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Rogers RO3006 PCB 25mmil 2 Layer Immersion Gold Circuit Boards

Rogers RO3006 PCB 25mmil 2 Layer Immersion Gold Circuit Boards

MOQ: 1PCS
Price: USD9.99-99.99/PCS
Standard Packaging: Vacuum bags+Cartons
Delivery Period: 8-9 working days
Payment Method: T/T
Supply Capacity: 5000PCS per month
Detail Information
Place of Origin
CHINA
Brand Name
Bicheng
Certification
UL, ISO9001, IATF16949
Material:
RO3006
PCB Thickness:
25mil
PCB Size:
51.31 Mm X 111.92 Mm
Layer Count:
2-layer
Copper Weight:
1OZ
Surface Finish:
Immersion Gold
Silkscreen:
White
Highlight:

Immersion Gold PCB

,

25mmil PCB

,

Rogers RO3006 PCB

Product Description

Rogers RO3006 PCB 25mmil 2-Layer Immersion Gold Circuit Boards

Introducing our high-performance Rogers RO3006 PCB, designed with advanced ceramic-filled PTFE composite materials that ensure exceptional electrical and mechanical stability. With its consistent dielectric properties, this PCB is engineered to excel in demanding applications across various industries.

 

Key Features
- Material: Rogers RO3006 ceramic-filled PTFE composites
- Dielectric Constant: 6.15 ± 0.15 at 10 GHz, 23°C
- Dissipation Factor: 0.002 at 10 GHz, 23°C
- Thermal Properties: Td > 500°C, Thermal Conductivity of 0.79 W/mK
- Moisture Absorption: 0.02%
- Coefficient of Thermal Expansion: X/Y axes: 17 ppm/°C, Z axis: 24 ppm/°C (-55 to 288 °C)

 

Property RO3006 Direction Units Condition Test Method
Dielectric Constant,εProcess 6.15±0.05 Z   10 GHz/23℃ IPC-TM-650 2.5.5.5 Clamped Stripline
Dielectric Constant,εDesign 6.5 Z   8GHz to 40 GHz Differential Phase Length Method
Dissipation Factor,tanδ 0.002 Z   10 GHz/23℃ IPC-TM-650 2.5.5.5
Thermal Coefficient of ε -262 Z ppm/℃ 10 GHz -50℃to 150℃ IPC-TM-650 2.5.5.5
Dimensional Stability 0.27
0.15
X
Y
mm/m COND A IPC-TM-650 2.2.4
Volume Resistivity 105   MΩ.cm COND A IPC 2.5.17.1
Surface Resistivity 105   COND A IPC 2.5.17.1
Tensile Modulus 1498
1293
X
Y
MPa 23℃ ASTM D 638
Moisture Absorption 0.02   % D48/50 IPC-TM-650 2.6.2.1
Specific Heat 0.86   j/g/k   Calculated
Thermal Conductivity 0.79   W/M/K 50℃ ASTM D 5470
Coefficient of Thermal Expansion
(-55 to 288℃)
17
17
24
X
Y
Z
ppm/℃ 23℃/50% RH IPC-TM-650 2.4.4.1
Td 500   ℃ TGA   ASTM D 3850
Density 2.6   gm/cm3 23℃ ASTM D 792
Copper Peel Stength 7.1   Ib/in. 1oz,EDC After Solder Float IPC-TM 2.4.8
Flammability V-0       UL 94
Lead-free Process Compatible Yes        

 

Benefits
- Uniform Mechanical Properties: Ideal for multi-layer board designs, especially where a range of dielectric constants is required.

 

- Low In-Plane Expansion Coefficient: Matches copper expansion, ensuring reliable surface-mounted assemblies, making it perfect for temperature-sensitive applications.
 

- Cost-Effective Manufacturing: Our volume manufacturing process allows for economical laminate pricing without compromising quality.

