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Roger RO4003C 12mil Two Layer Pcb Black Silkscreen ENEPIG Finished

Roger RO4003C 12mil Two Layer Pcb Black Silkscreen ENEPIG Finished

MOQ: 1PCS
Price: USD9.99-99.99/PCS
Standard Packaging: Vacuum bags+Cartons
Delivery Period: 8-9 working days
Payment Method: T/T
Supply Capacity: 5000PCS per month
Detail Information
Place of Origin
CHINA
Brand Name
Bicheng
Certification
UL, ISO9001, IATF16949
Material:
Rogers 4003C Core
PCB Size:
66.95mm X 38.29 Mm=1PCS, +/- 0.15mm
Copper Weight:
1oz (1.4 Mils) Outer Layers
Surface Finish:
ENEPIG
Layer Count:
2-layer
PCB Thickness:
0.4 Mm
Highlight:

Roger RO4003C two layer pcb

,

12mil two layer pcb

,

Black Silkscreen two layer pcb

Product Description

The Rogers RO4003C High Frequency PCB is a premier choice for applications demanding superior electrical performance and manufacturability. This innovative material is a proprietary woven glass reinforced hydrocarbon/ceramic laminate that combines the beneficial properties of PTFE/woven glass with the ease of processing associated with epoxy/glass materials. The RO4003C stands out by offering excellent dielectric control and low loss at a competitive cost, making it ideal for high-volume, performance-sensitive applications.

 

Key Features
Dielectric Constant (Dk): 3.38 ± 0.05 at 10 GHz
Dissipation Factor: 0.0027 at 10 GHz
Thermal Conductivity: 0.71 W/m/°K
Thermal Coefficient of Dielectric Constant: +40 ppm/°C (operating range: -50°C to 150°C)
Coefficient of Thermal Expansion (CTE): Matched to copper (X: 11 ppm/°C, Y: 14 ppm/°C)
Low Z-axis CTE: 46 ppm/°C
Glass Transition Temperature (Tg): >280 °C
Low Moisture Absorption: 0.06%

 

Benefits
Ideal for Multi-Layer Board (MLB) Constructions: The RO4003C is designed specifically for complex PCB designs, providing excellent performance in multi-layer configurations.

 

Cost-Effective Fabrication: Processes similarly to FR-4, allowing for lower fabrication costs compared to traditional microwave laminates.
 

High Volume Applications: Engineered for performance-sensitive applications, making it the perfect choice for high-demand environments.
 

Competitive Pricing: Offers exceptional value without compromising on quality or performance.

 

Property RO4003C Direction Units Condition Test Method
Dielectric Constant,εProcess 3.38±0.05 Z   10 GHz/23℃ IPC-TM-650 2.5.5.5 Clamped Stripline
Dielectric Constant,εDesign 3.55 Z   8 to 40 GHz Differential Phase Length Method
Dissipation Factortan,δ 0.0027
0.0021
Z   10 GHz/23℃
2.5 GHz/23℃
IPC-TM-650 2.5.5.5
Thermal Coefficient of ε +40 Z ppm/℃ -50℃to 150℃ IPC-TM-650 2.5.5.5
Volume Resistivity 1.7 x 1010   MΩ.cm COND A IPC-TM-650 2.5.17.1
Surface Resistivity 4.2 x 109   COND A IPC-TM-650 2.5.17.1
Electrical Strength 31.2(780) Z Kv/mm(v/mil) 0.51mm(0.020") IPC-TM-650 2.5.6.2
Tensile Modulus 19,650(2,850)
19,450(2,821)
X
Y
MPa(ksi) RT ASTM D 638
Tensile Strength 139(20.2)
100(14.5)
X
Y
MPa(ksi) RT ASTM D 638
Flexural Strength 276
(40)
  MPa
(kpsi)
  IPC-TM-650 2.4.4
Dimensional Stability <0.3 X,Y mm/m
(mil/inch)
after etch+E2/150℃ IPC-TM-650 2.4.39A
Coefficient of Thermal Expansion 11
14
46
X
Y
Z
ppm/℃ -55℃to288℃ IPC-TM-650 2.4.41
Tg >280   ℃ TMA A IPC-TM-650 2.4.24.3
Td 425   ℃ TGA   ASTM D 3850
Thermal Conductivity 0.71   W/M/oK 80℃ ASTM C518
Moisture Absorption 0.06   % 48hrs immersion 0.060"
sample Temperature 50℃
ASTM D 570
Density 1.79   gm/cm3 23℃ ASTM D 792
Copper Peel Stength 1.05
(6.0)
  N/mm
(pli)
after solder float 1 oz.
EDC Foil
IPC-TM-650 2.4.8
Flammability N/A       UL 94
Lead-free Process Compatible Yes        

