logo
Home ProductsRF PCB Board

Rogers RO3006 PCB 25mmil 2 Layer Immersion Gold Circuit Boards

Certification
China Bicheng Electronics Technology Co., Ltd certification
China Bicheng Electronics Technology Co., Ltd certification
Customer Reviews
Kevin, Received and tested the boards - thanks very much. These are perfect, exactly what we needed. rgds Rich

—— Rich Rickett

Ruth, I got the PCB today, and they are just perfect. Please stay a little patience, my next order is coming soon. Kind regards from Hamburg Olaf

—— Olaf Kühnhold

Hi Natalie. It was perfect, I attach some pictures for your reference. And I send you next 2 projects to budget. Thanks a lot again

—— Sebastian Toplisek

Kevin, Thanks, they were perfectly made, and work well. As promised, here are the links for my latest project, using the PCBs you manufactured for me: Regards, Daniel

—— Daniel Ford

I'm Online Chat Now

Rogers RO3006 PCB 25mmil 2 Layer Immersion Gold Circuit Boards

Rogers RO3006 PCB 25mmil 2 Layer Immersion Gold Circuit Boards
Rogers RO3006 PCB 25mmil 2 Layer Immersion Gold Circuit Boards Rogers RO3006 PCB 25mmil 2 Layer Immersion Gold Circuit Boards Rogers RO3006 PCB 25mmil 2 Layer Immersion Gold Circuit Boards

Large Image :  Rogers RO3006 PCB 25mmil 2 Layer Immersion Gold Circuit Boards

Product Details:
Place of Origin: CHINA
Brand Name: Bicheng
Certification: UL, ISO9001, IATF16949
Payment & Shipping Terms:
Minimum Order Quantity: 1PCS
Price: USD9.99-99.99/PCS
Packaging Details: Vacuum bags+Cartons
Delivery Time: 8-9 working days
Payment Terms: T/T
Supply Ability: 5000PCS per month

Rogers RO3006 PCB 25mmil 2 Layer Immersion Gold Circuit Boards

Description
Material: RO3006 PCB Thickness: 25mil
PCB Size: 51.31 Mm X 111.92 Mm Layer Count: 2-layer
Copper Weight: 1OZ Surface Finish: Immersion Gold
Silkscreen: White
Highlight:

Immersion Gold PCB

,

25mmil PCB

,

Rogers RO3006 PCB

Rogers RO3006 PCB 25mmil 2-Layer Immersion Gold Circuit Boards

Introducing our high-performance Rogers RO3006 PCB, designed with advanced ceramic-filled PTFE composite materials that ensure exceptional electrical and mechanical stability. With its consistent dielectric properties, this PCB is engineered to excel in demanding applications across various industries.

 

Key Features
- Material: Rogers RO3006 ceramic-filled PTFE composites
- Dielectric Constant: 6.15 ± 0.15 at 10 GHz, 23°C
- Dissipation Factor: 0.002 at 10 GHz, 23°C
- Thermal Properties: Td > 500°C, Thermal Conductivity of 0.79 W/mK
- Moisture Absorption: 0.02%
- Coefficient of Thermal Expansion: X/Y axes: 17 ppm/°C, Z axis: 24 ppm/°C (-55 to 288 °C)

 

Property RO3006 Direction Units Condition Test Method
Dielectric Constant,εProcess 6.15±0.05 Z   10 GHz/23℃ IPC-TM-650 2.5.5.5 Clamped Stripline
Dielectric Constant,εDesign 6.5 Z   8GHz to 40 GHz Differential Phase Length Method
Dissipation Factor,tanδ 0.002 Z   10 GHz/23℃ IPC-TM-650 2.5.5.5
Thermal Coefficient of ε -262 Z ppm/℃ 10 GHz -50℃to 150℃ IPC-TM-650 2.5.5.5
Dimensional Stability 0.27
0.15
X
Y
mm/m COND A IPC-TM-650 2.2.4
Volume Resistivity 105   MΩ.cm COND A IPC 2.5.17.1
Surface Resistivity 105   COND A IPC 2.5.17.1
Tensile Modulus 1498
1293
X
Y
MPa 23℃ ASTM D 638
Moisture Absorption 0.02   % D48/50 IPC-TM-650 2.6.2.1
Specific Heat 0.86   j/g/k   Calculated
Thermal Conductivity 0.79   W/M/K 50℃ ASTM D 5470
Coefficient of Thermal Expansion
(-55 to 288℃)
17
17
24
X
Y
Z
ppm/℃ 23℃/50% RH IPC-TM-650 2.4.4.1
Td 500   ℃ TGA   ASTM D 3850
Density 2.6   gm/cm3 23℃ ASTM D 792
Copper Peel Stength 7.1   Ib/in. 1oz,EDC After Solder Float IPC-TM 2.4.8
Flammability V-0       UL 94
Lead-free Process Compatible Yes        

 

Benefits
- Uniform Mechanical Properties: Ideal for multi-layer board designs, especially where a range of dielectric constants is required.

 

- Low In-Plane Expansion Coefficient: Matches copper expansion, ensuring reliable surface-mounted assemblies, making it perfect for temperature-sensitive applications.
 

- Cost-Effective Manufacturing: Our volume manufacturing process allows for economical laminate pricing without compromising quality.

 

PCB Specifications

- Construction:
 

- Copper Layer 1: 35 μm
- Rogers RO3006 Substrate: 25 mil (0.635 mm)
- Copper Layer 2: 35 μm

 

The Rogers RO3006 PCB measures 51.31 mm x 111.92 mm and consists of two pieces, making it versatile for various applications. Manufacturing specifications include a minimum trace/space of 5/4 mils and a minimum hole size of 0.4 mm. The finished board thickness is 0.76 mm, with a finished copper weight of 1 oz (1.4 mils) on the outer layers. The via plating thickness is 20 μm, and the surface finish is immersion gold for enhanced durability.

 

The top silkscreen is white, while the bottom silkscreen is not present. The top solder mask is green, improving trace visibility. To ensure reliability, each PCB undergoes 100% electrical testing before shipment.

 

PCB Material: Ceramic-filled PTFE Composites
Designation: RO3006
Dielectric constant: 6.15
Dissipation Factor 0.002 10GHz
Layer count: Double Sided PCB, Multilayer PCB, Hybrid PCB
Copper weight: 0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
Laminate thickness: 5mil(0.127mm), 10mil(0.254mm), 20mil(0.508mm), 30mil (0.762mm), 60mil (1.524mm )
PCB size: ≤400mm X 500mm
Solder mask: Green, Black, Blue, Yellow, Red etc.
Surface finish: Bare copper, HASL, ENIG, Immersion silver, Immersion tin, OSP, Pure gold plated etc..

 

Rogers RO3006 PCB 25mmil 2 Layer Immersion Gold Circuit Boards 0

 

Artwork and Standards
 

- Artwork Provided: Gerber RS-274-X
- Accepted Standard: IPC-Class-2
- Availability: Worldwide

 

Typical Applications
Our Rogers RO3006 PCB is ideally suited for:

 

- Automotive radar applications
- Global positioning satellite antennas
- Cellular telecommunications systems (power amplifiers and antennas)
- Patch antennas for wireless communications
- Direct broadcast satellites
- Datalink on cable systems
- Remote meter readers
- Power backplanes

 

Elevate your projects with the reliability and performance of the Rogers RO3006 PCB—engineered for excellence in demanding application.

Contact Details
Bicheng Electronics Technology Co., Ltd

Contact Person: Ms. Ivy Deng

Tel: 86-755-27374946

Fax: 86-755-27374848

Send your inquiry directly to us (0 / 3000)