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AD1000 PCB 59mil 2-Layer Immersion Silver Circuit Board

AD1000 PCB 59mil 2-Layer Immersion Silver Circuit Board

MOQ: 1PCS
Price: USD9.99-99.99/PCS
Standard Packaging: Vacuum bags+Cartons
Delivery Period: 8-9 working days
Payment Method: T/T
Supply Capacity: 5000PCS per month
Detail Information
Place of Origin
CHINA
Brand Name
Bicheng
Certification
UL, ISO9001, IATF16949
Material:
AD1000
Layer Count:
2-layer
PCB Size:
92.32mm X 41.52 Mm=2Types=2PCS, +/- 0.15mm
PCB Thickness:
1.56mm
Copper Weight:
1oz (1.4 Mils) Inner/outer Layers
Surface Finish:
Immersion Silver
Highlight:

AD1000 Immersion Silver Circuit Board

,

2 Layer Immersion Silver Circuit Board

,

59mil Immersion Silver Circuit Board

Product Description

The AD1000 PCB is a state-of-the-art printed circuit board designed with woven-glass reinforced laminate, providing superior dimensional stability and mechanical robustness compared to other 10 Dk products. Its expansive panel size allows for efficient multi-circuit processing, making it an excellent choice for miniaturization in various applications. This high dielectric constant substrate is particularly beneficial for power amplifiers, filters, couplers, and other components utilizing low-impedance lines.

 

Key Features

- Material Excellence: The only woven glass reinforced PTFE/Ceramic laminate with a dielectric constant (Dk) of 10.2 or greater.

 

- Thermal Performance: Best-in-class thermal conductivity for enhanced heat dissipation.

 

- Durable Design: High copper peel strength of >12 lbs/in (after thermal stress) and 13.6 lbs/in at elevated temperatures (150°C), allowing for thinner etched line widths.

 

- Signal Integrity: Lowest insertion loss available, ensuring clearer signal transmission.

 

- Size Advantage: Larger panel sizes support complex layouts and designs.

 

- Moisture Resistance: Low moisture absorption of just 0.03% to maintain performance in humid environments.

 

- Reliable Construction: Excellent CTE values (8 ppm/°C, 10 ppm/°C, and 20 ppm/°C in X, Y, Z directions) guarantee reliability in component attachment and PTH performance.

 

Property Units Value Test Method
1. Electrical Properties
Dielectric Constant (may vary by thickness)
@1 MHz -   IPC TM-650 2.5.5.3
@ 10 GHz - 10.2 IPC TM-650 2.5.5.5
Dissipation Factor
@ 1 MHz -   IPC TM-650 2.5.5.3
@ 10 GHz - 0.0023 IPC TM-650 2.5.5.5
Temperature Coefficient of Dielectric -    
TCεr @ 10 GHz (-40-150°C) ppm/℃ -380 IPC TM-650 2.5.5.5
Volume Resistivity
C96/35/90 MΩ-cm 1.40x109 IPC TM-650 2.5.17.1
E24/125 MΩ-cm 5.36x107 IPC TM-650 2.5.17.1
Surface Resistivity
C96/35/90 1.80x109 IPC TM-650 2.5.17.1
E24/125 3.16x108 IPC TM-650 2.5.17.1
Electrical Strength Volts/mil (kV/mm) 622 (24.5) IPC TM-650 2.5.6.2
Dielectric Breakdown kV >45 IPC TM-650 2.5.6
Arc Resistance sec >180 IPC TM-650 2.5.1
2. Thermal Properties
Decomposition Temperature (Td)
Initial >500 IPC TM-650 2.4.24.6
5% >500 IPC TM-650 2.4.24.6
T260 min >60 IPC TM-650 2.4.24.1
T288 min >60 IPC TM-650 2.4.24.1
T300 min >60 IPC TM-650 2.4.24.1
Thermal Expansion, CTE (x,y) 50-150ºC ppm/℃ 8, 10 IPC TM-650 2.4.41
Thermal Expansion, CTE (z) 50-150ºC ppm/℃ 20 IPC TM-650 2.4.24
% z-axis Expansion (50-260ºC) %   IPC TM-650 2.4.24
3. Mechanical Properties
Peel Strength to Copper (1 oz/35 micron)
After Thermal Stress lb/in (N/mm) >12 (2.1) IPC TM-650 2.4.8
At Elevated Temperatures (150º) lb/in (N/mm) 13.6 (2.4) IPC TM-650 2.4.8.2
After Process Solutions lb/in (N/mm)   IPC TM-650 2.4.8
Young’s Modulus kpsi (GPa) 200 (1.38) IPC TM-650 2.4.18.3
Flexural Strength (Machine/Cross) kpsi (MPa) 9.9/7.5 (68/52) IPC TM-650 2.4.4
Tensile Strength (Machine/Cross) kpsi (MPa) 5.1/4.3 (35/30) IPC TM-650 2.4.18.3
Compressive Modulus kpsi (GPa) >425 (>2.93) ASTM D-3410
Poisson’s Ratio - 0.16 ASTM D-3039
4. Physical Properties
Water Absorption % 0.03 IPC TM-650 2.6.2.1
Density, ambient 23ºC g/cm3 3.20 ASTM D792 Method A
Thermal Conductivity W/mK 0.81 ASTM E1461
Flammability class Meets V0 UL-94
NASA Outgassing, 125ºC, ≤10-6 torr %   NASA SP-R-0022A
Total Mass Loss % 0.01 NASA SP-R-0022A
Collected Volatiles % 0.00 NASA SP-R-0022A
Water Vapor Recovered % 0.00 NASA SP-R-0022A

