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TC350 PCB 10mil 2-Layer 1OZ Copper with ENEPIG

China Bicheng Electronics Technology Co., Ltd certification
China Bicheng Electronics Technology Co., Ltd certification
Kevin, Received and tested the boards - thanks very much. These are perfect, exactly what we needed. rgds Rich

—— Rich Rickett

Ruth, I got the PCB today, and they are just perfect. Please stay a little patience, my next order is coming soon. Kind regards from Hamburg Olaf

—— Olaf Kühnhold

Hi Natalie. It was perfect, I attach some pictures for your reference. And I send you next 2 projects to budget. Thanks a lot again

—— Sebastian Toplisek

Kevin, Thanks, they were perfectly made, and work well. As promised, here are the links for my latest project, using the PCBs you manufactured for me: Regards, Daniel

—— Daniel Ford

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TC350 PCB 10mil 2-Layer 1OZ Copper with ENEPIG

TC350 PCB 10mil 2-Layer 1OZ Copper with ENEPIG
TC350 PCB 10mil 2-Layer 1OZ Copper with ENEPIG TC350 PCB 10mil 2-Layer 1OZ Copper with ENEPIG

Large Image :  TC350 PCB 10mil 2-Layer 1OZ Copper with ENEPIG

Product Details:
Place of Origin: CHINA
Brand Name: Bicheng
Certification: UL, ISO9001, IATF16949
Payment & Shipping Terms:
Minimum Order Quantity: 1PCS
Price: USD9.99-99.99/PCS
Packaging Details: Vacuum bags+Cartons
Delivery Time: 8-9 working days
Payment Terms: T/T
Supply Ability: 5000PCS per month
Detailed Product Description
Material: TC350 Layer Count: 2-layer
PCB Size: 97.5mm X 31.7 Mm=1PCS, +/- 0.15mm PCB Thickness: 10mil
Copper Weight: 1oz (1.4 Mils) Outer Layers Surface Finish: Electroless Nicklek, Electroless Palladium And Immersion Gold (ENEPIG)

TC350 PCB is crafted from Rogers TC350 laminates, featuring a unique composition of PTFE, highly thermally conductive ceramic fillers, and woven glass reinforcement. This combination results in low insertion loss and high thermal conductivity, making the TC350 an excellent choice for high-power applications. Its design ensures superior reliability and reduced operating temperatures, ideal for power amplifier and antenna systems.

 

With a dielectric constant (Dk) of 3.5 at 1 MHz, 1.8 GHz, and 10 GHz, the TC350 laminates maintain excellent stability across various temperatures. This stability is crucial for maximizing gain and minimizing bandwidth loss in power amplifiers and antennas. Moreover, it is key for phase and impedance-sensitive devices, such as network transformers and Wilkinson Power Dividers.

 

Key features include:
- Dissipation Factor: 0.0015 at 1 MHz, 0.0018 at 1.8 GHz, and 0.002 at 10 GHz
- Coefficient of Thermal Expansion (CTE): 7 ppm/°C in the x and y axes, 23 ppm/°C in the z-axis from 50°C to 150°C
- Low Thermal Coefficient of Dk: -9 ppm/°C from -40°C to 140°C
- High Thermal Conductivity: 0.72 W/mk
- Moisture Absorption: 0.05%
- T260, T288, T300: > 60 minutes

 

