logo
products
PRODUCTS DETAILS
Home > Products >
4-Layer Hybrid PCB with RT/duroid 5880 and RO4003C Materials Immersion Gold
Products

RF PCB Board

Rogers PCB Board

PTFE PCB Board

High TG PCB

Multi Layer PCB

Taconic PCB

HDI PCB Board

High Speed PCB

Impedance Controlled PCB

Flexible PCB Board

FR4 PCB Board

PCB Stencil

Metal Core PCB
Contact Us
Ms. Ivy Deng
sales10@bichengpcb.com
86-755-27374847
Contact Now
4-Layer Hybrid PCB with RT/duroid 5880 and RO4003C Materials Immersion Gold
  • name

4-Layer Hybrid PCB with RT/duroid 5880 and RO4003C Materials Immersion Gold

MOQ: 1PCS
Price: USD9.99-99.99/PCS
Standard Packaging: Vacuum bags+Cartons
Delivery Period: 8-9 working days
Payment Method: T/T
Supply Capacity: 5000PCS per month
Details Information
Product Description
Detail Information
Place of Origin
CHINA
Brand Name
Bicheng
Certification
UL, ISO9001, IATF16949
Material:
RT/duroid 5880 And RO4003C
Layer Count:
4-layer
PCB Size:
110mm X 51mm=1PCS, +/- 0.15mm
PCB Thickness:
1.3mm
Copper Weight:
1oz (1.4 Mils) Inner/outer Layers
Surface Finish:
Immersion Gold
Highlight:

RT/duroid 5880 Hybrid PCB

,

Immersion Gold Hybrid PCB

,

4 Layer Hybrid PCB

Product Description

Introducing our newly shipped 4-layer printed circuit board (PCB) engineered with high-performance materials—Rogers RT/duroid 5880 and RO4003C. This PCB is designed for high-frequency and broadband applications, offering exceptional electrical properties and reliability.


Material Introductions

 

RT/duroid 5880
Rogers RT/duroid 5880 is a high-frequency laminate made from PTFE composites reinforced with glass microfibers. This material features:
- Low Dielectric Constant (Dk): 2.2 ± 0.02 at 10 GHz
- Low Loss: Dissipation factor of 0.0009 at 10 GHz
- Uniformity: Randomly oriented microfibers enhance Dk stability.

 

RT/duroid 5880 Typical Value
Property RT/duroid 5880 Direction Units Condition Test Method
Dielectric Constant,εProcess 2.20
2.20±0.02 spec.		 Z N/A C24/23/50
C24/23/50		 1 MHz IPC-TM-650 2.5.5.3
10 GHz IPC-TM 2.5.5.5
Dielectric Constant,εDesign 2.2 Z N/A 8GHz to 40 GHz Differential Phase Length Method
Dissipation Factor,tanδ 0.0004
0.0009		 Z N/A C24/23/50
C24/23/50		 1 MHz IPC-TM-650 2.5.5.3
10 GHz IPC-TM 2.5.5.5
Thermal Coefficient of ε -125 Z ppm/℃ -50℃to 150℃ IPC-TM-650 2.5.5.5
Volume Resistivity 2 x 107 Z Mohm cm C/96/35/90 ASTM D 257
Surface Resistivity 3 x 107 Z Mohm C/96/35/90 ASTM D 257
Specific Heat 0.96(0.23) N/A j/g/k
(cal/g/c)		 N/A Calculated
Tensile Modulus Test at 23℃ Test at 100℃ N/A MPa(kpsi) A ASTM D 638
1070(156) 450(65) X
860(125) 380(55) Y
Ultimate Stress 29(4.2) 20(2.9) X
27(3.9) 18(2.6) Y
Ultimate Strain 6 7.2 X %
4.9 5.8 Y
Compressive Modulus 710(103) 500(73) X MPa(kpsi) A ASTM D 695
710(103) 500(73) Y
940(136) 670(97) Z
Ultimate Stress 27(3.9) 22(3.2) X
29(5.3) 21(3.1) Y
52(7.5) 43(6.3) Z
Ultimate Strain 8.5 8.4 X %
7.7 7.8 Y
12.5 17.6 Z
Moisture Absorption 0.02 N/A % 0.62"(1.6mm) D48/50 ASTM D 570
Thermal Conductivity 0.2 Z W/m/k 80℃ ASTM C 518
Coefficient of Thermal Expansion 31
48
237		 X
Y
Z		 ppm/℃ 0-100℃ IPC-TM-650 2.4.41
Td 500 N/A ℃ TGA N/A ASTM D 3850
Density 2.2 N/A gm/cm3 N/A ASTM D 792
Copper Peel 31.2(5.5) N/A Pli(N/mm) 1oz(35mm)EDC foil
after solder float		 IPC-TM-650 2.4.8
Flammability V-0 N/A N/A N/A UL 94
Lead-free Process Compatible Yes N/A N/A N/A N/A