 

PCB Specifications

- Construction:
 

- Copper Layer 1: 35 μm
- Rogers RO3006 Substrate: 25 mil (0.635 mm)
- Copper Layer 2: 35 μm

 

The Rogers RO3006 PCB measures 51.31 mm x 111.92 mm and consists of two pieces, making it versatile for various applications. Manufacturing specifications include a minimum trace/space of 5/4 mils and a minimum hole size of 0.4 mm. The finished board thickness is 0.76 mm, with a finished copper weight of 1 oz (1.4 mils) on the outer layers. The via plating thickness is 20 μm, and the surface finish is immersion gold for enhanced durability.

 

The top silkscreen is white, while the bottom silkscreen is not present. The top solder mask is green, improving trace visibility. To ensure reliability, each PCB undergoes 100% electrical testing before shipment.

 

PCB Material: Ceramic-filled PTFE Composites
Designation: RO3006
Dielectric constant: 6.15
Dissipation Factor 0.002 10GHz
Layer count: Double Sided PCB, Multilayer PCB, Hybrid PCB
Copper weight: 0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
Laminate thickness: 5mil(0.127mm), 10mil(0.254mm), 20mil(0.508mm), 30mil (0.762mm), 60mil (1.524mm )
PCB size: ≤400mm X 500mm
Solder mask: Green, Black, Blue, Yellow, Red etc.
Surface finish: Bare copper, HASL, ENIG, Immersion silver, Immersion tin, OSP, Pure gold plated etc..

 

Rogers RO3006 PCB 25mmil 2 Layer Immersion Gold Circuit Boards 0

 

Artwork and Standards
 

- Artwork Provided: Gerber RS-274-X
- Accepted Standard: IPC-Class-2
- Availability: Worldwide

 

Typical Applications
Our Rogers RO3006 PCB is ideally suited for:

 

- Automotive radar applications
- Global positioning satellite antennas
- Cellular telecommunications systems (power amplifiers and antennas)
- Patch antennas for wireless communications
- Direct broadcast satellites
- Datalink on cable systems
- Remote meter readers
- Power backplanes

 

Elevate your projects with the reliability and performance of the Rogers RO3006 PCB—engineered for excellence in demanding application.

products
PRODUCTS DETAILS
Rogers RO3006 PCB 25mmil 2 Layer Immersion Gold Circuit Boards
MOQ: 1PCS
Price: USD9.99-99.99/PCS
Standard Packaging: Vacuum bags+Cartons
Delivery Period: 8-9 working days
Payment Method: T/T
Supply Capacity: 5000PCS per month
Detail Information
Place of Origin
CHINA
Brand Name
Bicheng
Certification
UL, ISO9001, IATF16949
Material:
RO3006
PCB Thickness:
25mil
PCB Size:
51.31 Mm X 111.92 Mm
Layer Count:
2-layer
Copper Weight:
1OZ
Surface Finish:
Immersion Gold
Silkscreen:
White
Minimum Order Quantity:
1PCS
Price:
USD9.99-99.99/PCS
Packaging Details:
Vacuum bags+Cartons
Delivery Time:
8-9 working days
Payment Terms:
T/T
Supply Ability:
5000PCS per month
Highlight

Immersion Gold PCB

,

25mmil PCB

,

Rogers RO3006 PCB

Product Description

Rogers RO3006 PCB 25mmil 2-Layer Immersion Gold Circuit Boards

Introducing our high-performance Rogers RO3006 PCB, designed with advanced ceramic-filled PTFE composite materials that ensure exceptional electrical and mechanical stability. With its consistent dielectric properties, this PCB is engineered to excel in demanding applications across various industries.

 

Key Features
- Material: Rogers RO3006 ceramic-filled PTFE composites
- Dielectric Constant: 6.15 ± 0.15 at 10 GHz, 23°C
- Dissipation Factor: 0.002 at 10 GHz, 23°C
- Thermal Properties: Td > 500°C, Thermal Conductivity of 0.79 W/mK
- Moisture Absorption: 0.02%
- Coefficient of Thermal Expansion: X/Y axes: 17 ppm/°C, Z axis: 24 ppm/°C (-55 to 288 °C)

 

