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Product Details:
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Material: | RO4534 | PCB Thickness: | 30mil |
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PCB Size: | 73.2mm X 36.44 Mm=1PCS, +/- 0.15mm | Layer Count: | 2-layer |
Copper Weight: | 1oz (1.4 Mils) Outer Layers | Surface Finish: | Immersion Silver |
Top Silkscreen: | White | ||
High Light: | 30mil Immersion Silver PCB,RO4534 Immersion Silver PCB,RF pcb 2 layer |
We are excited to introduce our newly shipped PCB utilizing RO4534 substrates, meticulously crafted to meet the stringent demands of the antenna market. Developed by Rogers Corporation, RO4534 laminates build upon the success of the RO4000 series, extending its capabilities into mobile infrastructure applications. This ceramic-filled, glass-reinforced hydrocarbon material delivers controlled dielectric constants, low loss performance, and excellent passive intermodulation (PIM) response, making it an ideal choice for microstrip antenna applications.
Key Features
- Dielectric Constant: 3.4 at 10 GHz
- Dissipation Factor: 0.0027 at 10 GHz
- PIM Value: Typical -157 dBC
- Thermal Coefficient of Expansion (CTE)**:
- X axis: 11 ppm/°C
- Y axis: 14 ppm/°C
- Z axis: 46 ppm/°C
- Glass Transition Temperature (Tg): >280 °C
- Moisture Absorption: 0.06%
- Lead-Free Process Compatibility: Yes
Benefits:
- Low Loss, Low Dk and low PIM response for wide range of application use
- Thermoset resin system compatible with standard PCB fabrication
- Excellent dimensional stability for greater yield on larger panels sizes
- Uniform mechanical properties for maintaining mechanical form during handling
- High thermal conductivity for improved power handling
- CTE similar to that of copper, reducing stress in PCB antenna
Property | RO4534 | Direction | Units | Condition | Test Method |
Dielectric Constant, er Process | 3.4 ± 0.08 | Z | - | 10 GHz/23℃ 2.5 GHz | IPC-TM-650,2.5.5.5 |
Dissipation Factor | 0.0022 | Z | - | 2.5 GHz/23℃ | IPC-TM-650, 2.5.5.5 |
0.0027 | 10 GHz/23℃ | ||||
PIM (Typical) | -157 | - | dBc | Reflected 43 dBm swept tones | Summitek 1900b PIM Analyzer |
Dielectric Strength | >500 | Z | V/mil | 0.51 mm | IPC-TM-650, 2.5.6.2 |
Dimensional Stability | <0.3 | X,Y | mm/m (mils/inch) | after etch | IPC-TM-650, 2.4.39A |
Coefficient of Thermal Expansion | 11 | X | ppm/℃ | -55 to 288℃ | IPC-TM-650, 2.4.41 |
14 | Y | ||||
46 | Z | ||||
Thermal Conductivity | 0.6 | - | W/(m.K) | 80℃ | ASTM C518 |
Moisture Absorption | 0.06 | - | % | D48/50 | IPC-TM-650, 2.6.2.1 ASTM D570 |
Tg | >280 | - | ℃ TMA | A | IPC-TM-650, 2.4.24.3 |
Density | 1.8 | - | gm/cm3 | - | ASTM D792 |
Copper Peel Strength | 6.3 (1.1) | - | lbs/in (N/mm) | 1 oz. EDC post solder float | IPC-TM-650, 2.4.8 |
Flammability | NON FR | - | - | - | UL 94 |
Lead-Free Process Compatible | Yes | - | - | - | - |
PCB Stackup
This PCB features a robust 2-layer rigid stackup:
- Copper Layer 1: 35 μm
- RO4534 Core: 0.762 mm
- Copper Layer 2: 35 μm
Construction Details
The PCB dimensions are 73.2 mm x 36.44 mm (± 0.15 mm), with a finished thickness of 0.8 mm. It accommodates a minimum trace/space of 4/4 mils and a minimum hole size of 0.3 mm. The outer layers have a finished copper weight of 1 oz (1.4 mils), and the via plating thickness is 20 μm. The surface finish is immersion silver, featuring a white top silkscreen and a blue bottom silkscreen. No solder masks are applied to either side. Each board undergoes 100% electrical testing before shipment to ensure high quality.
PCB Material: | Ceramic-filled, Glass-reinforced Hydrocarbon |
Designation: | RO4534 |
Dielectric constant: | 3.4 |
Dissipation Factor | 0.0027 10GHz |
Layer count: | Double Sided PCB, Multilayer PCB, Hybrid PCB |
Copper weight: | 0.5oz (17 µm), 1oz (35µm), 2oz (70µm) |
Laminate thickness: | 20mil (0.508mm), 30mil (0.762mm), 60mil (1.524mm ) |
PCB size: | ≤400mm X 500mm |
Solder mask: | Green, Black, Blue, Yellow, Red etc. |
Surface finish: | Bare copper, HASL, ENIG, Immersion silver, Immersion tin, OSP, Pure gold plated etc.. |
Compliance and Availability
- Artwork Format: Gerber RS-274-X
- Quality Standard: IPC-Class-2
- Availability: Worldwide
Typical Applications
- Cellular infrastructure base station antennas
- WiMAX antenna networks
Leverage the advanced features of the RO4534 PCB to enhance both performance and cost-effectiveness in your antenna designs, ensuring reliable functionality in challenging environments.
Contact Person: Ms. Ivy Deng
Tel: 86-755-27374946
Fax: 86-755-27374848