 

RO4003C
Rogers RO4003C is a proprietary woven glass reinforced hydrocarbon/ceramic material that combines:
- Dielectric Constant (Dk): 3.38 ± 0.05 at 10 GHz
- Cost-Effectiveness: Utilizes standard epoxy/glass processing methods.
- Low Moisture Absorption: 0.06%, enhancing reliability.

 

 

 
RO4003C Typical Value
Property RO4003C Direction Units Condition Test Method
Dielectric Constant,εProcess 3.38±0.05 Z   10 GHz/23℃ IPC-TM-650 2.5.5.5 Clamped Stripline
Dielectric Constant,εDesign 3.55 Z   8 to 40 GHz Differential Phase Length Method
Dissipation Factortan,δ 0.0027
0.0021		 Z   10 GHz/23℃
2.5 GHz/23℃		 IPC-TM-650 2.5.5.5
Thermal Coefficient of ε +40 Z ppm/℃ -50℃to 150℃ IPC-TM-650 2.5.5.5
Volume Resistivity 1.7 x 1010   MΩ.cm COND A IPC-TM-650 2.5.17.1
Surface Resistivity 4.2 x 109   MΩ COND A IPC-TM-650 2.5.17.1
Electrical Strength 31.2(780) Z Kv/mm(v/mil) 0.51mm(0.020") IPC-TM-650 2.5.6.2
Tensile Modulus 19,650(2,850)
19,450(2,821)		 X
Y		 MPa(ksi) RT ASTM D 638
Tensile Strength 139(20.2)
100(14.5)		 X
Y		 MPa(ksi) RT ASTM D 638
Flexural Strength 276
(40)		   MPa
(kpsi)		   IPC-TM-650 2.4.4
Dimensional Stability <0.3 X,Y mm/m
(mil/inch)		 after etch+E2/150℃ IPC-TM-650 2.4.39A
Coefficient of Thermal Expansion 11
14
46		 X
Y
Z		 ppm/℃ -55℃to288℃ IPC-TM-650 2.4.41
Tg >280   ℃ TMA A IPC-TM-650 2.4.24.3
Td 425   ℃ TGA   ASTM D 3850
Thermal Conductivity 0.71   W/M/oK 80℃ ASTM C518
Moisture Absorption 0.06   % 48hrs immersion 0.060"
sample Temperature 50℃		 ASTM D 570
Density 1.79   gm/cm3 23℃ ASTM D 792
Copper Peel Stength 1.05
(6.0)		   N/mm
(pli)		 after solder float 1 oz.
EDC Foil		 IPC-TM-650 2.4.8
Flammability N/A       UL 94
Lead-free Process Compatible Yes        

 

4-Layer Hybrid PCB with RT/duroid 5880 and RO4003C Materials Immersion Gold 0


PCB Specifications

Stackup:

 

Copper Layer 1: 35 μm

RT/duroid 5880: 0.787 mm (31 mil)

Copper Layer 2: 35 μm

RO4450F Prepreg Bondply: 0.101 mm (4 mil)

Copper Layer 3: 35 μm

RO4003C: 0.203 mm (8 mil)

Copper Layer 4: 35 μm

 

This PCB measures 110 mm x 51 mm ± 0.15 mm, with a finished thickness of 1.3 mm and a copper weight of 1 oz (1.4 mils) on both inner and outer layers. It supports a minimum trace/space of 4/6 mils and a minimum hole size of 0.3 mm, with a via plating thickness of 20 μm.

For surface finish, it uses immersion gold, complemented by a green solder mask on the top side and no mask on the bottom. A white silkscreen is applied on the top for clear component labeling. Each PCB is 100% electrically tested before shipment to ensure high quality and reliability.


