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Roger RO4003C 12mil Two Layer Pcb Black Silkscreen ENEPIG Finished

China Bicheng Electronics Technology Co., Ltd certification
China Bicheng Electronics Technology Co., Ltd certification
Kevin, Received and tested the boards - thanks very much. These are perfect, exactly what we needed. rgds Rich

—— Rich Rickett

Ruth, I got the PCB today, and they are just perfect. Please stay a little patience, my next order is coming soon. Kind regards from Hamburg Olaf

—— Olaf Kühnhold

Hi Natalie. It was perfect, I attach some pictures for your reference. And I send you next 2 projects to budget. Thanks a lot again

—— Sebastian Toplisek

Kevin, Thanks, they were perfectly made, and work well. As promised, here are the links for my latest project, using the PCBs you manufactured for me: Regards, Daniel

—— Daniel Ford

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Roger RO4003C 12mil Two Layer Pcb Black Silkscreen ENEPIG Finished

Roger RO4003C 12mil Two Layer Pcb Black Silkscreen ENEPIG Finished
Roger RO4003C 12mil Two Layer Pcb Black Silkscreen ENEPIG Finished Roger RO4003C 12mil Two Layer Pcb Black Silkscreen ENEPIG Finished

Large Image :  Roger RO4003C 12mil Two Layer Pcb Black Silkscreen ENEPIG Finished

Product Details:
Place of Origin: CHINA
Brand Name: Bicheng
Certification: UL, ISO9001, IATF16949
Payment & Shipping Terms:
Minimum Order Quantity: 1PCS
Price: USD9.99-99.99/PCS
Packaging Details: Vacuum bags+Cartons
Delivery Time: 8-9 working days
Payment Terms: T/T
Supply Ability: 5000PCS per month
Detailed Product Description
Material: Rogers 4003C Core PCB Size: 66.95mm X 38.29 Mm=1PCS, +/- 0.15mm
Copper Weight: 1oz (1.4 Mils) Outer Layers Surface Finish: ENEPIG
Layer Count: 2-layer PCB Thickness: 0.4 Mm
High Light:

Roger RO4003C two layer pcb

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12mil two layer pcb

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Black Silkscreen two layer pcb

The Rogers RO4003C High Frequency PCB is a premier choice for applications demanding superior electrical performance and manufacturability. This innovative material is a proprietary woven glass reinforced hydrocarbon/ceramic laminate that combines the beneficial properties of PTFE/woven glass with the ease of processing associated with epoxy/glass materials. The RO4003C stands out by offering excellent dielectric control and low loss at a competitive cost, making it ideal for high-volume, performance-sensitive applications.

 

Key Features
Dielectric Constant (Dk): 3.38 ± 0.05 at 10 GHz
Dissipation Factor: 0.0027 at 10 GHz
Thermal Conductivity: 0.71 W/m/°K
Thermal Coefficient of Dielectric Constant: +40 ppm/°C (operating range: -50°C to 150°C)
Coefficient of Thermal Expansion (CTE): Matched to copper (X: 11 ppm/°C, Y: 14 ppm/°C)
Low Z-axis CTE: 46 ppm/°C
Glass Transition Temperature (Tg): >280 °C
Low Moisture Absorption: 0.06%

 

Benefits
Ideal for Multi-Layer Board (MLB) Constructions: The RO4003C is designed specifically for complex PCB designs, providing excellent performance in multi-layer configurations.

 

Cost-Effective Fabrication: Processes similarly to FR-4, allowing for lower fabrication costs compared to traditional microwave laminates.
 

High Volume Applications: Engineered for performance-sensitive applications, making it the perfect choice for high-demand environments.
 

Competitive Pricing: Offers exceptional value without compromising on quality or performance.

 

Property RO4003C Direction Units Condition Test Method
Dielectric Constant,εProcess 3.38±0.05 Z   10 GHz/23℃ IPC-TM-650 2.5.5.5 Clamped Stripline
Dielectric Constant,εDesign 3.55 Z   8 to 40 GHz Differential Phase Length Method
Dissipation Factortan,δ 0.0027
0.0021
Z   10 GHz/23℃
2.5 GHz/23℃
IPC-TM-650 2.5.5.5
Thermal Coefficient of ε +40 Z ppm/℃ -50℃to 150℃ IPC-TM-650 2.5.5.5
Volume Resistivity 1.7 x 1010   MΩ.cm COND A IPC-TM-650 2.5.17.1
Surface Resistivity 4.2 x 109   COND A IPC-TM-650 2.5.17.1
Electrical Strength 31.2(780) Z Kv/mm(v/mil) 0.51mm(0.020") IPC-TM-650 2.5.6.2
Tensile Modulus 19,650(2,850)
19,450(2,821)
X
Y
MPa(ksi) RT ASTM D 638
Tensile Strength 139(20.2)
100(14.5)
X
Y
MPa(ksi) RT ASTM D 638
Flexural Strength 276
(40)
  MPa
(kpsi)
  IPC-TM-650 2.4.4
Dimensional Stability <0.3 X,Y mm/m
(mil/inch)
after etch+E2/150℃ IPC-TM-650 2.4.39A
Coefficient of Thermal Expansion 11
14
46
X
Y
Z
ppm/℃ -55℃to288℃ IPC-TM-650 2.4.41
Tg >280   ℃ TMA A IPC-TM-650 2.4.24.3
Td 425   ℃ TGA   ASTM D 3850
Thermal Conductivity 0.71   W/M/oK 80℃ ASTM C518
Moisture Absorption 0.06   % 48hrs immersion 0.060"
sample Temperature 50℃
ASTM D 570
Density 1.79   gm/cm3 23℃ ASTM D 792
Copper Peel Stength 1.05
(6.0)
  N/mm
(pli)
after solder float 1 oz.
EDC Foil
IPC-TM-650 2.4.8
Flammability N/A       UL 94
Lead-free Process Compatible Yes        

 

In terms of technical specifications, the RO4003C features a 2-layer rigid PCB stackup, with copper layer thicknesses of 35 μm on both sides and a core thickness of 0.305 mm (12 mil). The board dimensions are 66.95 mm x 38.29 mm (± 0.15 mm), with a finished board thickness of 0.4 mm. It supports a minimum trace/space of 4/4 mils and a minimum hole size of 0.4 mm. The finished copper weight is 1 oz (1.4 mils) for the outer layers, and the surface finish is ENEPIG.

 

Typical Applications
The Rogers RO4003C PCB is versatile and suitable for a wide range of applications, including:

 

Cellular base station antennas and power amplifiers
RF identification tags
Automotive radar and sensors
LNBs for direct broadcast satellites

 

Availability
The Rogers RO4003C PCB is available worldwide, designed to meet the needs of modern high-frequency applications. With its advanced material properties and cost-effective manufacturing processes, it represents a significant advancement in PCB technology.

 

Roger RO4003C 12mil Two Layer Pcb Black Silkscreen ENEPIG Finished 0

Contact Details
Bicheng Electronics Technology Co., Ltd

Contact Person: Ms. Ivy Deng

Tel: 86-755-27374946

Fax: 86-755-27374848

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