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Product Details:
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| Material: | Rogers RO4350B Core, RO4450F Bondply | PCB Size: | 42.35mm X 42.35 Mm=1PCS, +/- 0.15mm |
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| Copper Weight: | 1oz (1.4 Mils) Outer Layers, 0.5oz (0.7mils) Inner Layer | Surface Finish: | ENIG |
| Layer Count: | 3-Layer | PCB Thickness: | 1.7 Mm |
| High Light: | Rogers RO4350B rf pcb boards,3 Layer rf pcb boards,ENIG rf pcb boards |
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Introduction
The Rogers RO4350B High Frequency PCB is engineered for applications requiring exceptional electrical performance and manufacturability. The RO4350B materials feature proprietary woven glass reinforced hydrocarbon/ceramics that deliver electrical performance comparable to PTFE/woven glass, combined with the ease of processing found in epoxy/glass. These laminates maintain tight control over dielectric constant (Dk) while ensuring low loss, all at a fraction of the cost of conventional microwave materials. Unlike PTFE-based options, RO4350B does not require special through-hole treatments or handling procedures, making it user-friendly. Additionally, it is UL 94 V-0 rated, suitable for active devices and high-power RF designs.
The RO4450F bondply complements the RO4350B core, consisting of several grades compatible with RO4000 laminates for multi-layer constructions. Its high postcure Tg allows it to handle multiple lamination cycles, making it ideal for applications requiring sequential laminations. The bondply is also compatible with FR-4 requirements, enabling the combination of RO4450F and low-flow FR-4 bondplies in non-homogeneous multi-layer constructions.
Features
RO4350B:
Dielectric Constant (Dk): 3.48 ± 0.05 at 10 GHz/23°C
Dissipation Factor: 0.0037 at 10 GHz/23°C
Thermal Conductivity: 0.69 W/m/°K
CTE: X: 10 ppm/°C, Y: 12 ppm/°C, Z: 32 ppm/°C
Glass Transition Temperature (Tg): >280 °C
Water Absorption: 0.06%
| RO4350B Typical Value | |||||
| Property | RO4350B | Direction | Units | Condition | Test Method |
| Dielectric Constant,εProcess | 3.48±0.05 | Z | 10 GHz/23℃ | IPC-TM-650 2.5.5.5 Clamped Stripline | |
| Dielectric Constant,εDesign | 3.66 | Z | 8 to 40 GHz | Differential Phase Length Method | |
| Dissipation Factortan,δ | 0.0037 0.0031 |
Z | 10 GHz/23℃ 2.5 GHz/23℃ |
IPC-TM-650 2.5.5.5 | |
| Thermal Coefficient of ε | +50 | Z | ppm/℃ | -50℃to 150℃ | IPC-TM-650 2.5.5.5 |
| Volume Resistivity | 1.2 x 1010 | MΩ.cm | COND A | IPC-TM-650 2.5.17.1 | |
| Surface Resistivity | 5.7 x109 | MΩ | COND A | IPC-TM-650 2.5.17.1 | |
| Electrical Strength | 31.2(780) | Z | Kv/mm(v/mil) | 0.51mm(0.020") | IPC-TM-650 2.5.6.2 |
| Tensile Modulus | 16,767(2,432) 14,153(2,053) |
X Y |
MPa(ksi) | RT | ASTM D 638 |
| Tensile Strength | 203(29.5) 130(18.9) |
X Y |
MPa(ksi) | RT | ASTM D 638 |
| Flexural Strength | 255 (37) |
MPa (kpsi) |
IPC-TM-650 2.4.4 | ||
| Dimensional Stability | <0.5 | X,Y | mm/m (mil/inch) |
after etch+E2/150℃ | IPC-TM-650 2.4.39A |
| Coefficient of Thermal Expansion | 10 12 32 |
X Y Z |
ppm/℃ | -55℃to288℃ | IPC-TM-650 2.4.41 |
| Tg | >280 | ℃ TMA | A | IPC-TM-650 2.4.24.3 | |
| Td | 390 | ℃ TGA | ASTM D 3850 | ||
| Thermal Conductivity | 0.69 | W/M/oK | 80℃ | ASTM C518 | |
| Moisture Absorption | 0.06 | % | 48hrs immersion 0.060" sample Temperature 50℃ |
ASTM D 570 | |
| Density | 1.86 | gm/cm3 | 23℃ | ASTM D 792 | |
| Copper Peel Stength | 0.88 (5.0) |
N/mm (pli) |
after solder float 1 oz. EDC Foil |
IPC-TM-650 2.4.8 | |
| Flammability | (3)V-0 | UL 94 | |||
| Lead-free Process Compatible | Yes | ||||
RO4450F:
Dielectric Constant (Dk): 3.52 ± 0.05 at 10 GHz/23°C
Dissipation Factor: 0.004 at 10 GHz/23°C
Thermal Conductivity: 0.65 W/m/°K
CTE: X: 19 ppm/°C, Y: 17 ppm/°C, Z: 50 ppm/°C
Glass Transition Temperature (Tg): >280 °C
Water Absorption: 0.04%
Technical Specifications
PCB Stackup: 2-layer rigid PCB
Copper Layer 1: 35 μm
Rogers RO4350B Core: 0.762 mm (30 mil)
Copper Layer 2: 18 μm
Prepreg Bond-ply (RO4450F): 0.101 mm (4 mil)
Rogers RO4350B Core: 0.762 mm (30 mil)
Copper Layer 3: 35 μm
The board dimensions are 42.35 mm x 42.35 mm (± 0.15 mm), with a finished board thickness of 1.7 mm. It supports a minimum trace/space of 5/5 mils and a minimum hole size of 0.3 mm. The finished copper weight is 1 oz (1.4 mils) for the outer layers and 0.5 oz (0.7 mils) for the inner layer, with a via plating thickness of 20 μm. The surface finish is ENIG, with a yellow silkscreen on the top and a green solder mask.
Applications
The Rogers RO4350B PCB is suitable for a variety of applications, including:
Cellular base station antennas and power amplifiers
RF identification tags
Automotive radar and sensors
LNBs for direct broadcast satellites
Availability
The Rogers RO4350B PCB is available worldwide, designed to meet the demands of modern high-frequency applications. Its advanced material properties and user-friendly processing methods make it an essential choice for engineers and designers.
Contact Person: Ms. Ivy Deng
Tel: 86-755-27374946
Fax: 86-755-27374848
