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Product Details:
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| Material: | Rogers 4003C Core, RO4450F Bondply | PCB Size: | 112mm X 121 Mm=2 Types=2PCS, +/- 0.15mm |
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| Copper Weight: | 1oz (1.4 Mils) Outer Layers, 1oz (1.4 Mils) Inner Layers | Surface Finish: | ENIG |
| Layer Count: | 4-Layer | PCB Thickness: | 0.7 Mm |
| High Light: | Rogers RO4003C high frequency circuit board,0.7mm high frequency circuit board,4 Layer high frequency circuit board |
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The Rogers RO4003C High Frequency PCB is engineered for applications that demand exceptional electrical performance and ease of manufacturability. This advanced material features woven glass reinforced hydrocarbon/ceramics, providing the electrical characteristics of PTFE/woven glass with the processing advantages of epoxy/glass composites. Available in multiple configurations, including 1080 and 1674 glass fabric styles, all variants maintain rigorous laminate electrical performance specifications.
RO4450F Bondply
The RO4450F bondply is comprised of several grades based on the RO4000 series core materials, and are compatible in multi-layer constructions with RO4000 laminates. A high postcure Tg makes RO4450F bondply an excellent choice for multi-layers requiring sequential laminations as fully cured RO4450F bondplys are capable of handling multiple lamination cycles. In addition, FR-4 compatible bond requirements permit RO4450F bondply and low flow FR-4 bondply to be combined into non-homogeneous multi-layer constructions using a single bond cycle.
Key Features
Dielectric Constant (Dk): 3.38 ± 0.05 at 10 GHz
Dissipation Factor: 0.0027 at 10 GHz
Thermal Conductivity: 0.71 W/m/°K
Thermal Coefficient of Dielectric Constant: +40 ppm/°C (operating range: -50°C to 150°C)
CTE Matched to Copper: X-axis: 11 ppm/°C, Y-axis: 14 ppm/°C
Low Z-axis CTE: 46 ppm/°C
Glass Transition Temperature (Tg): >280 °C
Moisture Absorption: 0.06%
| Property | RO4003C | Direction | Units | Condition | Test Method |
| Dielectric Constant,εProcess | 3.38±0.05 | Z | 10 GHz/23℃ | IPC-TM-650 2.5.5.5 Clamped Stripline | |
| Dielectric Constant,εDesign | 3.55 | Z | 8 to 40 GHz | Differential Phase Length Method | |
| Dissipation Factortan,δ | 0.0027 0.0021 |
Z | 10 GHz/23℃ 2.5 GHz/23℃ |
IPC-TM-650 2.5.5.5 | |
| Thermal Coefficient of ε | +40 | Z | ppm/℃ | -50℃to 150℃ | IPC-TM-650 2.5.5.5 |
| Volume Resistivity | 1.7 x 1010 | MΩ.cm | COND A | IPC-TM-650 2.5.17.1 | |
| Surface Resistivity | 4.2 x 109 | MΩ | COND A | IPC-TM-650 2.5.17.1 | |
| Electrical Strength | 31.2(780) | Z | Kv/mm(v/mil) | 0.51mm(0.020") | IPC-TM-650 2.5.6.2 |
| Tensile Modulus | 19,650(2,850) 19,450(2,821) |
X Y |
MPa(ksi) | RT | ASTM D 638 |
| Tensile Strength | 139(20.2) 100(14.5) |
X Y |
MPa(ksi) | RT | ASTM D 638 |
| Flexural Strength | 276 (40) |
MPa (kpsi) |
IPC-TM-650 2.4.4 | ||
| Dimensional Stability | <0.3 | X,Y | mm/m (mil/inch) |
after etch+E2/150℃ | IPC-TM-650 2.4.39A |
| Coefficient of Thermal Expansion | 11 14 46 |
X Y Z |
ppm/℃ | -55℃to288℃ | IPC-TM-650 2.4.41 |
| Tg | >280 | ℃ TMA | A | IPC-TM-650 2.4.24.3 | |
| Td | 425 | ℃ TGA | ASTM D 3850 | ||
| Thermal Conductivity | 0.71 | W/M/oK | 80℃ | ASTM C518 | |
| Moisture Absorption | 0.06 | % | 48hrs immersion 0.060" sample Temperature 50℃ |
ASTM D 570 | |
| Density | 1.79 | gm/cm3 | 23℃ | ASTM D 792 | |
| Copper Peel Stength | 1.05 (6.0) |
N/mm (pli) |
after solder float 1 oz. EDC Foil |
IPC-TM-650 2.4.8 | |
| Flammability | N/A | UL 94 | |||
| Lead-free Process Compatible | Yes |
Benefits
The RO4003C is ideal for multi-layer board (MLB) constructions, providing excellent performance in complex PCB designs. It processes similarly to FR-4, allowing for lower fabrication costs compared to traditional microwave laminates. This combination of features makes it particularly suitable for high-volume applications that demand reliability and efficiency at a competitive price.
Technical Specifications
PCB Stackup: 4-layer rigid PCB
Copper_layer_1 - 35 μm
Rogers 4003C Core - 0.203 mm (8mil)
Copper_layer_2 - 35 μm
RO4450F Bondply - 0.101 mm (4mil) *
Copper_layer_3 - 35 μm
Rogers 4003C Core - 0.203 mm (8mil)
Copper_layer_4 - 35 μm
The board dimensions are 112 mm x 121 mm (± 0.15 mm), with a finished board thickness of 0.7 mm. It supports a minimum trace/space of 5/6 mils and a minimum hole size of 0.3 mm. The finished copper weight is 1 oz (1.4 mils) for both the outer and inner layers, with a via plating thickness of 20 μm. The surface finish is ENIG, with a white silkscreen on the top and a green solder mask.
This PCB supports a variety of applications, including cellular base station antennas and power amplifiers, RF identification tags, automotive radar and sensors, and LNBs for direct broadcast satellites. The Rogers RO4003C PCB is available worldwide, meeting the needs of modern high-frequency applications with its advanced material properties and cost-effective production methods.
Contact Person: Ms. Ivy Deng
Tel: 86-755-27374946
Fax: 86-755-27374848
