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30mil RO4534 PCB 2 Layer Immersion Silver RF Circuits

China Bicheng Electronics Technology Co., Ltd certification
China Bicheng Electronics Technology Co., Ltd certification
Kevin, Received and tested the boards - thanks very much. These are perfect, exactly what we needed. rgds Rich

—— Rich Rickett

Ruth, I got the PCB today, and they are just perfect. Please stay a little patience, my next order is coming soon. Kind regards from Hamburg Olaf

—— Olaf Kühnhold

Hi Natalie. It was perfect, I attach some pictures for your reference. And I send you next 2 projects to budget. Thanks a lot again

—— Sebastian Toplisek

Kevin, Thanks, they were perfectly made, and work well. As promised, here are the links for my latest project, using the PCBs you manufactured for me: Regards, Daniel

—— Daniel Ford

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30mil RO4534 PCB 2 Layer Immersion Silver RF Circuits

30mil RO4534 PCB 2 Layer Immersion Silver RF Circuits
30mil RO4534 PCB 2 Layer Immersion Silver RF Circuits 30mil RO4534 PCB 2 Layer Immersion Silver RF Circuits

Large Image :  30mil RO4534 PCB 2 Layer Immersion Silver RF Circuits

Product Details:
Place of Origin: CHINA
Brand Name: Bicheng
Certification: UL, ISO9001, IATF16949
Payment & Shipping Terms:
Minimum Order Quantity: 1PCS
Price: USD9.99-99.99/PCS
Packaging Details: Vacuum bags+Cartons
Delivery Time: 8-9 working days
Payment Terms: T/T
Supply Ability: 5000PCS per month
Detailed Product Description
Material: RO4534 PCB Thickness: 30mil
PCB Size: 73.2mm X 36.44 Mm=1PCS, +/- 0.15mm Layer Count: 2-layer
Copper Weight: 1oz (1.4 Mils) Outer Layers Surface Finish: Immersion Silver
Top Silkscreen: White
High Light:

30mil Immersion Silver PCB

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RO4534 Immersion Silver PCB

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RF pcb 2 layer

We are excited to introduce our newly shipped PCB utilizing RO4534 substrates, meticulously crafted to meet the stringent demands of the antenna market. Developed by Rogers Corporation, RO4534 laminates build upon the success of the RO4000 series, extending its capabilities into mobile infrastructure applications. This ceramic-filled, glass-reinforced hydrocarbon material delivers controlled dielectric constants, low loss performance, and excellent passive intermodulation (PIM) response, making it an ideal choice for microstrip antenna applications.

 

Key Features
- Dielectric Constant: 3.4 at 10 GHz
- Dissipation Factor: 0.0027 at 10 GHz
- PIM Value: Typical -157 dBC
- Thermal Coefficient of Expansion (CTE)**:
- X axis: 11 ppm/°C
- Y axis: 14 ppm/°C
- Z axis: 46 ppm/°C
- Glass Transition Temperature (Tg): >280 °C
- Moisture Absorption: 0.06%
- Lead-Free Process Compatibility: Yes

 

Benefits:
- Low Loss, Low Dk and low PIM response for wide range of application use
- Thermoset resin system compatible with standard PCB fabrication
- Excellent dimensional stability for greater yield on larger panels sizes
- Uniform mechanical properties for maintaining mechanical form during handling
- High thermal conductivity for improved power handling
- CTE similar to that of copper, reducing stress in PCB antenna

 

Property RO4534 Direction Units Condition Test Method
Dielectric Constant, er Process 3.4 ± 0.08 Z - 10 GHz/23℃ 2.5 GHz IPC-TM-650,2.5.5.5
Dissipation Factor 0.0022 Z - 2.5 GHz/23℃ IPC-TM-650, 2.5.5.5
0.0027 10 GHz/23℃
PIM (Typical) -157 - dBc Reflected 43 dBm swept tones Summitek 1900b PIM Analyzer
Dielectric Strength >500 Z V/mil 0.51 mm IPC-TM-650, 2.5.6.2
Dimensional Stability <0.3 X,Y mm/m (mils/inch) after etch IPC-TM-650, 2.4.39A
Coefficient of Thermal Expansion 11 X ppm/℃ -55 to 288℃ IPC-TM-650, 2.4.41
14 Y
46 Z
Thermal Conductivity 0.6 - W/(m.K) 80℃ ASTM C518
Moisture Absorption 0.06 - % D48/50 IPC-TM-650, 2.6.2.1 ASTM D570
Tg >280 - ℃ TMA A IPC-TM-650, 2.4.24.3
Density 1.8 - gm/cm3 - ASTM D792
Copper Peel Strength 6.3 (1.1) - lbs/in (N/mm) 1 oz. EDC post solder float IPC-TM-650, 2.4.8
Flammability NON FR - - - UL 94
Lead-Free Process Compatible Yes - - - -

 

PCB Stackup
This PCB features a robust 2-layer rigid stackup:

 

- Copper Layer 1: 35 μm
- RO4534 Core: 0.762 mm
- Copper Layer 2: 35 μm

 

Construction Details
The PCB dimensions are 73.2 mm x 36.44 mm (± 0.15 mm), with a finished thickness of 0.8 mm. It accommodates a minimum trace/space of 4/4 mils and a minimum hole size of 0.3 mm. The outer layers have a finished copper weight of 1 oz (1.4 mils), and the via plating thickness is 20 μm. The surface finish is immersion silver, featuring a white top silkscreen and a blue bottom silkscreen. No solder masks are applied to either side. Each board undergoes 100% electrical testing before shipment to ensure high quality.

 

PCB Material: Ceramic-filled, Glass-reinforced Hydrocarbon
Designation: RO4534
Dielectric constant: 3.4
Dissipation Factor 0.0027 10GHz
Layer count: Double Sided PCB, Multilayer PCB, Hybrid PCB
Copper weight: 0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
Laminate thickness: 20mil (0.508mm), 30mil (0.762mm), 60mil (1.524mm )
PCB size: ≤400mm X 500mm
Solder mask: Green, Black, Blue, Yellow, Red etc.
Surface finish: Bare copper, HASL, ENIG, Immersion silver, Immersion tin, OSP, Pure gold plated etc..

 

30mil RO4534 PCB 2 Layer Immersion Silver RF Circuits 0

 

Compliance and Availability
- Artwork Format: Gerber RS-274-X
- Quality Standard: IPC-Class-2
- Availability: Worldwide

 

Typical Applications
- Cellular infrastructure base station antennas
- WiMAX antenna networks

 

Leverage the advanced features of the RO4534 PCB to enhance both performance and cost-effectiveness in your antenna designs, ensuring reliable functionality in challenging environments.

Contact Details
Bicheng Electronics Technology Co., Ltd

Contact Person: Ms. Ivy Deng

Tel: 86-755-27374946

Fax: 86-755-27374848

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