 

Benefits

The AD1000 PCB offers significant advantages for your projects. Its mechanical robustness ensures it can withstand vibrational stress, making it ideal for miniaturized circuitry. Additionally, it demonstrates enhanced dimensional stability, outperforming other 10 Dk products in reliability.

 

Circuit miniaturization with the AD1000 leads to weight reduction, an essential factor in aerospace and high-performance applications. The design also optimizes heat management, ensuring longevity and stability even under demanding conditions.

 

Moreover, the AD1000 PCB enhances signal integrity, minimizing loss for superior communication and performance. Its cost-effective features streamline board layout and processing, ultimately reducing overall project costs. Importantly, it maintains low loss even in humid environments, ensuring high performance under various conditions.

 

PCB Material: Woven Glass Reinforced PTFE/Ceramic Filled
Designation: AD1000
Dielectric constant: 10.2
Dissipation Factor 0.0023 10GHz
Layer count: Double Sided PCB, Multilayer PCB, Hybrid PCB
Copper weight: 0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
PCB thickness: 6mil (0.1524mm), 10.5mil (0.2667mm), 15mil (0.381mm), 20mil (0.508mm), 25mil (0.635mm), 30mil (0.762mm), 50mil (1.27mm), 59mil (1.499mm ), 125mil ( 3.175mm ), 127mil (3.226mm )
PCB size: ≤400mm X 500mm
Solder mask: Green, Black, Blue, Yellow, Red etc.
Surface finish: Bare copper, HASL, ENIG, Immersion silver, Immersion tin, OSP etc..

 

Specifications

The PCB stackup consists of a 2-layer rigid design, featuring a Copper Layer 1 of 35 μm, an AD1000 Core thickness of 1.499 mm (59 mil), and a Copper Layer 2 also at 35 μm.

 

In terms of board dimensions, the AD1000 measures 92.32 mm x 41.52 mm, available in 2 types (2 PCS), with a tolerance of +/- 0.15 mm. The minimum trace/space is set at 6/4 mils, while the minimum hole size is 0.35 mm.

 

The finished board thickness is 1.56 mm, and the finished copper weight is 1 oz (1.4 mils) for the outer layers. It features a via plating thickness of 20 μm and a surface finish of immersion silver.

 

For the silkscreen, the top side is marked in white, while there is no silkscreen on the bottom side. Additionally, there is no solder mask on either side of the board. Prior to shipment, a 100% electrical test is performed to ensure reliability.

 

AD1000 PCB 59mil 2-Layer Immersion Silver Circuit Board 0


Standards & Availability

This PCB adheres to high-quality standards. The artwork type is Gerber RS-274-X, and it meets the IPC-Class-2 standard. This product is available worldwide, ensuring accessibility for your projects.


Typical Applications

The AD1000 PCB is ideal for a variety of applications, including:

 

- X-Band and below systems

- Radar modules and manifolds

- Aircraft collision avoidance systems (TCAS)

- Ground-based radar surveillance systems

- Miniaturized circuitry and patch antennas

- Power amplifiers (PAs)

- Low noise amplifiers (LNAs)


With its advanced features and robust performance, the AD1000 PCB is a reliable choice for your electronic needs.