Property RO3006 Direction Units Condition Test Method
Dielectric Constant,εProcess 6.15±0.05 Z   10 GHz/23℃ IPC-TM-650 2.5.5.5 Clamped Stripline
Dielectric Constant,εDesign 6.5 Z   8GHz to 40 GHz Differential Phase Length Method
Dissipation Factor,tanδ 0.002 Z   10 GHz/23℃ IPC-TM-650 2.5.5.5
Thermal Coefficient of ε -262 Z ppm/℃ 10 GHz -50℃to 150℃ IPC-TM-650 2.5.5.5
Dimensional Stability 0.27
0.15
X
Y
mm/m COND A IPC-TM-650 2.2.4
Volume Resistivity 105   MΩ.cm COND A IPC 2.5.17.1
Surface Resistivity 105   COND A IPC 2.5.17.1
Tensile Modulus 1498
1293
X
Y
MPa 23℃ ASTM D 638
Moisture Absorption 0.02   % D48/50 IPC-TM-650 2.6.2.1
Specific Heat 0.86   j/g/k   Calculated
Thermal Conductivity 0.79   W/M/K 50℃ ASTM D 5470
Coefficient of Thermal Expansion
(-55 to 288℃)
17
17
24
X
Y
Z
ppm/℃ 23℃/50% RH IPC-TM-650 2.4.4.1
Td 500   ℃ TGA   ASTM D 3850
Density 2.6   gm/cm3 23℃ ASTM D 792
Copper Peel Stength 7.1   Ib/in. 1oz,EDC After Solder Float IPC-TM 2.4.8
Flammability V-0       UL 94
Lead-free Process Compatible Yes        

 

Benefits
- Uniform Mechanical Properties: Ideal for multi-layer board designs, especially where a range of dielectric constants is required.

 

- Low In-Plane Expansion Coefficient: Matches copper expansion, ensuring reliable surface-mounted assemblies, making it perfect for temperature-sensitive applications.
 

- Cost-Effective Manufacturing: Our volume manufacturing process allows for economical laminate pricing without compromising quality.

 

PCB Specifications

- Construction:
 

- Copper Layer 1: 35 μm
- Rogers RO3006 Substrate: 25 mil (0.635 mm)
- Copper Layer 2: 35 μm

 

The Rogers RO3006 PCB measures 51.31 mm x 111.92 mm and consists of two pieces, making it versatile for various applications. Manufacturing specifications include a minimum trace/space of 5/4 mils and a minimum hole size of 0.4 mm. The finished board thickness is 0.76 mm, with a finished copper weight of 1 oz (1.4 mils) on the outer layers. The via plating thickness is 20 μm, and the surface finish is immersion gold for enhanced durability.

 

The top silkscreen is white, while the bottom silkscreen is not present. The top solder mask is green, improving trace visibility. To ensure reliability, each PCB undergoes 100% electrical testing before shipment.

 

PCB Material: Ceramic-filled PTFE Composites
Designation: RO3006
Dielectric constant: 6.15
Dissipation Factor 0.002 10GHz
Layer count: Double Sided PCB, Multilayer PCB, Hybrid PCB
Copper weight: 0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
Laminate thickness: 5mil(0.127mm), 10mil(0.254mm), 20mil(0.508mm), 30mil (0.762mm), 60mil (1.524mm )
PCB size: ≤400mm X 500mm
Solder mask: Green, Black, Blue, Yellow, Red etc.
Surface finish: Bare copper, HASL, ENIG, Immersion silver, Immersion tin, OSP, Pure gold plated etc..

 

Rogers RO3006 PCB 25mmil 2 Layer Immersion Gold Circuit Boards 0

 

Artwork and Standards
 

- Artwork Provided: Gerber RS-274-X
- Accepted Standard: IPC-Class-2
- Availability: Worldwide

 

Typical Applications
Our Rogers RO3006 PCB is ideally suited for:

 

- Automotive radar applications
- Global positioning satellite antennas
- Cellular telecommunications systems (power amplifiers and antennas)
- Patch antennas for wireless communications
- Direct broadcast satellites
- Datalink on cable systems
- Remote meter readers
- Power backplanes

 

Elevate your projects with the reliability and performance of the Rogers RO3006 PCB—engineered for excellence in demanding application.

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