Typical Applications

- Commercial Airline Broadband Antennas
- Microstrip and Stripline Circuits
- Millimeter Wave Applications
- Radar Systems
- Guidance Systems
- Point-to-Point Digital Radio Antennas

 

Quality Assurance

This PCB meets IPC-Class 2 standards and is supplied with Gerber RS-274-X artwork format, ensuring compatibility with industry-standard PCB design software.


Global Availability

Available for worldwide shipping, our advanced PCB technology is ready to support your high-frequency application needs.

 

4-Layer Hybrid PCB with RT/duroid 5880 and RO4003C Materials Immersion Gold 1

Tags: 

1oz RF PCB Board,  

1.6mm RF PCB Board,  

0.635mm RF PCB Board

Recommended Products
TP1020 PCB 2-layer 6mm Thick ENIG Finish 1oz Copper

TP1020 PCB 2-layer 6mm Thick ENIG Finish 1oz Copper

Contact Now
RF-60A PCB 2-layer 25mil Thick Black Silkscreen Immersion Gold

RF-60A PCB 2-layer 25mil Thick Black Silkscreen Immersion Gold

Contact Now
RF-35 PCB Double-Sided 20mil ENIG Finish

RF-35 PCB Double-Sided 20mil ENIG Finish

Contact Now
IsoClad 933 PCB 2-layer 20mil Electroless Nickel Immersion Gold Finish

IsoClad 933 PCB 2-layer 20mil Electroless Nickel Immersion Gold Finish

Contact Now
RO3003G2 High Frequency PCB Built On 10mil 0.254mm Substrates With Immersion Gold

RO3003G2 High Frequency PCB Built On 10mil 0.254mm Substrates With Immersion Gold

Contact Now
25mil RT Duroid 6010.2LM PCB 2-layer Rigid Circuit Board With Immersion Gold

25mil RT Duroid 6010.2LM PCB 2-layer Rigid Circuit Board With Immersion Gold

Contact Now
6.35mm F4BTMS350 RF PCB 1OZ Hot Air Soldering Level (HASL)

6.35mm F4BTMS350 RF PCB 1OZ Hot Air Soldering Level (HASL)

Contact Now
Immersion Gold PCB based on 20mil RO3003 Laminates 2 Layer Circuit Boards

Immersion Gold PCB based on 20mil RO3003 Laminates 2 Layer Circuit Boards

Contact Now
RF-10 PCB Double-Side 60mil 1.524mm Immersion Tin Finished

RF-10 PCB Double-Side 60mil 1.524mm Immersion Tin Finished

Contact Now
F4BM220 PCB Double-Sided 0.8mm Substrate Immersion Gold

F4BM220 PCB Double-Sided 0.8mm Substrate Immersion Gold

Contact Now
2-Layer PCB TP980 7.62mm Thick ENIG With Electroless Nickel Immersion Gold Coating

2-Layer PCB TP980 7.62mm Thick ENIG With Electroless Nickel Immersion Gold Coating

Contact Now
products
PRODUCTS DETAILS
Products

RF PCB Board

Rogers PCB Board

PTFE PCB Board

High TG PCB

Multi Layer PCB

Taconic PCB

HDI PCB Board

High Speed PCB

Impedance Controlled PCB

Flexible PCB Board

FR4 PCB Board

PCB Stencil

Metal Core PCB
4-Layer Hybrid PCB with RT/duroid 5880 and RO4003C Materials Immersion Gold
  • name
4-Layer Hybrid PCB with RT/duroid 5880 and RO4003C Materials Immersion Gold
MOQ: 1PCS
Price: USD9.99-99.99/PCS
Standard Packaging: Vacuum bags+Cartons
Delivery Period: 8-9 working days
Payment Method: T/T
Supply Capacity: 5000PCS per month
Detail Information
Product Description
Detail Information
Place of Origin
CHINA
Brand Name
Bicheng
Certification
UL, ISO9001, IATF16949
Material:
RT/duroid 5880 And RO4003C
Layer Count:
4-layer
PCB Size:
110mm X 51mm=1PCS, +/- 0.15mm
PCB Thickness:
1.3mm
Copper Weight:
1oz (1.4 Mils) Inner/outer Layers
Surface Finish:
Immersion Gold
Minimum Order Quantity:
1PCS
Price:
USD9.99-99.99/PCS
Packaging Details:
Vacuum bags+Cartons
Delivery Time:
8-9 working days
Payment Terms:
T/T
Supply Ability:
5000PCS per month
Highlight

