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Product Details:
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| Material: | RO4003C And FR-4 | Layer Count: | 6-layer |
|---|---|---|---|
| PCB Size: | 83.50mm X 66mm=1PCS, +/- 0.15mm | PCB Thickness: | 1.1mm |
| Copper Weight: | 1oz (1.4 Mils) Inner/outer Layers | Surface Finish: | Immersion Gold |
| Highlight: | RO4003C Hybrid PCB,FR4 Material Hybrid PCB,Impedance Controlled Hybrid PCB |
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We are excited to announce our newly shipped 6-layer printed circuit board (PCB) designed with Rogers RO4003C materials. This innovative PCB combines exceptional electrical performance with manufacturing ease, making it a perfect solution for high-frequency applications.
Key Features
RO4003C Material
- Dielectric Constant (Dk): 3.38 ± 0.05 at 10 GHz
- Dissipation Factor: 0.0027 at 10 GHz
- Thermal Conductivity: 0.71 W/m/°K
- Thermal Coefficient of Dielectric Constant: +40 ppm/°C (operating range: -50°C to 150°C)
- CTE Matched to Copper:
- X axis: 11 ppm/°C
- Y axis: 14 ppm/°C
- Z-axis CTE: 46 ppm/°C
- Glass Transition Temperature (Tg): >280 °C
- Moisture Absorption: 0.06%
- Non-Brominated
| RO4003C Typical Value | |||||
| Property | RO4003C | Direction | Units | Condition | Test Method |
| Dielectric Constant,εProcess | 3.38±0.05 | Z | 10 GHz/23℃ | IPC-TM-650 2.5.5.5 Clamped Stripline | |
| Dielectric Constant,εDesign | 3.55 | Z | 8 to 40 GHz | Differential Phase Length Method | |
| Dissipation Factortan,δ | 0.0027 0.0021 |
Z | 10 GHz/23℃ 2.5 GHz/23℃ |
IPC-TM-650 2.5.5.5 | |
| Thermal Coefficient of ε | +40 | Z | ppm/℃ | -50℃to 150℃ | IPC-TM-650 2.5.5.5 |
| Volume Resistivity | 1.7 x 1010 | MΩ.cm | COND A | IPC-TM-650 2.5.17.1 | |
| Surface Resistivity | 4.2 x 109 | MΩ | COND A | IPC-TM-650 2.5.17.1 | |
| Electrical Strength | 31.2(780) | Z | Kv/mm(v/mil) | 0.51mm(0.020") | IPC-TM-650 2.5.6.2 |
| Tensile Modulus | 19,650(2,850) 19,450(2,821) |
X Y |
MPa(ksi) | RT | ASTM D 638 |
| Tensile Strength | 139(20.2) 100(14.5) |
X Y |
MPa(ksi) | RT | ASTM D 638 |
| Flexural Strength | 276 (40) |
MPa (kpsi) |
IPC-TM-650 2.4.4 | ||
| Dimensional Stability | <0.3 | X,Y | mm/m (mil/inch) |
after etch+E2/150℃ | IPC-TM-650 2.4.39A |
| Coefficient of Thermal Expansion | 11 14 46 |
X Y Z |
ppm/℃ | -55℃to288℃ | IPC-TM-650 2.4.41 |
| Tg | >280 | ℃ TMA | A | IPC-TM-650 2.4.24.3 | |
| Td | 425 | ℃ TGA | ASTM D 3850 | ||
| Thermal Conductivity | 0.71 | W/M/oK | 80℃ | ASTM C518 | |
| Moisture Absorption | 0.06 | % | 48hrs immersion 0.060" sample Temperature 50℃ |
ASTM D 570 | |
| Density | 1.79 | gm/cm3 | 23℃ | ASTM D 792 | |
| Copper Peel Stength | 1.05 (6.0) |
N/mm (pli) |
after solder float 1 oz. EDC Foil |
IPC-TM-650 2.4.8 | |
| Flammability | N/A | UL 94 | |||
| Lead-free Process Compatible | Yes | ||||
S1000-2M Features
- Enhanced Z-axis CTE for improved through-hole reliability
- Excellent mechanical processability and thermal resistance
- Lead-free compatibility
- Tg: 180°C (DSC)
- UV blocking and AOI compatible
- High heat resistance with superior anti-CAF performance
- Low water absorption
PCB Specifications
- Layer Stackup:
- Copper Layer 1: 35 μm
- RO4003C Core: 0.305 mm (12 mil)
- Copper Layer 2: 35 μm
- Prepreg Bondply (1080 RC63%): 0.0644 mm (2.5 mil)
- Copper Layer 3: 35 μm
- FR-4 (Tg 170): 0.076 - 0.203 mm (3 mil)
- Copper Layer 4: 35 μm
- Prepreg Bondply (1080 RC63%): 0.0644 mm (2.5 mil)
- Copper Layer 5: 35 μm
- RO4003C Core: 0.305 mm (12 mil)
- Copper Layer 6: 35 μm
- Dimensions: 83.50 mm x 66 mm ± 0.15 mm
- Finished Board Thickness: 1.1 mm
- Finished Copper Weight: 1 oz (1.4 mils) on both inner and outer layers
-Minimum Trace/Space: 4/4 mils
- Minimum Hole Size: 0.2 mm
- Via Plating Thickness: 20 μm
- Surface Finish: Immersion Gold
- Solder Mask Color: Matt Green (top and bottom)
- Silkscreen Color: White (top only)
- Impedance Control: 50 ohm on 4 mil / 4 mil traces/gaps (top layer)
- Via Configuration: 0.2 mm via filled and capped
- Electrical Testing: 100% before shipment
Typical Applications
This PCB is ideal for a variety of advanced applications, including:
- Commercial airline broadband antennas
- Microstrip and stripline circuits
- Millimeter wave applications
- Radar systems
- Guidance systems
- Point-to-point digital radio antennas
Quality Assurance
Manufactured to IPC-Class 2 standards, our PCB ensures high reliability and performance. The artwork is supplied in Gerber RS-274-X format, compatible with most PCB design tools.
Global Availability
Our high-performance PCB is available for worldwide shipping, providing cutting-edge solutions wherever you are located.
Contact Person: Ms. Ivy Deng
Tel: 86-755-27374946
Fax: 86-755-27374848
