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Material: | AD1000 | Layer Count: | 2-layer |
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PCB Size: | 92.32mm X 41.52 Mm=2Types=2PCS, +/- 0.15mm | PCB Thickness: | 1.56mm |
Copper Weight: | 1oz (1.4 Mils) Inner/outer Layers | Surface Finish: | Immersion Silver |
Highlight: | AD1000 Immersion Silver Circuit Board,2 Layer Immersion Silver Circuit Board,59mil Immersion Silver Circuit Board |
The AD1000 PCB is a state-of-the-art printed circuit board designed with woven-glass reinforced laminate, providing superior dimensional stability and mechanical robustness compared to other 10 Dk products. Its expansive panel size allows for efficient multi-circuit processing, making it an excellent choice for miniaturization in various applications. This high dielectric constant substrate is particularly beneficial for power amplifiers, filters, couplers, and other components utilizing low-impedance lines.
Key Features
- Material Excellence: The only woven glass reinforced PTFE/Ceramic laminate with a dielectric constant (Dk) of 10.2 or greater.
- Thermal Performance: Best-in-class thermal conductivity for enhanced heat dissipation.
- Durable Design: High copper peel strength of >12 lbs/in (after thermal stress) and 13.6 lbs/in at elevated temperatures (150°C), allowing for thinner etched line widths.
- Signal Integrity: Lowest insertion loss available, ensuring clearer signal transmission.
- Size Advantage: Larger panel sizes support complex layouts and designs.
- Moisture Resistance: Low moisture absorption of just 0.03% to maintain performance in humid environments.
- Reliable Construction: Excellent CTE values (8 ppm/°C, 10 ppm/°C, and 20 ppm/°C in X, Y, Z directions) guarantee reliability in component attachment and PTH performance.
Property | Units | Value | Test Method |
1. Electrical Properties | |||
Dielectric Constant (may vary by thickness) | |||
@1 MHz | - | IPC TM-650 2.5.5.3 | |
@ 10 GHz | - | 10.2 | IPC TM-650 2.5.5.5 |
Dissipation Factor | |||
@ 1 MHz | - | IPC TM-650 2.5.5.3 | |
@ 10 GHz | - | 0.0023 | IPC TM-650 2.5.5.5 |
Temperature Coefficient of Dielectric | - | ||
TCεr @ 10 GHz (-40-150°C) | ppm/℃ | -380 | IPC TM-650 2.5.5.5 |
Volume Resistivity | |||
C96/35/90 | MΩ-cm | 1.40x109 | IPC TM-650 2.5.17.1 |
E24/125 | MΩ-cm | 5.36x107 | IPC TM-650 2.5.17.1 |
Surface Resistivity | |||
C96/35/90 | MΩ | 1.80x109 | IPC TM-650 2.5.17.1 |
E24/125 | MΩ | 3.16x108 | IPC TM-650 2.5.17.1 |
Electrical Strength | Volts/mil (kV/mm) | 622 (24.5) | IPC TM-650 2.5.6.2 |
Dielectric Breakdown | kV | >45 | IPC TM-650 2.5.6 |
Arc Resistance | sec | >180 | IPC TM-650 2.5.1 |
2. Thermal Properties | |||
Decomposition Temperature (Td) | |||
Initial | ℃ | >500 | IPC TM-650 2.4.24.6 |
5% | ℃ | >500 | IPC TM-650 2.4.24.6 |
T260 | min | >60 | IPC TM-650 2.4.24.1 |
T288 | min | >60 | IPC TM-650 2.4.24.1 |
T300 | min | >60 | IPC TM-650 2.4.24.1 |
Thermal Expansion, CTE (x,y) 50-150ºC | ppm/℃ | 8, 10 | IPC TM-650 2.4.41 |
Thermal Expansion, CTE (z) 50-150ºC | ppm/℃ | 20 | IPC TM-650 2.4.24 |
% z-axis Expansion (50-260ºC) | % | IPC TM-650 2.4.24 | |
3. Mechanical Properties | |||
Peel Strength to Copper (1 oz/35 micron) | |||
After Thermal Stress | lb/in (N/mm) | >12 (2.1) | IPC TM-650 2.4.8 |
At Elevated Temperatures (150º) | lb/in (N/mm) | 13.6 (2.4) | IPC TM-650 2.4.8.2 |
After Process Solutions | lb/in (N/mm) | IPC TM-650 2.4.8 | |
Young’s Modulus | kpsi (GPa) | 200 (1.38) | IPC TM-650 2.4.18.3 |
Flexural Strength (Machine/Cross) | kpsi (MPa) | 9.9/7.5 (68/52) | IPC TM-650 2.4.4 |
Tensile Strength (Machine/Cross) | kpsi (MPa) | 5.1/4.3 (35/30) | IPC TM-650 2.4.18.3 |
