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60mil DiClad 880 PCB 2 Layer Immesion Gold Circuit Board

China Bicheng Electronics Technology Co., Ltd certification
China Bicheng Electronics Technology Co., Ltd certification
Kevin, Received and tested the boards - thanks very much. These are perfect, exactly what we needed. rgds Rich

—— Rich Rickett

Ruth, I got the PCB today, and they are just perfect. Please stay a little patience, my next order is coming soon. Kind regards from Hamburg Olaf

—— Olaf Kühnhold

Hi Natalie. It was perfect, I attach some pictures for your reference. And I send you next 2 projects to budget. Thanks a lot again

—— Sebastian Toplisek

Kevin, Thanks, they were perfectly made, and work well. As promised, here are the links for my latest project, using the PCBs you manufactured for me: Regards, Daniel

—— Daniel Ford

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60mil DiClad 880 PCB 2 Layer Immesion Gold Circuit Board

60mil DiClad 880 PCB 2 Layer Immesion Gold Circuit Board
60mil DiClad 880 PCB 2 Layer Immesion Gold Circuit Board 60mil DiClad 880 PCB 2 Layer Immesion Gold Circuit Board

Large Image :  60mil DiClad 880 PCB 2 Layer Immesion Gold Circuit Board

Product Details:
Place of Origin: CHINA
Brand Name: Bicheng
Certification: UL, ISO9001, IATF16949
Payment & Shipping Terms:
Minimum Order Quantity: 1PCS
Price: USD9.99-99.99/PCS
Packaging Details: Vacuum bags+Cartons
Delivery Time: 8-9 working days
Payment Terms: T/T
Supply Ability: 5000PCS per month
Detailed Product Description
Material: DiClad 880 Layer Count: 2-layer
PCB Size: 70.28mm X 139.35 Mm=1PCS, +/- 0.15mm PCB Thickness: 60mil
Copper Weight: 1oz (1.4 Mils) Inner/outer Layers Surface Finish: Immersion Gold
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60mil Immesion Gold Circuit Board

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DiClad 880 PCB Circuit Board

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Immesion Gold two layer pcb

The DiClad 880 PCB is crafted from Rogers' advanced woven fiberglass reinforced, PTFE-based composites, specifically designed to provide a lower dielectric constant for printed circuit board substrates. With precise control over the fiberglass/PTFE ratio, DiClad 880 laminates not only achieve a lower dielectric constant and dissipation factor but also offer enhanced dimensional stability. The unique woven fiberglass reinforcement in DiClad 880 ensures greater stability compared to nonwoven fiberglass reinforced PTFE laminates with similar dielectric properties, making it an ideal choice for high-performance applications.

 

Key Features

The DiClad 880 exhibits a dielectric constant (Dk) of 2.17 or 2.2, with a tolerance of +/- 0.04 at frequencies of 10 GHz and 23°C, as well as at 1 MHz. Its dissipation factor is impressively low, measuring at 0.0009 at 10 GHz and 0.0008 at 1 MHz, contributing to its efficiency.

 

Additionally, the temperature coefficient of dielectric constant (TcDK) is -160 ppm/°C, maintaining stability across a temperature range of -10°C to 140°C. With a moisture absorption rate of just 0.02%, DiClad 880 outperforms many PTFE-based composites. The coefficient of thermal expansion (CTE) values are 25 ppm/°C in the X-axis, 34 ppm/°C in the Y-axis, and 252 ppm/°C in the Z-axis. This laminate also meets UL 94-V0 flammability standards, ensuring safety in various applications.

 