 

AD1000 PCB 59mil 2-Layer Immersion Silver Circuit Board 1

products
PRODUCTS DETAILS
AD1000 PCB 59mil 2-Layer Immersion Silver Circuit Board
MOQ: 1PCS
Price: USD9.99-99.99/PCS
Standard Packaging: Vacuum bags+Cartons
Delivery Period: 8-9 working days
Payment Method: T/T
Supply Capacity: 5000PCS per month
Detail Information
Place of Origin
CHINA
Brand Name
Bicheng
Certification
UL, ISO9001, IATF16949
Material:
AD1000
Layer Count:
2-layer
PCB Size:
92.32mm X 41.52 Mm=2Types=2PCS, +/- 0.15mm
PCB Thickness:
1.56mm
Copper Weight:
1oz (1.4 Mils) Inner/outer Layers
Surface Finish:
Immersion Silver
Minimum Order Quantity:
1PCS
Price:
USD9.99-99.99/PCS
Packaging Details:
Vacuum bags+Cartons
Delivery Time:
8-9 working days
Payment Terms:
T/T
Supply Ability:
5000PCS per month
Highlight

AD1000 Immersion Silver Circuit Board

,

2 Layer Immersion Silver Circuit Board

,

59mil Immersion Silver Circuit Board

Product Description

The AD1000 PCB is a state-of-the-art printed circuit board designed with woven-glass reinforced laminate, providing superior dimensional stability and mechanical robustness compared to other 10 Dk products. Its expansive panel size allows for efficient multi-circuit processing, making it an excellent choice for miniaturization in various applications. This high dielectric constant substrate is particularly beneficial for power amplifiers, filters, couplers, and other components utilizing low-impedance lines.

 

Key Features

- Material Excellence: The only woven glass reinforced PTFE/Ceramic laminate with a dielectric constant (Dk) of 10.2 or greater.

 

- Thermal Performance: Best-in-class thermal conductivity for enhanced heat dissipation.

 

- Durable Design: High copper peel strength of >12 lbs/in (after thermal stress) and 13.6 lbs/in at elevated temperatures (150°C), allowing for thinner etched line widths.

 

- Signal Integrity: Lowest insertion loss available, ensuring clearer signal transmission.

 

- Size Advantage: Larger panel sizes support complex layouts and designs.

 

- Moisture Resistance: Low moisture absorption of just 0.03% to maintain performance in humid environments.

 

- Reliable Construction: Excellent CTE values (8 ppm/°C, 10 ppm/°C, and 20 ppm/°C in X, Y, Z directions) guarantee reliability in component attachment and PTH performance.

 

Property Units Value Test Method
1. Electrical Properties
Dielectric Constant (may vary by thickness)
@1 MHz -   IPC TM-650 2.5.5.3
@ 10 GHz - 10.2 IPC TM-650 2.5.5.5
Dissipation Factor
@ 1 MHz -   IPC TM-650 2.5.5.3
@ 10 GHz - 0.0023 IPC TM-650 2.5.5.5
Temperature Coefficient of Dielectric -    
TCεr @ 10 GHz (-40-150°C) ppm/℃ -380 IPC TM-650 2.5.5.5
Volume Resistivity
C96/35/90 MΩ-cm 1.40x109 IPC TM-650 2.5.17.1
E24/125 MΩ-cm 5.36x107 IPC TM-650 2.5.17.1
Surface Resistivity
C96/35/90 1.80x109 IPC TM-650 2.5.17.1
E24/125 3.16x108 IPC TM-650 2.5.17.1
Electrical Strength Volts/mil (kV/mm) 622 (24.5) IPC TM-650 2.5.6.2
Dielectric Breakdown kV >45 IPC TM-650 2.5.6
Arc Resistance sec >180 IPC TM-650 2.5.1
2. Thermal Properties
Decomposition Temperature (Td)
Initial >500 IPC TM-650 2.4.24.6
5% >500 IPC TM-650 2.4.24.6
T260 min >60 IPC TM-650 2.4.24.1
T288 min >60 IPC TM-650 2.4.24.1
T300 min >60 IPC TM-650 2.4.24.1
Thermal Expansion, CTE (x,y) 50-150ºC ppm/℃ 8, 10 IPC TM-650 2.4.41
Thermal Expansion, CTE (z) 50-150ºC ppm/℃ 20 IPC TM-650 2.4.24
% z-axis Expansion (50-260ºC) %   IPC TM-650 2.4.24
3. Mechanical Properties
Peel Strength to Copper (1 oz/35 micron)
After Thermal Stress lb/in (N/mm) >12 (2.1) IPC TM-650 2.4.8
At Elevated Temperatures (150º) lb/in (N/mm) 13.6 (2.4) IPC TM-650 2.4.8.2
After Process Solutions lb/in (N/mm)   IPC TM-650 2.4.8
Young’s Modulus kpsi (GPa) 200 (1.38) IPC TM-650 2.4.18.3
Flexural Strength (Machine/Cross) kpsi (MPa) 9.9/7.5 (68/52) IPC TM-650 2.4.4
Tensile Strength (Machine/Cross) kpsi (MPa) 5.1/4.3 (35/30) IPC TM-650 2.4.18.3
Compressive Modulus kpsi (GPa) >425 (>2.93) ASTM D-3410
Poisson’s Ratio - 0.16 ASTM D-3039
4. Physical Properties
Water Absorption % 0.03 IPC TM-650 2.6.2.1
Density, ambient 23ºC g/cm3 3.20 ASTM D792 Method A
Thermal Conductivity W/mK 0.81 ASTM E1461
Flammability class Meets V0 UL-94
NASA Outgassing, 125ºC, ≤10-6 torr %   NASA SP-R-0022A
Total Mass Loss % 0.01 NASA SP-R-0022A
Collected Volatiles % 0.00 NASA SP-R-0022A
Water Vapor Recovered % 0.00 NASA SP-R-0022A