RT/duroid 5880 Hybrid PCB

,

Immersion Gold Hybrid PCB

,

4 Layer Hybrid PCB

Product Description

Introducing our newly shipped 4-layer printed circuit board (PCB) engineered with high-performance materials—Rogers RT/duroid 5880 and RO4003C. This PCB is designed for high-frequency and broadband applications, offering exceptional electrical properties and reliability.


Material Introductions

 

RT/duroid 5880
Rogers RT/duroid 5880 is a high-frequency laminate made from PTFE composites reinforced with glass microfibers. This material features:
- Low Dielectric Constant (Dk): 2.2 ± 0.02 at 10 GHz
- Low Loss: Dissipation factor of 0.0009 at 10 GHz
- Uniformity: Randomly oriented microfibers enhance Dk stability.

 

RT/duroid 5880 Typical Value
Property RT/duroid 5880 Direction Units Condition Test Method
Dielectric Constant,εProcess 2.20
2.20±0.02 spec.		 Z N/A C24/23/50
C24/23/50		 1 MHz IPC-TM-650 2.5.5.3
10 GHz IPC-TM 2.5.5.5
Dielectric Constant,εDesign 2.2 Z N/A 8GHz to 40 GHz Differential Phase Length Method
Dissipation Factor,tanδ 0.0004
0.0009		 Z N/A C24/23/50
C24/23/50		 1 MHz IPC-TM-650 2.5.5.3
10 GHz IPC-TM 2.5.5.5
Thermal Coefficient of ε -125 Z ppm/℃ -50℃to 150℃ IPC-TM-650 2.5.5.5
Volume Resistivity 2 x 107 Z Mohm cm C/96/35/90 ASTM D 257
Surface Resistivity 3 x 107 Z Mohm C/96/35/90 ASTM D 257
Specific Heat 0.96(0.23) N/A j/g/k
(cal/g/c)		 N/A Calculated
Tensile Modulus Test at 23℃ Test at 100℃ N/A MPa(kpsi) A ASTM D 638
1070(156) 450(65) X
860(125) 380(55) Y
Ultimate Stress 29(4.2) 20(2.9) X
27(3.9) 18(2.6) Y
Ultimate Strain 6 7.2 X %
4.9 5.8 Y
Compressive Modulus 710(103) 500(73) X MPa(kpsi) A ASTM D 695
710(103) 500(73) Y
940(136) 670(97) Z
Ultimate Stress 27(3.9) 22(3.2) X
29(5.3) 21(3.1) Y
52(7.5) 43(6.3) Z
Ultimate Strain 8.5 8.4 X %
7.7 7.8 Y
12.5 17.6 Z
Moisture Absorption 0.02 N/A % 0.62"(1.6mm) D48/50 ASTM D 570
Thermal Conductivity 0.2 Z W/m/k 80℃ ASTM C 518
Coefficient of Thermal Expansion 31
48
237		 X
Y
Z		 ppm/℃ 0-100℃ IPC-TM-650 2.4.41
Td 500 N/A ℃ TGA N/A ASTM D 3850
Density 2.2 N/A gm/cm3 N/A ASTM D 792
Copper Peel 31.2(5.5) N/A Pli(N/mm) 1oz(35mm)EDC foil
after solder float		 IPC-TM-650 2.4.8
Flammability V-0 N/A N/A N/A UL 94
Lead-free Process Compatible Yes N/A N/A N/A N/A

 

RO4003C
Rogers RO4003C is a proprietary woven glass reinforced hydrocarbon/ceramic material that combines:
- Dielectric Constant (Dk): 3.38 ± 0.05 at 10 GHz
- Cost-Effectiveness: Utilizes standard epoxy/glass processing methods.
- Low Moisture Absorption: 0.06%, enhancing reliability.