Property Units Value Test Merthod
1. Electrical Properties  
Dielectric Constant (may vary by thickness)      
@1 MHz 3.50 IPC TM-650 2.5.5.3
@1.8 GHz 3.50 RESONANT CAVITY
@10 GHz 3.50 IPC TM-650 2.5.5.5
Dissipation Factor      
@1 MHz 0.0015 IPC TM-650 2.5.5.3
@1.8 GHz 0.0018 RESONANT CAVITY
@10 GHz 0.0020 IPC TM-650 2.5.5.5
Temperature Coefficient of Dielectric    
TC r @ 10 GHz (-40-150°C) ppm/ºC -9 IPC TM-650 2.5.5.5
Volume Resistivity      
C96/35/90 MΩ-cm 7.4x106 IPC TM-650 2.5.17.1
E24/125 MΩ-cm 1.4x108  
Surface Resistivity      
C96/35/90 3.2x107 IPC TM-650 2.5.17.1
E24/125 4.3x108 IPC TM-650 2.5.17.1
Electrical Strength Volts/mil (kV/mm) 780 (31) IPC TM-650 2.5.6.2
Dielectric Breakdown kV 40 IPC TM-650 2.5.6
Arc Resistance sec >240 IPC TM-650 2.5.1
2.Thermal Properties  
Decomposition Temperature (Td)      
Initial °C 520 IPC TM-650 2.4.24.6
5% °C 567 IPC TM-650 2.4.24.6
T260 min >60 IPC TM-650 2.4.24.1
T288 min >60 IPC TM-650 2.4.24.1
T300 min >60 IPC TM-650 2.4.24.1
Thermal Expansion, CTE (x,y) 50-150ºC ppm/ºC 7, 7 IPC TM-650 2.4.41
Thermal Expansion, CTE (z) 50-150ºC ppm/ºC 12 IPC TM-650 2.4.24
% z-axis Expansion (50-260ºC) % 1.2 IPC TM-650 2.4.24
3. Mechanical Properties  
Peel Strength to Copper (1 oz/35 micron)      
After Thermal Stress lb/in (N/mm) 7 (1.2) IPC TM-650 2.4.8
At Elevated Temperatures (150ºC) lb/in (N/mm) 9 (1.6) IPC TM-650 2.4.8.2
After Process Solutions lb/in (N/mm) 7 (1.2) IPC TM-650 2.4.8
Young’s Modulus kpsi (MPa)   IPC TM-650 2.4.18.3
Flexural Strength (Machine/Cross) kpsi (MPa) 14/10 (97/69) IPC TM-650 2.4.4
Tensile Strength (Machine/Cross) kpsi (MPa) 11/8 (76/55) IPC TM-650 2.4.18.3
Compressive Modulus kpsi (MPa)   ASTM D-3410
Poisson’s Ratio   ASTM D-3039
4. Physical Properties  
Water Absorption % 0.05 IPC TM-650 2.6.2.1
Density, ambient 23ºC g/cm3 2.30 ASTM D792 Method A
Thermal Conductivity W/mK 0.72 ASTM D5470
Specific Heat J/gK 0.90 ASTM D5470
Flammability class V0 UL-94
NASA Outgassing, 125ºC, ≤10- 6 torr      
Total Mass Loss % 0.02 NASA SP-R-0022A
Collected Volatiles % 0.01 NASA SP-R-0022A
Water Vapor Recovered % 0.01 NASA SP-R-0022A

 

PCB Material: Woven Fiberglass Reinforced, Ceramic Filled, PTFE based Composite
Designation: TC350
Dielectric constant: 3.5±0.05
Thermal Conductivity 0.72 W/m-K
Dissipation Factor Df .002@10 GHz
Layer count: Double Layer, Multilayer, Hybrid PCB
Copper weight: 0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
PCB thickness: 10mil (0.254mm), 20mil(0.508mm), 30mil (0.762mm), 60mil(1.524mm)
PCB size: ≤400mm X 500mm
Solder mask: Green, Black, Blue, Yellow, Red etc.
Surface finish: Bare copper, HASL, ENIG, OSP, Immersion tin etc..

 

TC350 PCB benefits from reduced junction temperatures and improved reliability, with excellent heat dissipation and management. This leads to enhanced bandwidth utilization and efficiency for amplifiers and antennas, along with superior plated-through hole reliability.

 

Constructed as a 2-layer rigid PCB, it features 35 μm of copper on both layers and a core thickness of 0.254 mm (10 mil) of TC350. The board dimensions measure 97.5 mm x 31.7 mm (± 0.15 mm) with a finished thickness of 0.37 mm. It supports minimum trace and space requirements of 5/5 mils and a minimum hole size of 0.2 mm, with no blind vias. The immersion gold surface finish (ENEPIG) enhances solderability.

 

This PCB is supplied with artwork in the Gerber RS-274-X format and meets the IPC-Class-2 quality standard. It is available for worldwide, making it accessible to engineers globally.

 

Typical applications include power amplifiers, filters, tower-mounted amplifiers (TMA), tower-mounted boosters (TMB), thermally cycled antennas sensitive to dielectric drift, and microwave combiners and power dividers. With its advanced thermal management and excellent electrical performance, the TC350 PCB is a reliable choice for modern electronic designs.

 

TC350 PCB 10mil 2-Layer 1OZ Copper with ENEPIG 0

Contact Details
Bicheng Electronics Technology Co., Ltd

Contact Person: Ms. Ivy Deng

Tel: 86-755-27374946

Fax: 86-755-27374848

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