Compressive Modulus | kpsi (GPa) | >425 (>2.93) | ASTM D-3410 |
Poisson’s Ratio | - | 0.16 | ASTM D-3039 |
4. Physical Properties | |||
Water Absorption | % | 0.03 | IPC TM-650 2.6.2.1 |
Density, ambient 23ºC | g/cm3 | 3.20 | ASTM D792 Method A |
Thermal Conductivity | W/mK | 0.81 | ASTM E1461 |
Flammability | class | Meets V0 | UL-94 |
NASA Outgassing, 125ºC, ≤10-6 torr | % | NASA SP-R-0022A | |
Total Mass Loss | % | 0.01 | NASA SP-R-0022A |
Collected Volatiles | % | 0.00 | NASA SP-R-0022A |
Water Vapor Recovered | % | 0.00 | NASA SP-R-0022A |
Benefits
The AD1000 PCB offers significant advantages for your projects. Its mechanical robustness ensures it can withstand vibrational stress, making it ideal for miniaturized circuitry. Additionally, it demonstrates enhanced dimensional stability, outperforming other 10 Dk products in reliability.
Circuit miniaturization with the AD1000 leads to weight reduction, an essential factor in aerospace and high-performance applications. The design also optimizes heat management, ensuring longevity and stability even under demanding conditions.
Moreover, the AD1000 PCB enhances signal integrity, minimizing loss for superior communication and performance. Its cost-effective features streamline board layout and processing, ultimately reducing overall project costs. Importantly, it maintains low loss even in humid environments, ensuring high performance under various conditions.
PCB Material: | Woven Glass Reinforced PTFE/Ceramic Filled |
Designation: | AD1000 |
Dielectric constant: | 10.2 |
Dissipation Factor | 0.0023 10GHz |
Layer count: | Double Sided PCB, Multilayer PCB, Hybrid PCB |
Copper weight: | 0.5oz (17 µm), 1oz (35µm), 2oz (70µm) |
PCB thickness: | 6mil (0.1524mm), 10.5mil (0.2667mm), 15mil (0.381mm), 20mil (0.508mm), 25mil (0.635mm), 30mil (0.762mm), 50mil (1.27mm), 59mil (1.499mm ), 125mil ( 3.175mm ), 127mil (3.226mm ) |
PCB size: | ≤400mm X 500mm |
Solder mask: | Green, Black, Blue, Yellow, Red etc. |
Surface finish: | Bare copper, HASL, ENIG, Immersion silver, Immersion tin, OSP etc.. |
Specifications
The PCB stackup consists of a 2-layer rigid design, featuring a Copper Layer 1 of 35 μm, an AD1000 Core thickness of 1.499 mm (59 mil), and a Copper Layer 2 also at 35 μm.
In terms of board dimensions, the AD1000 measures 92.32 mm x 41.52 mm, available in 2 types (2 PCS), with a tolerance of +/- 0.15 mm. The minimum trace/space is set at 6/4 mils, while the minimum hole size is 0.35 mm.
The finished board thickness is 1.56 mm, and the finished copper weight is 1 oz (1.4 mils) for the outer layers. It features a via plating thickness of 20 μm and a surface finish of immersion silver.
For the silkscreen, the top side is marked in white, while there is no silkscreen on the bottom side. Additionally, there is no solder mask on either side of the board. Prior to shipment, a 100% electrical test is performed to ensure reliability.
Standards & Availability
This PCB adheres to high-quality standards. The artwork type is Gerber RS-274-X, and it meets the IPC-Class-2 standard. This product is available worldwide, ensuring accessibility for your projects.
Typical Applications
The AD1000 PCB is ideal for a variety of applications, including:
- X-Band and below systems
- Radar modules and manifolds
- Aircraft collision avoidance systems (TCAS)
- Ground-based radar surveillance systems
- Miniaturized circuitry and patch antennas
- Power amplifiers (PAs)
- Low noise amplifiers (LNAs)
With its advanced features and robust performance, the AD1000 PCB is a reliable choice for your electronic needs.
Contact Person: Ms. Ivy Deng
Tel: 86-755-27374946
Fax: 86-755-27374848