 

Benefits

The AD1000 PCB offers significant advantages for your projects. Its mechanical robustness ensures it can withstand vibrational stress, making it ideal for miniaturized circuitry. Additionally, it demonstrates enhanced dimensional stability, outperforming other 10 Dk products in reliability.

 

Circuit miniaturization with the AD1000 leads to weight reduction, an essential factor in aerospace and high-performance applications. The design also optimizes heat management, ensuring longevity and stability even under demanding conditions.

 

Moreover, the AD1000 PCB enhances signal integrity, minimizing loss for superior communication and performance. Its cost-effective features streamline board layout and processing, ultimately reducing overall project costs. Importantly, it maintains low loss even in humid environments, ensuring high performance under various conditions.

 

PCB Material: Woven Glass Reinforced PTFE/Ceramic Filled
Designation: AD1000
Dielectric constant: 10.2
Dissipation Factor 0.0023 10GHz
Layer count: Double Sided PCB, Multilayer PCB, Hybrid PCB
Copper weight: 0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
PCB thickness: 6mil (0.1524mm), 10.5mil (0.2667mm), 15mil (0.381mm), 20mil (0.508mm), 25mil (0.635mm), 30mil (0.762mm), 50mil (1.27mm), 59mil (1.499mm ), 125mil ( 3.175mm ), 127mil (3.226mm )
PCB size: ≤400mm X 500mm
Solder mask: Green, Black, Blue, Yellow, Red etc.
Surface finish: Bare copper, HASL, ENIG, Immersion silver, Immersion tin, OSP etc..

 

Specifications

The PCB stackup consists of a 2-layer rigid design, featuring a Copper Layer 1 of 35 μm, an AD1000 Core thickness of 1.499 mm (59 mil), and a Copper Layer 2 also at 35 μm.

 

In terms of board dimensions, the AD1000 measures 92.32 mm x 41.52 mm, available in 2 types (2 PCS), with a tolerance of +/- 0.15 mm. The minimum trace/space is set at 6/4 mils, while the minimum hole size is 0.35 mm.

 

The finished board thickness is 1.56 mm, and the finished copper weight is 1 oz (1.4 mils) for the outer layers. It features a via plating thickness of 20 μm and a surface finish of immersion silver.

 

For the silkscreen, the top side is marked in white, while there is no silkscreen on the bottom side. Additionally, there is no solder mask on either side of the board. Prior to shipment, a 100% electrical test is performed to ensure reliability.

 

AD1000 PCB 59mil 2-Layer Immersion Silver Circuit Board 0


Standards & Availability

This PCB adheres to high-quality standards. The artwork type is Gerber RS-274-X, and it meets the IPC-Class-2 standard. This product is available worldwide, ensuring accessibility for your projects.


Typical Applications

The AD1000 PCB is ideal for a variety of applications, including:

 

- X-Band and below systems

- Radar modules and manifolds

- Aircraft collision avoidance systems (TCAS)

- Ground-based radar surveillance systems

- Miniaturized circuitry and patch antennas

- Power amplifiers (PAs)

- Low noise amplifiers (LNAs)


With its advanced features and robust performance, the AD1000 PCB is a reliable choice for your electronic needs.

 

AD1000 PCB 59mil 2-Layer Immersion Silver Circuit Board 1

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