 

In terms of technical specifications, the RO4003C features a 2-layer rigid PCB stackup, with copper layer thicknesses of 35 μm on both sides and a core thickness of 0.305 mm (12 mil). The board dimensions are 66.95 mm x 38.29 mm (± 0.15 mm), with a finished board thickness of 0.4 mm. It supports a minimum trace/space of 4/4 mils and a minimum hole size of 0.4 mm. The finished copper weight is 1 oz (1.4 mils) for the outer layers, and the surface finish is ENEPIG.

 

Typical Applications
The Rogers RO4003C PCB is versatile and suitable for a wide range of applications, including:

 

Cellular base station antennas and power amplifiers
RF identification tags
Automotive radar and sensors
LNBs for direct broadcast satellites

 

Availability
The Rogers RO4003C PCB is available worldwide, designed to meet the needs of modern high-frequency applications. With its advanced material properties and cost-effective manufacturing processes, it represents a significant advancement in PCB technology.

 

Roger RO4003C 12mil Two Layer Pcb Black Silkscreen ENEPIG Finished 0

products
PRODUCTS DETAILS
Roger RO4003C 12mil Two Layer Pcb Black Silkscreen ENEPIG Finished
MOQ: 1PCS
Price: USD9.99-99.99/PCS
Standard Packaging: Vacuum bags+Cartons
Delivery Period: 8-9 working days
Payment Method: T/T
Supply Capacity: 5000PCS per month
Detail Information
Place of Origin
CHINA
Brand Name
Bicheng
Certification
UL, ISO9001, IATF16949
Material:
Rogers 4003C Core
PCB Size:
66.95mm X 38.29 Mm=1PCS, +/- 0.15mm
Copper Weight:
1oz (1.4 Mils) Outer Layers
Surface Finish:
ENEPIG
Layer Count:
2-layer
PCB Thickness:
0.4 Mm
Minimum Order Quantity:
1PCS
Price:
USD9.99-99.99/PCS
Packaging Details:
Vacuum bags+Cartons
Delivery Time:
8-9 working days
Payment Terms:
T/T
Supply Ability:
5000PCS per month
Highlight

Roger RO4003C two layer pcb

,

12mil two layer pcb

,

Black Silkscreen two layer pcb

Product Description

The Rogers RO4003C High Frequency PCB is a premier choice for applications demanding superior electrical performance and manufacturability. This innovative material is a proprietary woven glass reinforced hydrocarbon/ceramic laminate that combines the beneficial properties of PTFE/woven glass with the ease of processing associated with epoxy/glass materials. The RO4003C stands out by offering excellent dielectric control and low loss at a competitive cost, making it ideal for high-volume, performance-sensitive applications.

 

Key Features
Dielectric Constant (Dk): 3.38 ± 0.05 at 10 GHz
Dissipation Factor: 0.0027 at 10 GHz
Thermal Conductivity: 0.71 W/m/°K
Thermal Coefficient of Dielectric Constant: +40 ppm/°C (operating range: -50°C to 150°C)
Coefficient of Thermal Expansion (CTE): Matched to copper (X: 11 ppm/°C, Y: 14 ppm/°C)
Low Z-axis CTE: 46 ppm/°C
Glass Transition Temperature (Tg): >280 °C
Low Moisture Absorption: 0.06%

 

Benefits
Ideal for Multi-Layer Board (MLB) Constructions: The RO4003C is designed specifically for complex PCB designs, providing excellent performance in multi-layer configurations.