Property Test Method Condition DiClad 880
Dielectric Constant @ 10 GHz IPC TM-650 2.5.5.5 C23/50 2.17, 2.20
Dielectric Constant @ 1 MHz IPC TM-650 2.5.5.3 C23/50 2.17, 2.20
Dissipation Factor @ 10 GHz IPC TM-650 2.5.5.5 C23/50 0.0009
Dissipation Factor @ 1 MHz IPC TM-650 2.5.5.3 C23/50 0.0008
Thermal Coefficient of Er (ppm/°C) IPC TM-650 2.5.5.5
Adapted
-10°C to +140°C -160
Peel Strength (lbs.per inch) IPC TM-650 2.4.8 After Thermal Stress 14
Volume Resistivity (MΩ-cm) IPC TM-650 2.5.17.1 C96/35/90 1.4 x 109
Surface Resistivity (MΩ) IPC TM-650 2.5.17.1 C96/35/90 2.9 x 106
Arc Resistance ASTM D-495 D48/50 >180
Tensile Modulus (kpsi) ASTM D-638 A, 23°C 267, 202
Tensile Strength (kpsi) ASTM D-882 A, 23°C 8.1, 7.5
Compressive Modulus (kpsi) ASTM D-695 A, 23°C 237
Flexural Modulus (kpsi) ASTM D-790 A, 23°C 357
Dielectric Breakdown (kV) ASTM D-149 D48/50 >45
Density (g/cm3) ASTM D-792 Method A A, 23°C 2.23
Water Absorption (%) MIL-S-13949H 3.7.7
IPC TM-650 2.6.2.2
E1/105 + D24/23 0.02
Coefficient of Thermal IPC TM-650 2.4.24 0°C to 100°C  
Expansion (ppm/°C) Mettler 3000  
X Axis Thermomechanical 25
Y Axis Analyzer 34
Z Axis   252
Thermal Conductivity (W/mK) ASTM E-1225 100°C 0.261
Outgassing NASA SP-R-0022A 125°C, ≤ 10-6 torr  
Total Mass Loss (%) Maximum 1.00% 0.01
Collected Volatile Maximum 0.10% 0.01
Condensable Material (%)    
Water Vapor Regain (%)   0.01
Visible Condensate (±)   NO
Flammability UL File E 80166 UL 94 Vertical Burn IPC TM-650 2.3.10 C48/23/50, E24/125 Meets requirements of UL94-V0

 

Benefits

DiClad 880 PCB offers numerous advantages, including an extremely low loss tangent and excellent dimensional stability, which are crucial for high-frequency applications. Its uniform product performance across frequencies ensures consistent electrical properties, providing reliable operation.

 

The material is chemically resistant, has the lowest moisture absorption among PTFE-based composites, and maintains a stable dielectric constant over a wide frequency range. This low Dk supports wider line widths, resulting in lower insertion loss, making DiClad 880 an exceptional choice for demanding electronic designs.

 

Specifications

This PCB stackup features a 2-layer rigid design, consisting of a Copper Layer 1 of 35 μm, a DiClad 880 core measuring 1.524 mm (60 mil), and a Copper Layer 2 also at 35 μm.

 

The board dimensions are 70.28 mm x 139.35 mm, with a tolerance of +/- 0.15 mm. The minimum trace/space is set at 5/8 mils, while the minimum hole size is 0.25 mm.

 

The finished board thickness is 0.8 mm, and the finished copper weight is 1 oz (1.4 mils) for the outer layers. The via plating thickness is 20 μm, and the surface finish is immersion gold.

 

For the silkscreen, the top side features a white print, while the bottom side has none. There is no solder mask on either side of the board. Prior to shipment, each PCB undergoes a 100% electrical test to ensure reliability.

 

PCB Material: Woven Fiberglass Reinforced, PTFE-based Composites
Designation: DiClad 880
Dielectric constant: 2.20 (10 GHz)
Dissipation factor 0.0009 (10 GHz)
Layer count: Double Sided PCB, Multilayer PCB, Hybrid PCB
Copper weight: 1oz (35µm), 2oz (70µm)
Dielectric thickness 20mil (0.508mm), 30mil (0.762mm), 60mil (1.524mm)
PCB size: ≤400mm X 500mm
Solder mask: Green, Black, Blue, Yellow, Red etc.
Surface finish: Immersion gold (ENIG), HASL, Immersion silver, Immersion tin, OSP, ENEPIG, Bare Copper, Pure gold plated etc..

 

60mil DiClad 880 PCB 2 Layer Immesion Gold Circuit Board 0


Standards & Availability

This PCB is supplied in accordance with high-quality standards. The artwork type is Gerber RS-274-X, and it adheres to the IPC-Class-2 standard. This product is available worldwide, making it accessible for a variety of projects.

 

Typical Applications

The DiClad 880 PCB is well-suited for a range of applications, including:

 

- Radar feed networks
- Commercial phased array networks
- Low loss base station antennas
- Guidance systems
- Digital radio antennas
- Filters, couplers, and low noise amplifiers (LNAs)

 

With its advanced features and robust performance, the DiClad 880 PCB stands out as an excellent choice for high-frequency and high-performance electronic applications.

 

60mil DiClad 880 PCB 2 Layer Immesion Gold Circuit Board 1

Contact Details
Bicheng Electronics Technology Co., Ltd

Contact Person: Ms. Ivy Deng

Tel: 86-755-27374946

Fax: 86-755-27374848

Send your inquiry directly to us (0 / 3000)