5.17.1 |
| Surface Resistivity (MΩ) | 1.0 x 109 | C96/35/90 | IPC TM-650 2.5.17.1 |
| Arc Resistance (seconds) | >180 | D48/50 | ASTM D-495 |
| Tensile Modulus (kpsi) | 133, 120 | A, 23°C | ASTM D-638 |
| Tensile Strength (kpsi) | 4.3, 3.8 | A, 23°C | ASTM D-882 |
| Compressive Modulus (kpsi) | 182 | A, 23°C | ASTM D-695 |
| Flexural Modulus (kpsi) | 213 | A, 23°C | ASTM D-790 |
| Dielectric Breakdown (kv) | >45 | D48/50 | ASTM D-149 |
| Density (g/cm3) | 2.23 | A, 23°C | ASTM D-792 Method A |
| Water Absorption (%) | 0.04 | E1/105 + D24/23 | MIL-S-13949H 3.7.7 IPC TM-650 2.6.2.2 |
| Coefficient of Thermal | 0°C to 100°C | IPC TM-650 2.4.24 | |
| Expansion (ppm/°C) | Mettler 3000 | ||
| X Axis | 46 | Thermomechanical | |
| Y Axis | 47 | Analyzer | |
| Z Axis | 236 | ||
| Thermal Conductivity (W/mK) | 0.263 | 100°C | ASTM E-1225 |
| Outgassing | 125°C, ≤10-6 torr | ||
| Total Mass Loss (%) | 0.02 | Maximum 1.00% | |
| Collected Volatile | 0.00 | Maximum 0.10% | |
| Condensable Material (%) | |||
| Water Vapor Regain (%) | 0.02 | ||
| Visible Condensate (±) | NO | ||
| Flammability | Meets requirements of UL94-V0 |
C48/23/50, E24/125 | UL 94 Vertical Burn IPC TM-650 2.3.10 |
Benefits
The IsoClad 917 PCB offers numerous advantages, including:
- Nonwoven fiberglass reinforcement for enhanced flexibility and performance.
- Low dielectric constant and extremely low loss, making it ideal for high-frequency applications.
- Low moisture absorption for improved reliability.
- Less rigidity compared to woven fiberglass, allowing for more versatile designs.
- Highly isotropic properties in the X, Y, and Z directions, providing consistent performance.
- Stable dielectric constant across a range of frequencies, ensuring reliable operation.
- Improved dimensional stability for precise applications.
| PCB Material: | Non-woven Fiberglass / PTFE Composites |
| Designation: | IsoClad 917 |
| Dielectric constant: | 2.17 or 2.20 (10 GHz) |
| Dissipation factor | 0.0013 (10 GHz) |
| Layer count: | Single Sided, Double Sided, Multi-layer PCB, Hybrid PCB |
| Copper weight: | 1oz (35µm), 2oz (70µm) |
| Dielectric thickness | 20mil (0.508mm), 31mil (0.787mm), 62mil (1.575mm) |
| PCB size: | ≤400mm X 500mm |
| Solder mask: | Green, Black, Blue, Yellow, Red etc. |
| Surface finish: | ENIG(immersion gold), HASL, Immersion silver, Immersion tin, ENEPIG, OSP, Bare copper, Pure gold plated etc.. |
Specifications
This PCB stackup consists of a 2-layer rigid design, featuring a Copper Layer 1 of 35 μm, an IsoClad 917 core measuring 0.787 mm (31 mil), and a Copper Layer 2 also at 35 μm.
The board dimensions are 91.17 mm x 31.36 mm, with a tolerance of +/- 0.15 mm. The minimum trace/space is set at 5/5 mils, and the minimum hole size is 0.3 mm.
The finished board thickness is 0.9 mm, with a finished copper weight of 1 oz (1.4 mils) for the outer layers. The via plating thickness is 20 μm, and the surface finish is immersion tin.
This PCB features a white silkscreen on the top side, while the bottom side has none. The top side is coated with a green solder mask, and there is no solder mask on the bottom. Each PCB undergoes a 100% electrical test prior to shipment to ensure reliability.
Standards & Availability
The IsoClad 917 PCB is manufactured to high-quality standards, with the artwork type being Gerber RS-274-X. It adheres to IPC-Class-2 quality standards, ensuring reliability and performance. This product is available worldwide, making it suitable for various applications.
Typical Applications
The IsoClad 917 PCB is ideal for a variety of applications, including:
- Conformal antennas
- Stripline and microstrip circuits
- Guidance systems
- Radar and electronic systems
Contact Person: Ms. Ivy Deng
Tel: 86-755-27374946
Fax: 86-755-27374848