 

Cost-Effective Fabrication: Processes similarly to FR-4, allowing for lower fabrication costs compared to traditional microwave laminates.
 

High Volume Applications: Engineered for performance-sensitive applications, making it the perfect choice for high-demand environments.
 

Competitive Pricing: Offers exceptional value without compromising on quality or performance.

 

Property RO4003C Direction Units Condition Test Method
Dielectric Constant,εProcess 3.38±0.05 Z   10 GHz/23℃ IPC-TM-650 2.5.5.5 Clamped Stripline
Dielectric Constant,εDesign 3.55 Z   8 to 40 GHz Differential Phase Length Method
Dissipation Factortan,δ 0.0027
0.0021
Z   10 GHz/23℃
2.5 GHz/23℃
IPC-TM-650 2.5.5.5
Thermal Coefficient of ε +40 Z ppm/℃ -50℃to 150℃ IPC-TM-650 2.5.5.5
Volume Resistivity 1.7 x 1010   MΩ.cm COND A IPC-TM-650 2.5.17.1
Surface Resistivity 4.2 x 109   COND A IPC-TM-650 2.5.17.1
Electrical Strength 31.2(780) Z Kv/mm(v/mil) 0.51mm(0.020") IPC-TM-650 2.5.6.2
Tensile Modulus 19,650(2,850)
19,450(2,821)
X
Y
MPa(ksi) RT ASTM D 638
Tensile Strength 139(20.2)
100(14.5)
X
Y
MPa(ksi) RT ASTM D 638
Flexural Strength 276
(40)
  MPa
(kpsi)
  IPC-TM-650 2.4.4
Dimensional Stability <0.3 X,Y mm/m
(mil/inch)
after etch+E2/150℃ IPC-TM-650 2.4.39A
Coefficient of Thermal Expansion 11
14
46
X
Y
Z
ppm/℃ -55℃to288℃ IPC-TM-650 2.4.41
Tg >280   ℃ TMA A IPC-TM-650 2.4.24.3
Td 425   ℃ TGA   ASTM D 3850
Thermal Conductivity 0.71   W/M/oK 80℃ ASTM C518
Moisture Absorption 0.06   % 48hrs immersion 0.060"
sample Temperature 50℃
ASTM D 570
Density 1.79   gm/cm3 23℃ ASTM D 792
Copper Peel Stength 1.05
(6.0)
  N/mm
(pli)
after solder float 1 oz.
EDC Foil
IPC-TM-650 2.4.8
Flammability N/A       UL 94
Lead-free Process Compatible Yes        

 

In terms of technical specifications, the RO4003C features a 2-layer rigid PCB stackup, with copper layer thicknesses of 35 μm on both sides and a core thickness of 0.305 mm (12 mil). The board dimensions are 66.95 mm x 38.29 mm (± 0.15 mm), with a finished board thickness of 0.4 mm. It supports a minimum trace/space of 4/4 mils and a minimum hole size of 0.4 mm. The finished copper weight is 1 oz (1.4 mils) for the outer layers, and the surface finish is ENEPIG.

 

Typical Applications
The Rogers RO4003C PCB is versatile and suitable for a wide range of applications, including:

 

Cellular base station antennas and power amplifiers
RF identification tags
Automotive radar and sensors
LNBs for direct broadcast satellites

 

Availability
The Rogers RO4003C PCB is available worldwide, designed to meet the needs of modern high-frequency applications. With its advanced material properties and cost-effective manufacturing processes, it represents a significant advancement in PCB technology.

 

Roger RO4003C 12mil Two Layer Pcb Black Silkscreen ENEPIG Finished 0

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