 

 

 
RO4003C Typical Value
Property RO4003C Direction Units Condition Test Method
Dielectric Constant,εProcess 3.38±0.05 Z   10 GHz/23℃ IPC-TM-650 2.5.5.5 Clamped Stripline
Dielectric Constant,εDesign 3.55 Z   8 to 40 GHz Differential Phase Length Method
Dissipation Factortan,δ 0.0027
0.0021		 Z   10 GHz/23℃
2.5 GHz/23℃		 IPC-TM-650 2.5.5.5
Thermal Coefficient of ε +40 Z ppm/℃ -50℃to 150℃ IPC-TM-650 2.5.5.5
Volume Resistivity 1.7 x 1010   MΩ.cm COND A IPC-TM-650 2.5.17.1
Surface Resistivity 4.2 x 109   MΩ COND A IPC-TM-650 2.5.17.1
Electrical Strength 31.2(780) Z Kv/mm(v/mil) 0.51mm(0.020") IPC-TM-650 2.5.6.2
Tensile Modulus 19,650(2,850)
19,450(2,821)		 X
Y		 MPa(ksi) RT ASTM D 638
Tensile Strength 139(20.2)
100(14.5)		 X
Y		 MPa(ksi) RT ASTM D 638
Flexural Strength 276
(40)		   MPa
(kpsi)		   IPC-TM-650 2.4.4
Dimensional Stability <0.3 X,Y mm/m
(mil/inch)		 after etch+E2/150℃ IPC-TM-650 2.4.39A
Coefficient of Thermal Expansion 11
14
46		 X
Y
Z		 ppm/℃ -55℃to288℃ IPC-TM-650 2.4.41
Tg >280   ℃ TMA A IPC-TM-650 2.4.24.3
Td 425   ℃ TGA   ASTM D 3850
Thermal Conductivity 0.71   W/M/oK 80℃ ASTM C518
Moisture Absorption 0.06   % 48hrs immersion 0.060"
sample Temperature 50℃		 ASTM D 570
Density 1.79   gm/cm3 23℃ ASTM D 792
Copper Peel Stength 1.05
(6.0)		   N/mm
(pli)		 after solder float 1 oz.
EDC Foil		 IPC-TM-650 2.4.8
Flammability N/A       UL 94
Lead-free Process Compatible Yes        

 

4-Layer Hybrid PCB with RT/duroid 5880 and RO4003C Materials Immersion Gold 0


PCB Specifications

Stackup:

 

Copper Layer 1: 35 μm

RT/duroid 5880: 0.787 mm (31 mil)

Copper Layer 2: 35 μm

RO4450F Prepreg Bondply: 0.101 mm (4 mil)

Copper Layer 3: 35 μm

RO4003C: 0.203 mm (8 mil)

Copper Layer 4: 35 μm

 

This PCB measures 110 mm x 51 mm ± 0.15 mm, with a finished thickness of 1.3 mm and a copper weight of 1 oz (1.4 mils) on both inner and outer layers. It supports a minimum trace/space of 4/6 mils and a minimum hole size of 0.3 mm, with a via plating thickness of 20 μm.

For surface finish, it uses immersion gold, complemented by a green solder mask on the top side and no mask on the bottom. A white silkscreen is applied on the top for clear component labeling. Each PCB is 100% electrically tested before shipment to ensure high quality and reliability.


Typical Applications

- Commercial Airline Broadband Antennas
- Microstrip and Stripline Circuits
- Millimeter Wave Applications
- Radar Systems
- Guidance Systems
- Point-to-Point Digital Radio Antennas

 

Quality Assurance

This PCB meets IPC-Class 2 standards and is supplied with Gerber RS-274-X artwork format, ensuring compatibility with industry-standard PCB design software.


Global Availability

Available for worldwide shipping, our advanced PCB technology is ready to support your high-frequency application needs.

 

4-Layer Hybrid PCB with RT/duroid 5880 and RO4003C Materials Immersion Gold 1

Tags: 

1oz RF PCB Board,

1.6mm RF PCB Board,

0.635mm RF PCB Board

Bicheng Electronics Technology Co., Ltd
6-11C Shidai Jingyuan,Fuyong, Baoan, Shenzhen, Guangdong, China 518103
Tel: 86-755-27374946
Sitemap |  Privacy Policy | China Good Quality RF PCB Board Supplier. Copyright © 2020-2025 Bicheng Electronics Technology Co., Ltd . All Rights Reserved.